DE3275105D1 - Method of activating substrate surfaces for electroless metal plating - Google Patents

Method of activating substrate surfaces for electroless metal plating

Info

Publication number
DE3275105D1
DE3275105D1 DE8282110736T DE3275105T DE3275105D1 DE 3275105 D1 DE3275105 D1 DE 3275105D1 DE 8282110736 T DE8282110736 T DE 8282110736T DE 3275105 T DE3275105 T DE 3275105T DE 3275105 D1 DE3275105 D1 DE 3275105D1
Authority
DE
Germany
Prior art keywords
metal plating
substrate surfaces
electroless metal
activating substrate
activating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282110736T
Other languages
English (en)
Inventor
Kirkor Dr Sirinyan
Henning Dr Giesecke
Gerhard Dieter Dr Wolf
Harold Dr Ebneth
Rudolf Dr Merten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Priority to DE8282110736T priority Critical patent/DE3275105D1/de
Application granted granted Critical
Publication of DE3275105D1 publication Critical patent/DE3275105D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8282110736T 1981-12-05 1982-11-20 Method of activating substrate surfaces for electroless metal plating Expired DE3275105D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8282110736T DE3275105D1 (en) 1981-12-05 1982-11-20 Method of activating substrate surfaces for electroless metal plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813148280 DE3148280A1 (de) 1981-12-05 1981-12-05 Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE8282110736T DE3275105D1 (en) 1981-12-05 1982-11-20 Method of activating substrate surfaces for electroless metal plating

Publications (1)

Publication Number Publication Date
DE3275105D1 true DE3275105D1 (en) 1987-02-19

Family

ID=6148037

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19813148280 Withdrawn DE3148280A1 (de) 1981-12-05 1981-12-05 Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE8282110736T Expired DE3275105D1 (en) 1981-12-05 1982-11-20 Method of activating substrate surfaces for electroless metal plating

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19813148280 Withdrawn DE3148280A1 (de) 1981-12-05 1981-12-05 Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung

Country Status (4)

Country Link
US (1) US4764401A (de)
EP (1) EP0081129B1 (de)
JP (1) JPS58104170A (de)
DE (2) DE3148280A1 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
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DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE3326508A1 (de) * 1983-07-22 1985-02-07 Bayer Ag, 5090 Leverkusen Verfahren zum aktivieren von substratoberflaechen fuer die direkte partielle metallisierung von traegermaterialien
DE3339856A1 (de) * 1983-11-04 1985-05-15 Bayer Ag, 5090 Leverkusen Verfahren zur haftaktivierung von polyamidsubstraten fuer die stromlose metallisierung
DE3339857A1 (de) * 1983-11-04 1985-05-15 Bayer Ag, 5090 Leverkusen Verfahren zur vorbehandlung von polyamidsubstraten fuer die stromlose metallisierung
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
DE3423457A1 (de) * 1984-06-26 1986-01-02 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
DE3424065A1 (de) * 1984-06-29 1986-01-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
DE3510202A1 (de) * 1985-03-21 1986-09-25 Bayer Ag, 5090 Leverkusen Elektrische leiterplatten
US5788812A (en) * 1985-11-05 1998-08-04 Agar; Richard C. Method of recovering furfural from organic pulping liquor
JPS62149884A (ja) * 1985-12-24 1987-07-03 Nippon Mining Co Ltd 無電解銅めつきの前処理方法
EP0233145B1 (de) * 1986-01-30 1989-10-18 Ciba-Geigy Ag Polymerzusammensetzungen enthaltend einen gelösten Dibenzalaceton-Palladiumkomplex
JPH0694592B2 (ja) * 1986-04-22 1994-11-24 日産化学工業株式会社 無電解メッキ法
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
DE3631011A1 (de) * 1986-09-12 1988-03-24 Bayer Ag Flexible schaltungen
JPH01104782A (ja) * 1987-07-02 1989-04-21 Fuji Photo Film Co Ltd 無電解メッキ用触媒材料およびそれを用いた金属化材料
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces
US5238702A (en) * 1988-10-27 1993-08-24 Henning Giesecke Electrically conductive patterns
DE3938710A1 (de) * 1989-11-17 1991-05-23 Schering Ag Komplexverbindungen mit oligomerem bis polymerem charakter
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
DE4036591A1 (de) * 1990-11-16 1992-05-21 Bayer Ag Primer zum metallisieren von substratoberflaechen
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
JPH0517081U (ja) * 1991-08-15 1993-03-05 ミサワホーム株式会社 玄関の排水装置
DE4209708A1 (de) * 1992-03-25 1993-09-30 Bayer Ag Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten
DE69205415T2 (de) * 1992-04-06 1996-05-30 Ibm Verfahren zur Herstellung von katalytisch hochwirksamen Beschichtungen bestehend aus einem Metall der Gruppe der Platinmetalle.
JPH0630394U (ja) * 1992-09-24 1994-04-19 ワイケイケイアーキテクチュラルプロダクツ株式会社 浴室ドアユニット
US5624479A (en) * 1993-04-02 1997-04-29 International Business Machines Corporation Solution for providing catalytically active platinum metal layers
DE4319759A1 (de) * 1993-06-15 1994-12-22 Bayer Ag Pulvermischungen zum Metallisieren von Substratoberflächen
DE4328883C2 (de) * 1993-08-27 1996-08-14 Bayer Ag Verfahren zur Vorbereitung von Polyamidformteilen für die nachfolgende stromlose Metallisierung
DE4418016A1 (de) * 1994-05-24 1995-11-30 Wilfried Neuschaefer Nichtleiter-Metallisierung
TW312079B (de) * 1994-06-06 1997-08-01 Ibm
US5645930A (en) * 1995-08-11 1997-07-08 The Dow Chemical Company Durable electrode coatings
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating
US6187374B1 (en) 1998-09-02 2001-02-13 Xim Products, Inc. Coatings with increased adhesion
IL126809A (en) * 1998-10-29 2001-08-26 Sarin Technologies Ltd Apparatus and method of examining the shape of gemstones
DE19941043B4 (de) * 1999-08-28 2004-04-29 Robert Bosch Gmbh Bekeimungsbad und Verfahren zur Bekeimung von pulverförmigen Werkstoffen, Verfahren zur Metallisierung eines bekeimten pulverförmigen Werkstoffs und Verfahren zur Herstellung metallisch begrenzter Hohlkörper
TWI224120B (en) * 2001-09-11 2004-11-21 Daicel Polymer Ltd Process for manufacturing plated resin molded article
GB2395365B8 (en) * 2002-11-13 2006-11-02 Peter Leslie Moran Electrical circuit board
EP1572788B1 (de) * 2002-12-20 2011-11-09 E.I. Du Pont De Nemours And Company Oberflächenbehandlung von polyacetalgegenständen
KR100691558B1 (ko) * 2005-04-22 2007-03-09 한국과학기술연구원 고체 산화물 연료전지의 제조 방법
JP4680824B2 (ja) * 2006-04-21 2011-05-11 日立マクセル株式会社 ポリマー基材のメッキ膜の形成方法及びポリマー基材
US7972652B2 (en) * 2005-10-14 2011-07-05 Lam Research Corporation Electroless plating system
JP4605074B2 (ja) * 2006-03-31 2011-01-05 Ｔｄｋ株式会社 無電解めっき液及びセラミック電子部品の製造方法
JP5487538B2 (ja) * 2007-10-22 2014-05-07 コニカミノルタ株式会社 めっき方法及び導電性パターンシート
US20170159184A1 (en) * 2015-12-07 2017-06-08 Averatek Corporation Metallization of low temperature fibers and porous substrates
ES2646237B2 (es) 2017-09-28 2018-07-27 Avanzare Innovacion Tecnologica S.L. Formulación para el mordentado de materiales poliméricos previo al recubrimiento de los mismos
CN108624907A (zh) * 2018-04-26 2018-10-09 复旦大学 非金属基体高效催化电极及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521445C3 (de) * 1965-06-01 1979-11-29 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Verfahren zur Herstellung von für die stromlose Metallbeschichtung aktivierten Isolierstoffoberflächen
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
CA925252A (en) * 1969-11-20 1973-05-01 Paunovic Milan Dual and multiple complexers for electroless plating baths
US3684534A (en) * 1970-07-06 1972-08-15 Hooker Chemical Corp Method for stabilizing palladium containing solutions
AT322940B (de) * 1972-10-31 1975-06-10 Siemens Ag Bäder zum stromlosen vernickeln von metall, kunststoff und keramik
US3963842A (en) * 1974-06-20 1976-06-15 London Laboratories Limited Co. Deposition of copper
US4006047A (en) * 1974-07-22 1977-02-01 Amp Incorporated Catalysts for electroless deposition of metals on comparatively low-temperature polyolefin and polyester substrates

Also Published As

Publication number Publication date
EP0081129B1 (de) 1987-01-14
US4764401A (en) 1988-08-16
EP0081129A1 (de) 1983-06-15
JPS6354792B2 (de) 1988-10-31
JPS58104170A (ja) 1983-06-21
DE3148280A1 (de) 1983-06-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee