KR840002148A - 반도체 조성물 - Google Patents
반도체 조성물 Download PDFInfo
- Publication number
- KR840002148A KR840002148A KR1019820004556A KR820004556A KR840002148A KR 840002148 A KR840002148 A KR 840002148A KR 1019820004556 A KR1019820004556 A KR 1019820004556A KR 820004556 A KR820004556 A KR 820004556A KR 840002148 A KR840002148 A KR 840002148A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- phenol
- vinyl acetate
- weight
- ethylene
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 3
- 229920001296 polysiloxane Polymers 0.000 claims 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 5
- 238000004132 cross linking Methods 0.000 claims 5
- 239000003112 inhibitor Substances 0.000 claims 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims 4
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 claims 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical group C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims 2
- 239000006229 carbon black Substances 0.000 claims 2
- 229920003020 cross-linked polyethylene Polymers 0.000 claims 2
- 239000004703 cross-linked polyethylene Substances 0.000 claims 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 claims 1
- 229940054266 2-mercaptobenzothiazole Drugs 0.000 claims 1
- YFHKLSPMRRWLKI-UHFFFAOYSA-N 2-tert-butyl-4-(3-tert-butyl-4-hydroxy-5-methylphenyl)sulfanyl-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(SC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 YFHKLSPMRRWLKI-UHFFFAOYSA-N 0.000 claims 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- CSNJTIWCTNEOSW-UHFFFAOYSA-N carbamothioylsulfanyl carbamodithioate Chemical compound NC(=S)SSC(N)=S CSNJTIWCTNEOSW-UHFFFAOYSA-N 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 150000001451 organic peroxides Chemical class 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 229920001451 polypropylene glycol Polymers 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 claims 1
- 229960002447 thiram Drugs 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
- C08K5/08—Quinones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
- C08K5/40—Thiurams, i.e. compounds containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/45—Heterocyclic compounds having sulfur in the ring
- C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
- C08K5/47—Thiazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (16)
- 에틸렌-비닐 아세테이트 코폴리머 또는 염화 에틸렌-비닐 아세테이트 코폴리머, 카본블랙, 실리콘 화합물 및 계면 교차결합 억제제로 이루어지며, 교차결합된 폴리에틸렌 기질에 접착할 수 있으며 교차절합된 폴리에틸렌 기질로부터 박리될 수 있는 반도체 조성물.
- 제1항에 있어서, 계면 교차결합 억제제로서 페놀, 퀴논, 티아졸 또는 티우람 설파이드를 사용한 조성물.
- 제1항에 있어서, 에틸렌-비닐 아세테이트 코폴리머 또는 염화에틸렌-비닐 아세테이트 코폴리머, 40 내지 100중량부의 카본블랙, 0.3 내지 5중량부의 실리콘 화합물 및 페놀, 퀴논, 티아졸 및 티우람 디설파이드로부터 선택된 게면 교차결합억제제 0.1 내지 1.5중량부로 이루어진 조성물.
- 제3항에 있어서, 염화 에틸렌-비닐 아세테이트 코폴리머에 3 내지 40중량부의 염소가 함유된 조성물.
- 제3항에 있어서, 계면 교차결합 억제제가 페놀인 조성물.
- 제5항에 있어서, 상기 페놀이 2,2'-메틸렌-비스(4-메틸-6-3급-부틸페놀)인 조성물.
- 제5항에 있어서, 페놀이 4,4'-티오-비스-(6-3급-부틸-2-메틸페놀)인 조성물.
- 제3항에 있어서, 계면 교차결합 억제제가 티아졸인 조성물.
- 제8항에 있어서, 상기티아졸이 2-메르캅토-벤조티아졸인 조성물.
- 제3항에 있어서, 실리콘 화합물이 다음 일반식의 반복단위를 갖는 조성물.상기식에서, R은 C22알킬이다.
- 제3항에 있어서, 실리콘 화합물이 다음 일반식의 반복단위를 갖는 조성물.상기식에서 R은 폴리프로필렌글리콜의 잔기이다.
- 제3항에 있어서, 유기 과산화물이 첨가된 조성물.
- 제12항에 따른 조성물의 교차결합된 생성물.
- 제3항에 따른 조성물 또는 이의 교차결합된 생성물상도 반도체층을 갖는 전도체.
- 교차결합된 폴리올레핀 기질상에 직접 결합된, 제3항에 따른 조성물 또는 이의 교차결합된 생성물.
- 제3항에 있어서, 실리콘 화합물이 실리콘오릴, 실리콘 고무 또는 실리콘 코폴리머이고 0.3 내지 2.5중량부로 존재하는 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP159446 | 1981-10-08 | ||
JP56-159446 | 1981-10-08 | ||
JP56159446A JPS5861501A (ja) | 1981-10-08 | 1981-10-08 | 接着性と剥離性を併有する半導電性材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR840002148A true KR840002148A (ko) | 1984-06-11 |
KR890004939B1 KR890004939B1 (ko) | 1989-11-30 |
Family
ID=15693926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR8204556A KR890004939B1 (ko) | 1981-10-08 | 1982-10-08 | 반전도성 조성물 |
Country Status (15)
Country | Link |
---|---|
US (1) | US4493787A (ko) |
EP (1) | EP0077957B1 (ko) |
JP (1) | JPS5861501A (ko) |
KR (1) | KR890004939B1 (ko) |
AU (1) | AU548839B2 (ko) |
BR (1) | BR8205844A (ko) |
CA (1) | CA1181941A (ko) |
DE (1) | DE3269663D1 (ko) |
DK (1) | DK444882A (ko) |
ES (1) | ES516358A0 (ko) |
FI (1) | FI823381L (ko) |
GR (1) | GR77711B (ko) |
IN (1) | IN157817B (ko) |
NO (1) | NO823357L (ko) |
ZA (1) | ZA827393B (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3375619D1 (en) * | 1983-06-13 | 1988-03-10 | Mitsui Du Pont Polychemical | Semiconducting compositions and wires and cables using the same |
JPS6092340A (ja) * | 1983-10-27 | 1985-05-23 | Mitsubishi Petrochem Co Ltd | 半導電性樹脂組成物 |
JPS60231753A (ja) * | 1984-04-12 | 1985-11-18 | エレクトロ マテリアルズ コーポレーシヨン オブ アメリカ | 基材上へ電気伝導体を形成するのに用いられる組成物及び電気伝導体の製造方法 |
BG41887A1 (en) * | 1985-12-24 | 1987-09-15 | Krstev | Electric resistance matter |
DK89087A (da) * | 1987-02-20 | 1988-08-21 | Nordiske Kabel Traad | Fremgangsmaade til fremstilling af en elektrisk halvledende, stripbar plastblending |
US4857232A (en) * | 1988-03-23 | 1989-08-15 | Union Carbide Corporation | Cable conductor shield |
JPH02110113U (ko) * | 1990-02-02 | 1990-09-04 | ||
JP2943621B2 (ja) * | 1994-09-01 | 1999-08-30 | 住友電装株式会社 | 巻線型雑音防止高圧抵抗電線 |
EP0785239B1 (en) * | 1996-01-19 | 2001-03-07 | Denki Kagaku Kogyo Kabushiki Kaisha | Granulated acetylene black, process for its production and its application |
US6294256B1 (en) | 1997-11-12 | 2001-09-25 | Bicc General Cable Industries, Inc. | Compositions and electric cables |
JP3551755B2 (ja) * | 1998-04-03 | 2004-08-11 | 日立電線株式会社 | 剥離容易性半導電性樹脂組成物及び電線・ケーブル |
US6013202A (en) * | 1998-07-29 | 2000-01-11 | Bicc General Uk Cables Limited | Compositions of matter and electric cables |
US6284832B1 (en) * | 1998-10-23 | 2001-09-04 | Pirelli Cables And Systems, Llc | Crosslinked conducting polymer composite materials and method of making same |
US6592791B1 (en) * | 1999-01-08 | 2003-07-15 | General Cable Technologies Corporation | Compositions and electric cables |
US6524702B1 (en) | 1999-08-12 | 2003-02-25 | Dow Global Technologies Inc. | Electrical devices having polymeric members |
EP1164167A4 (en) * | 1999-11-01 | 2003-04-02 | Bridgestone Corp | COMPOSITION AND SEALING METHOD |
US6858296B1 (en) | 2000-10-05 | 2005-02-22 | Union Carbide Chemicals & Plastics Technology Corporation | Power cable |
US6274066B1 (en) | 2000-10-11 | 2001-08-14 | General Cable Technologies Corporation | Low adhesion semi-conductive electrical shields |
US6972099B2 (en) * | 2003-04-30 | 2005-12-06 | General Cable Technologies Corporation | Strippable cable shield compositions |
US7767299B2 (en) | 2005-04-29 | 2010-08-03 | General Cable Technologies Corporation | Strippable cable shield compositions |
JP2006337612A (ja) * | 2005-05-31 | 2006-12-14 | Nippon Zeon Co Ltd | 重合トナーの製造方法 |
US8080735B2 (en) * | 2007-09-25 | 2011-12-20 | Dow Global Technologies Llc | Styrenic polymers as blend components to control adhesion between olefinic substrates |
US8287770B2 (en) * | 2010-03-05 | 2012-10-16 | General Cable Technologies Corporation | Semiconducting composition |
JP5689171B2 (ja) * | 2010-06-03 | 2015-03-25 | ダウ グローバル テクノロジーズ エルエルシー | ケーブルのための剥離性絶縁シールド |
CA2884630A1 (en) | 2012-09-19 | 2014-03-27 | General Cable Technologies Corporation | Strippable semiconducting shield compositions |
RU2517205C1 (ru) * | 2012-10-12 | 2014-05-27 | Открытое акционерное общество "Силовые машины-ЗТЛ,ЛМЗ, Электросила, Энергомашэкспорт" (ОАО Силовые машины") | Способ изготовления полупроводящей резиностеклоткани |
CN106147001A (zh) * | 2016-07-22 | 2016-11-23 | 江阴市海江高分子材料有限公司 | 一种高流动性快速交联半导电屏蔽料及其制备方法 |
JP7181869B2 (ja) * | 2016-12-21 | 2022-12-01 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性半導体組成物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2085926B1 (ko) * | 1970-04-08 | 1974-04-26 | Sumitomo Electric Industries | |
US3849333A (en) * | 1972-09-26 | 1974-11-19 | Union Carbide Corp | Semi-conducting polymer system comprising a copolymer of ethylene-ethylarcralate or vinyl acetate,ethylene-propylene-termonomer and carbon black |
FR2245058B1 (ko) * | 1973-09-25 | 1977-08-12 | Thomson Brandt | |
DE2723488C3 (de) * | 1977-05-21 | 1983-12-29 | AEG-Telefunken Kabelwerke AG, Rheydt, 4050 Mönchengladbach | Elektrisches Kabel mit Kunststoffisolierung und äußerer Leitschicht |
US4250075A (en) * | 1979-02-05 | 1981-02-10 | Dow Corning Corporation | Electrically conductive polydiorganosiloxanes |
US4244861A (en) * | 1979-02-23 | 1981-01-13 | Exxon Research & Engineering Co. | Injection molding thermoset interpolymers of ethylene-propylene and product thereof |
-
1981
- 1981-10-08 JP JP56159446A patent/JPS5861501A/ja active Granted
-
1982
- 1982-07-20 US US06/398,770 patent/US4493787A/en not_active Expired - Lifetime
- 1982-10-01 CA CA000412652A patent/CA1181941A/en not_active Expired
- 1982-10-05 FI FI823381A patent/FI823381L/fi not_active Application Discontinuation
- 1982-10-06 NO NO823357A patent/NO823357L/no unknown
- 1982-10-06 BR BR8205844A patent/BR8205844A/pt unknown
- 1982-10-06 GR GR69458A patent/GR77711B/el unknown
- 1982-10-07 DK DK444882A patent/DK444882A/da not_active Application Discontinuation
- 1982-10-07 IN IN1160/CAL/82A patent/IN157817B/en unknown
- 1982-10-08 KR KR8204556A patent/KR890004939B1/ko active
- 1982-10-08 ES ES516358A patent/ES516358A0/es active Granted
- 1982-10-08 ZA ZA827393A patent/ZA827393B/xx unknown
- 1982-10-08 AU AU89230/82A patent/AU548839B2/en not_active Expired
- 1982-10-08 DE DE8282109351T patent/DE3269663D1/de not_active Expired
- 1982-10-08 EP EP82109351A patent/EP0077957B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IN157817B (ko) | 1986-06-28 |
JPS6340002B2 (ko) | 1988-08-09 |
ES8401669A1 (es) | 1983-12-16 |
AU548839B2 (en) | 1986-01-02 |
DE3269663D1 (en) | 1986-04-10 |
EP0077957A1 (en) | 1983-05-04 |
BR8205844A (pt) | 1983-09-06 |
ES516358A0 (es) | 1983-12-16 |
FI823381A0 (fi) | 1982-10-05 |
NO823357L (no) | 1983-04-11 |
GR77711B (ko) | 1984-09-25 |
ZA827393B (en) | 1983-08-31 |
DK444882A (da) | 1983-04-09 |
AU8923082A (en) | 1983-04-14 |
JPS5861501A (ja) | 1983-04-12 |
KR890004939B1 (ko) | 1989-11-30 |
CA1181941A (en) | 1985-02-05 |
EP0077957B1 (en) | 1986-03-05 |
FI823381L (fi) | 1983-04-09 |
US4493787A (en) | 1985-01-15 |
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