DE3236469C2 - - Google Patents
Info
- Publication number
- DE3236469C2 DE3236469C2 DE3236469A DE3236469A DE3236469C2 DE 3236469 C2 DE3236469 C2 DE 3236469C2 DE 3236469 A DE3236469 A DE 3236469A DE 3236469 A DE3236469 A DE 3236469A DE 3236469 C2 DE3236469 C2 DE 3236469C2
- Authority
- DE
- Germany
- Prior art keywords
- channel
- gate electrode
- region
- area
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000015654 memory Effects 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 230000006870 function Effects 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000005684 electric field Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/683—Floating-gate IGFETs having only two programming levels programmed by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56157044A JPS5857750A (ja) | 1981-10-01 | 1981-10-01 | 不揮発性半導体メモリ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3236469A1 DE3236469A1 (de) | 1983-04-21 |
DE3236469C2 true DE3236469C2 (en, 2012) | 1992-07-09 |
Family
ID=15640963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19823236469 Granted DE3236469A1 (de) | 1981-10-01 | 1982-10-01 | Nichtfluechtiger speicher |
Country Status (4)
Country | Link |
---|---|
US (1) | US4794433A (en, 2012) |
JP (1) | JPS5857750A (en, 2012) |
DE (1) | DE3236469A1 (en, 2012) |
GB (1) | GB2107119B (en, 2012) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1213218B (it) * | 1984-09-25 | 1989-12-14 | Ates Componenti Elettron | Processo per la fabbricazione di una cella di memoria non volatile con area di ossido sottile di dimensioni molto piccole, e cella ottenuta con il processo suddetto. |
KR890003030A (ko) * | 1987-07-08 | 1989-04-12 | 미다 가쓰시게 | 플로팅 게이트를 갖는 반도체장치 |
JPH0712063B2 (ja) * | 1987-10-21 | 1995-02-08 | 三菱電機株式会社 | 不揮発性半導体記憶装置 |
US5262846A (en) * | 1988-11-14 | 1993-11-16 | Texas Instruments Incorporated | Contact-free floating-gate memory array with silicided buried bitlines and with single-step-defined floating gates |
DE69025939T2 (de) * | 1989-06-21 | 1996-08-01 | Xicor Inc | Apparat und verfahren zur herstellung einer speicherzelle mit schwebendem gate und doppelter dielektrikumschicht |
US5153691A (en) * | 1989-06-21 | 1992-10-06 | Xicor, Inc. | Apparatus for a dual thickness floating gate memory cell |
AU638812B2 (en) * | 1990-04-16 | 1993-07-08 | Digital Equipment Corporation | A method of operating a semiconductor device |
US5273926A (en) * | 1991-06-27 | 1993-12-28 | Texas Instruments Incorporated | Method of making flash EEPROM or merged FAMOS cell without alignment sensitivity |
US5225700A (en) * | 1991-06-28 | 1993-07-06 | Texas Instruments Incorporated | Circuit and method for forming a non-volatile memory cell |
US5260593A (en) * | 1991-12-10 | 1993-11-09 | Micron Technology, Inc. | Semiconductor floating gate device having improved channel-floating gate interaction |
US5218568A (en) * | 1991-12-17 | 1993-06-08 | Texas Instruments Incorporated | Electrically-erasable, electrically-programmable read-only memory cell, an array of such cells and methods for making and using the same |
US5444279A (en) * | 1993-08-11 | 1995-08-22 | Micron Semiconductor, Inc. | Floating gate memory device having discontinuous gate oxide thickness over the channel region |
JP3512292B2 (ja) * | 1996-01-30 | 2004-03-29 | 忠弘 大見 | 半導体装置及びこれを用いた算術演算システム、画像処理システム、音声信号処理システム、パターン認識システム、信号処理システム、並列データ処理システム、ビデオ信号処理システム |
EP0793238A1 (en) * | 1996-02-29 | 1997-09-03 | STMicroelectronics S.r.l. | Electrically programmable non-volatile memory cells device for a reduced number of programming cycles |
US6734491B1 (en) * | 2002-12-30 | 2004-05-11 | Texas Instruments Deutschland Gmbh | EEPROM with reduced manufacturing complexity |
US20040232476A1 (en) * | 2003-05-20 | 2004-11-25 | Kang Sung-Taeg | EEPROM cell structures having non-uniform channel-dielectric thickness and methods of making the same |
US7256449B2 (en) * | 2003-05-20 | 2007-08-14 | Samsung Electronics, Co., Ltd. | EEPROM device for increasing a coupling ratio and fabrication method thereof |
KR100604850B1 (ko) * | 2003-05-20 | 2006-07-31 | 삼성전자주식회사 | 균일하지 않은 채널 유전막 두께를 갖는 이이피롬 셀 구조및 그 제조방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3439236A (en) * | 1965-12-09 | 1969-04-15 | Rca Corp | Insulated-gate field-effect transistor with critical bulk characteristics for use as an oscillator component |
US3714522A (en) * | 1968-11-14 | 1973-01-30 | Kogyo Gijutsuin Agency Of Ind | Semiconductor device having surface electric-field effect |
US3767983A (en) * | 1972-08-23 | 1973-10-23 | Bell Telephone Labor Inc | Charge transfer device with improved transfer efficiency |
AT376845B (de) * | 1974-09-20 | 1985-01-10 | Siemens Ag | Speicher-feldeffekttransistor |
US4103344A (en) * | 1976-01-30 | 1978-07-25 | Westinghouse Electric Corp. | Method and apparatus for addressing a non-volatile memory array |
DE2743422A1 (de) * | 1977-09-27 | 1979-03-29 | Siemens Ag | Wortweise loeschbarer, nicht fluechtiger speicher in floating-gate-technik |
US4203158A (en) * | 1978-02-24 | 1980-05-13 | Intel Corporation | Electrically programmable and erasable MOS floating gate memory device employing tunneling and method of fabricating same |
JPS55111173A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Semiconductor memory device |
DE2908796C3 (de) * | 1979-03-07 | 1982-04-01 | Siemens AG, 1000 Berlin und 8000 München | Umprogrammierbarer Halbleiter-Festwertspeicher vom Floating-Gate-Typ |
US4399523A (en) * | 1979-08-24 | 1983-08-16 | Centre Electronique Horloger Sa | Non-volatile, electrically erasable and reprogrammable memory element |
US4409723A (en) * | 1980-04-07 | 1983-10-18 | Eliyahou Harari | Method of forming non-volatile EPROM and EEPROM with increased efficiency |
DE3029539A1 (de) * | 1980-08-04 | 1982-03-11 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Nichtfluechtige, programmierbare integrierte halbleiterspeicherzelle |
JPS57180182A (en) * | 1981-04-30 | 1982-11-06 | Fujitsu Ltd | Semiconductor involatile memory device |
DE3334295T1 (de) * | 1982-03-09 | 1984-03-22 | RCA Corp., 08540 Princeton, N.J. | Permanente Schwebe-Gate-Speicherzelle |
US4558339A (en) * | 1982-03-09 | 1985-12-10 | Rca Corporation | Electrically alterable, nonvolatile floating gate memory device |
US4615020A (en) * | 1983-12-06 | 1986-09-30 | Advanced Micro Devices, Inc. | Nonvolatile dynamic ram circuit |
US4589009A (en) * | 1984-10-09 | 1986-05-13 | The United States Of America As Represented By The Secretary Of The Army | Non-volatile piezoelectric memory transistor |
-
1981
- 1981-10-01 JP JP56157044A patent/JPS5857750A/ja active Granted
-
1982
- 1982-09-30 GB GB08227926A patent/GB2107119B/en not_active Expired
- 1982-10-01 DE DE19823236469 patent/DE3236469A1/de active Granted
-
1986
- 1986-02-19 US US06/831,064 patent/US4794433A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS649741B2 (en, 2012) | 1989-02-20 |
US4794433A (en) | 1988-12-27 |
JPS5857750A (ja) | 1983-04-06 |
DE3236469A1 (de) | 1983-04-21 |
GB2107119A (en) | 1983-04-20 |
GB2107119B (en) | 1986-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8127 | New person/name/address of the applicant |
Owner name: SEIKO INSTRUMENTS AND ELECTRONICS LTD., TOKIO, JP |
|
8110 | Request for examination paragraph 44 | ||
8125 | Change of the main classification |
Ipc: G11C 17/06 |
|
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8330 | Complete renunciation |