DE3269663D1 - Semi-conductive compositions, based on ethylene-vinyl acetate copolymers, having adhesion to and strippability from crosslinked polyolefin substrates - Google Patents

Semi-conductive compositions, based on ethylene-vinyl acetate copolymers, having adhesion to and strippability from crosslinked polyolefin substrates

Info

Publication number
DE3269663D1
DE3269663D1 DE8282109351T DE3269663T DE3269663D1 DE 3269663 D1 DE3269663 D1 DE 3269663D1 DE 8282109351 T DE8282109351 T DE 8282109351T DE 3269663 T DE3269663 T DE 3269663T DE 3269663 D1 DE3269663 D1 DE 3269663D1
Authority
DE
Germany
Prior art keywords
strippability
adhesion
ethylene
semi
vinyl acetate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282109351T
Other languages
English (en)
Inventor
Seiho Taniguchi
Yuichiro Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NUC Corp
Original Assignee
Nippon Unicar Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Unicar Co Ltd filed Critical Nippon Unicar Co Ltd
Application granted granted Critical
Publication of DE3269663D1 publication Critical patent/DE3269663D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • C08K5/08—Quinones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
    • C08K5/40—Thiurams, i.e. compounds containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45—Heterocyclic compounds having sulfur in the ring
    • C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
    • C08K5/47—Thiazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE8282109351T 1981-10-08 1982-10-08 Semi-conductive compositions, based on ethylene-vinyl acetate copolymers, having adhesion to and strippability from crosslinked polyolefin substrates Expired DE3269663D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56159446A JPS5861501A (ja) 1981-10-08 1981-10-08 接着性と剥離性を併有する半導電性材料

Publications (1)

Publication Number Publication Date
DE3269663D1 true DE3269663D1 (en) 1986-04-10

Family

ID=15693926

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282109351T Expired DE3269663D1 (en) 1981-10-08 1982-10-08 Semi-conductive compositions, based on ethylene-vinyl acetate copolymers, having adhesion to and strippability from crosslinked polyolefin substrates

Country Status (15)

Country Link
US (1) US4493787A (de)
EP (1) EP0077957B1 (de)
JP (1) JPS5861501A (de)
KR (1) KR890004939B1 (de)
AU (1) AU548839B2 (de)
BR (1) BR8205844A (de)
CA (1) CA1181941A (de)
DE (1) DE3269663D1 (de)
DK (1) DK444882A (de)
ES (1) ES516358A0 (de)
FI (1) FI823381L (de)
GR (1) GR77711B (de)
IN (1) IN157817B (de)
NO (1) NO823357L (de)
ZA (1) ZA827393B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3375619D1 (en) * 1983-06-13 1988-03-10 Mitsui Du Pont Polychemical Semiconducting compositions and wires and cables using the same
JPS6092340A (ja) * 1983-10-27 1985-05-23 Mitsubishi Petrochem Co Ltd 半導電性樹脂組成物
JPS60231753A (ja) * 1984-04-12 1985-11-18 エレクトロ　マテリアルズ　コーポレーシヨン　オブ　アメリカ 基材上へ電気伝導体を形成するのに用いられる組成物及び電気伝導体の製造方法
BG41887A1 (en) * 1985-12-24 1987-09-15 Krstev Electric resistance matter
DK89087A (da) * 1987-02-20 1988-08-21 Nordiske Kabel Traad Fremgangsmaade til fremstilling af en elektrisk halvledende, stripbar plastblending
US4857232A (en) * 1988-03-23 1989-08-15 Union Carbide Corporation Cable conductor shield
JPH02110113U (de) * 1990-02-02 1990-09-04
JP2943621B2 (ja) * 1994-09-01 1999-08-30 住友電装株式会社 巻線型雑音防止高圧抵抗電線
EP0785239B1 (de) * 1996-01-19 2001-03-07 Denki Kagaku Kogyo Kabushiki Kaisha Acetylenruss, seine Herstellung und seine Verwendung
US6294256B1 (en) 1997-11-12 2001-09-25 Bicc General Cable Industries, Inc. Compositions and electric cables
JP3551755B2 (ja) * 1998-04-03 2004-08-11 日立電線株式会社 剥離容易性半導電性樹脂組成物及び電線・ケーブル
US6013202A (en) * 1998-07-29 2000-01-11 Bicc General Uk Cables Limited Compositions of matter and electric cables
US6284832B1 (en) * 1998-10-23 2001-09-04 Pirelli Cables And Systems, Llc Crosslinked conducting polymer composite materials and method of making same
US6592791B1 (en) * 1999-01-08 2003-07-15 General Cable Technologies Corporation Compositions and electric cables
US6524702B1 (en) 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
AU7960200A (en) * 1999-11-01 2001-05-14 Bridgestone Corporation Sealing composition and sealing method
US6858296B1 (en) 2000-10-05 2005-02-22 Union Carbide Chemicals & Plastics Technology Corporation Power cable
US6274066B1 (en) 2000-10-11 2001-08-14 General Cable Technologies Corporation Low adhesion semi-conductive electrical shields
US6972099B2 (en) * 2003-04-30 2005-12-06 General Cable Technologies Corporation Strippable cable shield compositions
US7767299B2 (en) 2005-04-29 2010-08-03 General Cable Technologies Corporation Strippable cable shield compositions
JP2006337612A (ja) * 2005-05-31 2006-12-14 Nippon Zeon Co Ltd 重合トナーの製造方法
EP2195378B1 (de) 2007-09-25 2013-01-09 Dow Global Technologies LLC Styrolpolymere als mischungsbestandteile zur steuerung der adhäsion zwischen olefinischen substraten
US8287770B2 (en) * 2010-03-05 2012-10-16 General Cable Technologies Corporation Semiconducting composition
JP5689171B2 (ja) 2010-06-03 2015-03-25 ダウ グローバル テクノロジーズ エルエルシー ケーブルのための剥離性絶縁シールド
CA2884630A1 (en) 2012-09-19 2014-03-27 General Cable Technologies Corporation Strippable semiconducting shield compositions
RU2517205C1 (ru) * 2012-10-12 2014-05-27 Открытое акционерное общество "Силовые машины-ЗТЛ,ЛМЗ, Электросила, Энергомашэкспорт" (ОАО Силовые машины") Способ изготовления полупроводящей резиностеклоткани
CN106147001A (zh) * 2016-07-22 2016-11-23 江阴市海江高分子材料有限公司 一种高流动性快速交联半导电屏蔽料及其制备方法
CA3047755A1 (en) 2016-12-21 2018-06-28 Dow Global Technologies Llc Curable semiconducting composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2085926B1 (de) * 1970-04-08 1974-04-26 Sumitomo Electric Industries
US3849333A (en) * 1972-09-26 1974-11-19 Union Carbide Corp Semi-conducting polymer system comprising a copolymer of ethylene-ethylarcralate or vinyl acetate,ethylene-propylene-termonomer and carbon black
FR2245058B1 (de) * 1973-09-25 1977-08-12 Thomson Brandt
DE2723488C3 (de) * 1977-05-21 1983-12-29 AEG-Telefunken Kabelwerke AG, Rheydt, 4050 Mönchengladbach Elektrisches Kabel mit Kunststoffisolierung und äußerer Leitschicht
US4250075A (en) * 1979-02-05 1981-02-10 Dow Corning Corporation Electrically conductive polydiorganosiloxanes
US4244861A (en) * 1979-02-23 1981-01-13 Exxon Research & Engineering Co. Injection molding thermoset interpolymers of ethylene-propylene and product thereof

Also Published As

Publication number Publication date
AU548839B2 (en) 1986-01-02
EP0077957A1 (de) 1983-05-04
ES8401669A1 (es) 1983-12-16
NO823357L (no) 1983-04-11
IN157817B (de) 1986-06-28
FI823381L (fi) 1983-04-09
AU8923082A (en) 1983-04-14
ES516358A0 (es) 1983-12-16
JPS6340002B2 (de) 1988-08-09
CA1181941A (en) 1985-02-05
EP0077957B1 (de) 1986-03-05
GR77711B (de) 1984-09-25
ZA827393B (en) 1983-08-31
DK444882A (da) 1983-04-09
US4493787A (en) 1985-01-15
KR840002148A (ko) 1984-06-11
JPS5861501A (ja) 1983-04-12
BR8205844A (pt) 1983-09-06
KR890004939B1 (ko) 1989-11-30
FI823381A0 (fi) 1982-10-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee