DE3211975A1 - Montagegehaeuse fuer halbleiterbauteile mittlerer leistung - Google Patents

Montagegehaeuse fuer halbleiterbauteile mittlerer leistung

Info

Publication number
DE3211975A1
DE3211975A1 DE19823211975 DE3211975A DE3211975A1 DE 3211975 A1 DE3211975 A1 DE 3211975A1 DE 19823211975 DE19823211975 DE 19823211975 DE 3211975 A DE3211975 A DE 3211975A DE 3211975 A1 DE3211975 A1 DE 3211975A1
Authority
DE
Germany
Prior art keywords
connection
attached
thyristor
lamella
semiconductor components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823211975
Other languages
German (de)
English (en)
Inventor
Maurice 6100 Alencon Doutey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pour La Fabrication Automatique De Condens Ste
Original Assignee
Le Silicium Semiconducteur Ssc 75008 Paris
Le Silicium Semiconducteur Ssc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Le Silicium Semiconducteur Ssc 75008 Paris, Le Silicium Semiconducteur Ssc filed Critical Le Silicium Semiconducteur Ssc 75008 Paris
Publication of DE3211975A1 publication Critical patent/DE3211975A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Conversion In General (AREA)
  • Thyristors (AREA)
DE19823211975 1981-04-03 1982-03-31 Montagegehaeuse fuer halbleiterbauteile mittlerer leistung Withdrawn DE3211975A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8106773A FR2503526A1 (fr) 1981-04-03 1981-04-03 Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.

Publications (1)

Publication Number Publication Date
DE3211975A1 true DE3211975A1 (de) 1982-10-21

Family

ID=9257005

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823211975 Withdrawn DE3211975A1 (de) 1981-04-03 1982-03-31 Montagegehaeuse fuer halbleiterbauteile mittlerer leistung

Country Status (2)

Country Link
DE (1) DE3211975A1 (enrdf_load_stackoverflow)
FR (1) FR2503526A1 (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3410580A1 (de) * 1983-03-22 1984-11-15 Mitsubishi Denki K.K., Tokio/Tokyo Abschaltthyristormodul
DE3706480A1 (de) * 1986-02-28 1987-09-03 Mitsubishi Electric Corp Halbleitereinrichtung
US4768075A (en) * 1985-11-15 1988-08-30 Bbc Brown, Boveri & Company, Limited Power semiconductor module
US4819042A (en) * 1983-10-31 1989-04-04 Kaufman Lance R Isolated package for multiple semiconductor power components
US4829348A (en) * 1984-10-19 1989-05-09 Bbc Brown, Boveri & Company Limited Disconnectable power semiconductor component
DE3839383A1 (de) * 1988-11-22 1990-05-23 Semikron Elektronik Gmbh Verfahren zum herstellen einer halbleiterbaueinheit und vorrichtung zur durchfuehrung des verfahrens
US5063436A (en) * 1989-02-02 1991-11-05 Asea Brown Boveri Ltd. Pressure-contacted semiconductor component

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8400122A (pt) * 1983-01-12 1984-08-21 Allen Bradley Co Modulo semicondutor e embalagem de semicondutor aperfeicoada
DE3527206A1 (de) * 1985-07-30 1987-02-12 Bbc Brown Boveri & Cie Anschlussblock fuer stromrichtergeraete
FR2660826A1 (fr) * 1990-04-05 1991-10-11 Mcb Sa Boitier economique pour composants electroniques de puissance, a fixer sur dissipateur thermique et son procede de fabrication.
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
KR20130130770A (ko) * 2010-12-20 2013-12-02 디오데스 제텍스 세미컨덕터즈 리미티드 향상된 스위칭 속도 및 향상된 크로스-오버 제어 및 증가된 출력 전압을 갖는 상보적 달링턴 이미터 팔로워

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1789028B1 (de) * 1968-09-25 1971-05-13 Licentia Gmbh Elektronischer baustein
DE2639979C3 (de) * 1976-09-04 1980-05-14 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiterbaueinheit
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
FR2392498A1 (fr) * 1976-11-23 1978-12-22 Motorola Semiconducteurs Ensemble redresseur
DE2728564A1 (de) * 1977-06-24 1979-01-11 Siemens Ag Halbleiterbauelement
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
DE3410580A1 (de) * 1983-03-22 1984-11-15 Mitsubishi Denki K.K., Tokio/Tokyo Abschaltthyristormodul
US4634891A (en) * 1983-03-22 1987-01-06 Mitsubishi Denki Kabushiki Kaisha Gate turn-off thyristor module
US4819042A (en) * 1983-10-31 1989-04-04 Kaufman Lance R Isolated package for multiple semiconductor power components
US4829348A (en) * 1984-10-19 1989-05-09 Bbc Brown, Boveri & Company Limited Disconnectable power semiconductor component
US4768075A (en) * 1985-11-15 1988-08-30 Bbc Brown, Boveri & Company, Limited Power semiconductor module
DE3706480A1 (de) * 1986-02-28 1987-09-03 Mitsubishi Electric Corp Halbleitereinrichtung
DE3839383A1 (de) * 1988-11-22 1990-05-23 Semikron Elektronik Gmbh Verfahren zum herstellen einer halbleiterbaueinheit und vorrichtung zur durchfuehrung des verfahrens
US5063436A (en) * 1989-02-02 1991-11-05 Asea Brown Boveri Ltd. Pressure-contacted semiconductor component

Also Published As

Publication number Publication date
FR2503526A1 (fr) 1982-10-08
FR2503526B1 (enrdf_load_stackoverflow) 1984-07-13

Similar Documents

Publication Publication Date Title
DE102006050291B4 (de) Elektronische Baugruppe und Verfahren, um diese zu bestücken
DE10310809B4 (de) Leistungshalbleitereinrichtung
DE69637488T2 (de) Halbleiter und Halbleitermodul
DE102005050314A1 (de) Verbindungsvorrichtung zur Verbindung eines elektrischen Leiters mit einer Anschlussleitung mit einem Diodenbauelement
DE2337694A1 (de) Halbleitergleichrichteranordnung
DE10316231A1 (de) Anschlusskastenvorrichtung für ein Solarzellenmodul
DE102012219791A1 (de) Niederinduktives leistungsmodul
DE7512573U (de) Halbleitergleichrichteranordnung
DE102016208431A1 (de) Anordnung mit einem elektrischen Bauteil
DE102014118836A1 (de) Halbleiterbauteil
DE10313917A1 (de) Halbleitervorrichtung
DE2314247B2 (de) Halbleiteranordnung mit einer biegsamen isolierenden Folie
DE202011100820U1 (de) Leistungshalbleiter
DE4316639C2 (de) Halbleitermodul mit verbesserter Wärmeableitung und Verfahren zu seiner Herstellung
DE3211975A1 (de) Montagegehaeuse fuer halbleiterbauteile mittlerer leistung
DE102018132663B4 (de) Schaltnetzteil
DE2653833A1 (de) Halbleitervorrichtung
DE3711192A1 (de) Lager- und kuehleinrichtung fuer gleichrichterdioden bei elektrischen maschinen
DE3717489A1 (de) Leistungshalbleitermodul und verfahren zur herstellung des moduls
DE69027724T2 (de) Leistungshalbleiteranordnung mit Plastikumhüllung
DE112017006619T5 (de) Schaltungsanordnung und elektrischer Verteilerkasten
DE102019109275A1 (de) Halbleitervorrichtung
DE112021006941T5 (de) Kondensator
DE602004011195T2 (de) Vertikal leitender Leistungselektronikvorrichtungs-Baustein sowie entsprechendes Montageverfahren
DE102008050627B4 (de) Stromanschlusskasten

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: SOCIETE POUR LA FABRICATION AUTOMATIQUE DE CONDENS

8128 New person/name/address of the agent

Representative=s name: BUSE, K., DIPL.-PHYS. MENTZEL, N., DIPL.-PHYS. LUD

8141 Disposal/no request for examination