FR2503526B1 - - Google Patents

Info

Publication number
FR2503526B1
FR2503526B1 FR8106773A FR8106773A FR2503526B1 FR 2503526 B1 FR2503526 B1 FR 2503526B1 FR 8106773 A FR8106773 A FR 8106773A FR 8106773 A FR8106773 A FR 8106773A FR 2503526 B1 FR2503526 B1 FR 2503526B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8106773A
Other languages
French (fr)
Other versions
FR2503526A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SILICIUM SEMICONDUCTEUR SSC
Original Assignee
SILICIUM SEMICONDUCTEUR SSC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SILICIUM SEMICONDUCTEUR SSC filed Critical SILICIUM SEMICONDUCTEUR SSC
Priority to FR8106773A priority Critical patent/FR2503526A1/fr
Priority to DE19823211975 priority patent/DE3211975A1/de
Publication of FR2503526A1 publication Critical patent/FR2503526A1/fr
Application granted granted Critical
Publication of FR2503526B1 publication Critical patent/FR2503526B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Conversion In General (AREA)
  • Thyristors (AREA)
FR8106773A 1981-04-03 1981-04-03 Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. Granted FR2503526A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8106773A FR2503526A1 (fr) 1981-04-03 1981-04-03 Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.
DE19823211975 DE3211975A1 (de) 1981-04-03 1982-03-31 Montagegehaeuse fuer halbleiterbauteile mittlerer leistung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8106773A FR2503526A1 (fr) 1981-04-03 1981-04-03 Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.

Publications (2)

Publication Number Publication Date
FR2503526A1 FR2503526A1 (fr) 1982-10-08
FR2503526B1 true FR2503526B1 (enrdf_load_stackoverflow) 1984-07-13

Family

ID=9257005

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8106773A Granted FR2503526A1 (fr) 1981-04-03 1981-04-03 Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique.

Country Status (2)

Country Link
DE (1) DE3211975A1 (enrdf_load_stackoverflow)
FR (1) FR2503526A1 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3241508A1 (de) * 1982-11-10 1984-05-10 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungstransistor-modul
BR8400122A (pt) * 1983-01-12 1984-08-21 Allen Bradley Co Modulo semicondutor e embalagem de semicondutor aperfeicoada
JPS59172759A (ja) * 1983-03-22 1984-09-29 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタモジユ−ル
US4819042A (en) * 1983-10-31 1989-04-04 Kaufman Lance R Isolated package for multiple semiconductor power components
EP0178387B1 (de) * 1984-10-19 1992-10-07 BBC Brown Boveri AG Abschaltbares Leistungshalbleiterbauelement
DE3527206A1 (de) * 1985-07-30 1987-02-12 Bbc Brown Boveri & Cie Anschlussblock fuer stromrichtergeraete
CH668667A5 (de) * 1985-11-15 1989-01-13 Bbc Brown Boveri & Cie Leistungshalbleitermodul.
JPS62142856U (enrdf_load_stackoverflow) * 1986-02-28 1987-09-09
DE3839383A1 (de) * 1988-11-22 1990-05-23 Semikron Elektronik Gmbh Verfahren zum herstellen einer halbleiterbaueinheit und vorrichtung zur durchfuehrung des verfahrens
EP0380799B1 (de) * 1989-02-02 1993-10-06 Asea Brown Boveri Ag Druckkontaktiertes Halbleiterbauelement
FR2660826A1 (fr) * 1990-04-05 1991-10-11 Mcb Sa Boitier economique pour composants electroniques de puissance, a fixer sur dissipateur thermique et son procede de fabrication.
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
KR20130130770A (ko) * 2010-12-20 2013-12-02 디오데스 제텍스 세미컨덕터즈 리미티드 향상된 스위칭 속도 및 향상된 크로스-오버 제어 및 증가된 출력 전압을 갖는 상보적 달링턴 이미터 팔로워

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1789028B1 (de) * 1968-09-25 1971-05-13 Licentia Gmbh Elektronischer baustein
DE2639979C3 (de) * 1976-09-04 1980-05-14 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiterbaueinheit
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
FR2392498A1 (fr) * 1976-11-23 1978-12-22 Motorola Semiconducteurs Ensemble redresseur
DE2728564A1 (de) * 1977-06-24 1979-01-11 Siemens Ag Halbleiterbauelement
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber

Also Published As

Publication number Publication date
FR2503526A1 (fr) 1982-10-08
DE3211975A1 (de) 1982-10-21

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse