DE3177218D1 - Integrierte schaltungsanordnung auf halbleiterscheibenskala. - Google Patents
Integrierte schaltungsanordnung auf halbleiterscheibenskala.Info
- Publication number
- DE3177218D1 DE3177218D1 DE8585109028T DE3177218T DE3177218D1 DE 3177218 D1 DE3177218 D1 DE 3177218D1 DE 8585109028 T DE8585109028 T DE 8585109028T DE 3177218 T DE3177218 T DE 3177218T DE 3177218 D1 DE3177218 D1 DE 3177218D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- circuit arrangement
- semiconductor disc
- disc scale
- scale
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/225,580 US4479088A (en) | 1981-01-16 | 1981-01-16 | Wafer including test lead connected to ground for testing networks thereon |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3177218D1 true DE3177218D1 (de) | 1990-11-08 |
Family
ID=22845433
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282900480T Expired - Lifetime DE3175139D1 (en) | 1981-01-16 | 1981-12-22 | Wafer and method of testing networks thereon |
DE8585109028T Expired - Fee Related DE3177218D1 (de) | 1981-01-16 | 1981-12-22 | Integrierte schaltungsanordnung auf halbleiterscheibenskala. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282900480T Expired - Lifetime DE3175139D1 (en) | 1981-01-16 | 1981-12-22 | Wafer and method of testing networks thereon |
Country Status (5)
Country | Link |
---|---|
US (1) | US4479088A (de) |
EP (3) | EP0070861B1 (de) |
JP (1) | JPS58500095A (de) |
DE (2) | DE3175139D1 (de) |
WO (1) | WO1982002603A1 (de) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3382183D1 (de) * | 1982-12-23 | 1991-04-04 | Sumitomo Electric Industries | Monolithische integrierte mikrowellenschaltung und verfahren zum auswaehlen derselben. |
US4920454A (en) * | 1983-09-15 | 1990-04-24 | Mosaic Systems, Inc. | Wafer scale package system and header and method of manufacture thereof |
US4847732A (en) * | 1983-09-15 | 1989-07-11 | Mosaic Systems, Inc. | Wafer and method of making same |
WO1985001390A1 (en) * | 1983-09-15 | 1985-03-28 | Mosaic Systems, Inc. | Wafer |
EP0174950A4 (de) * | 1984-02-21 | 1988-02-05 | Mosaic Systems Inc | Packungssystem auf halbleiterscheibenskala und leiter und verfahren zum herstellen derselben. |
JPH0673363B2 (ja) * | 1984-07-02 | 1994-09-14 | 株式会社東芝 | システムlsiの設計方法 |
US4719411A (en) * | 1985-05-13 | 1988-01-12 | California Institute Of Technology | Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation |
DE3526485A1 (de) * | 1985-07-24 | 1987-02-05 | Heinz Krug | Schaltungsanordnung zum pruefen integrierter schaltungseinheiten |
NL8502476A (nl) * | 1985-09-11 | 1987-04-01 | Philips Nv | Werkwijze voor het testen van dragers met meerdere digitaal-werkende geintegreerde schakelingen, drager voorzien van zulke schakelingen, geintegreerde schakeling geschikt voor het aanbrengen op zo'n drager, en testinrichting voor het testen van zulke dragers. |
US4725773A (en) * | 1986-06-27 | 1988-02-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Cross-contact chain |
US5367208A (en) * | 1986-09-19 | 1994-11-22 | Actel Corporation | Reconfigurable programmable interconnect architecture |
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
US4937203A (en) * | 1986-09-26 | 1990-06-26 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
US4866508A (en) * | 1986-09-26 | 1989-09-12 | General Electric Company | Integrated circuit packaging configuration for rapid customized design and unique test capability |
US4783695A (en) * | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
EP0286660B1 (de) * | 1986-09-26 | 1992-03-04 | General Electric Company | Verfahren und anordnung zum prüfen elektronischer schaltungen und integrierter schaltungschips mit einer lösbaren bedeckungsschicht |
US4835704A (en) * | 1986-12-29 | 1989-05-30 | General Electric Company | Adaptive lithography system to provide high density interconnect |
US5097232A (en) * | 1989-06-16 | 1992-03-17 | Environmental Research Institute Of Michigan | Transmission lines for wafer-scale integration and method for increasing signal transmission speeds |
FR2618021B1 (fr) * | 1987-07-07 | 1990-01-05 | Thomson Semiconducteurs | Structure et procede de test pour circuit integre permettant la determination des effets de surface de couches |
US4894605A (en) * | 1988-02-24 | 1990-01-16 | Digital Equipment Corporation | Method and on-chip apparatus for continuity testing |
US4829014A (en) * | 1988-05-02 | 1989-05-09 | General Electric Company | Screenable power chip mosaics, a method for fabricating large power semiconductor chips |
US5016080A (en) * | 1988-10-07 | 1991-05-14 | Exar Corporation | Programmable die size continuous array |
US5349219A (en) * | 1989-06-15 | 1994-09-20 | Fujitsu Limited | Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device |
JP2585799B2 (ja) * | 1989-06-30 | 1997-02-26 | 株式会社東芝 | 半導体メモリ装置及びそのバーンイン方法 |
US5502315A (en) * | 1989-09-07 | 1996-03-26 | Quicklogic Corporation | Electrically programmable interconnect structure having a PECVD amorphous silicon element |
US5989943A (en) * | 1989-09-07 | 1999-11-23 | Quicklogic Corporation | Method for fabrication of programmable interconnect structure |
US5400262A (en) * | 1989-09-20 | 1995-03-21 | Aptix Corporation | Universal interconnect matrix array |
US5377124A (en) * | 1989-09-20 | 1994-12-27 | Aptix Corporation | Field programmable printed circuit board |
WO1991004633A1 (en) * | 1989-09-23 | 1991-04-04 | Vlsi Vision Limited | I.c. sensor |
GB8921561D0 (en) * | 1989-09-23 | 1989-11-08 | Univ Edinburgh | Designs and procedures for testing integrated circuits containing sensor arrays |
US5059897A (en) * | 1989-12-07 | 1991-10-22 | Texas Instruments Incorporated | Method and apparatus for testing passive substrates for integrated circuit mounting |
US5059899A (en) * | 1990-08-16 | 1991-10-22 | Micron Technology, Inc. | Semiconductor dies and wafers and methods for making |
EP0481703B1 (de) * | 1990-10-15 | 2003-09-17 | Aptix Corporation | Verbindungssubstrat mit integrierter Schaltung zur programmierbaren Verbindung und Probenuntersuchung |
JPH0817221B2 (ja) * | 1990-11-13 | 1996-02-21 | 株式会社東芝 | 半導体装置及び半導体ウェーハの実装方法 |
US5274270A (en) * | 1990-12-17 | 1993-12-28 | Nchip, Inc. | Multichip module having SiO2 insulating layer |
US5134539A (en) * | 1990-12-17 | 1992-07-28 | Nchip, Inc. | Multichip module having integral decoupling capacitor |
EP0494782B1 (de) * | 1991-01-11 | 1997-04-23 | Texas Instruments Incorporated | Prüf- und Einbrennsystem für einen Wafer und Methode für deren Herstellung |
US5528600A (en) * | 1991-01-28 | 1996-06-18 | Actel Corporation | Testability circuits for logic arrays |
JPH05198637A (ja) * | 1992-01-23 | 1993-08-06 | Mitsubishi Electric Corp | 半導体集積回路及びそのテスト方法 |
JPH06151737A (ja) * | 1992-10-30 | 1994-05-31 | Toshiba Corp | 半導体装置及びその製造方法 |
US5357192A (en) * | 1993-02-01 | 1994-10-18 | Motorola, Inc. | Method of contacting a semiconductor die with probes |
FI100136B (fi) * | 1993-10-01 | 1997-09-30 | Nokia Telecommunications Oy | Menetelmä integroidun piirin testaamiseksi sekä integroitu piiri |
US5532174A (en) * | 1994-04-22 | 1996-07-02 | Lsi Logic Corporation | Wafer level integrated circuit testing with a sacrificial metal layer |
US5698895A (en) | 1994-06-23 | 1997-12-16 | Cubic Memory, Inc. | Silicon segment programming method and apparatus |
US6124633A (en) * | 1994-06-23 | 2000-09-26 | Cubic Memory | Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
US6255726B1 (en) | 1994-06-23 | 2001-07-03 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments with dielectric isolation |
US5657206A (en) * | 1994-06-23 | 1997-08-12 | Cubic Memory, Inc. | Conductive epoxy flip-chip package and method |
US5891761A (en) * | 1994-06-23 | 1999-04-06 | Cubic Memory, Inc. | Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
US5675180A (en) * | 1994-06-23 | 1997-10-07 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments |
US6080596A (en) * | 1994-06-23 | 2000-06-27 | Cubic Memory Inc. | Method for forming vertical interconnect process for silicon segments with dielectric isolation |
US6486528B1 (en) | 1994-06-23 | 2002-11-26 | Vertical Circuits, Inc. | Silicon segment programming apparatus and three terminal fuse configuration |
DE69633695T2 (de) * | 1995-05-31 | 2005-04-28 | STMicroelectronics, Inc., Carrollton | Konfigurierbare Testkontakte zum Erleichtern der parallelen Prüfung von integrierten Schaltungen |
FR2741475B1 (fr) * | 1995-11-17 | 2000-05-12 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif de micro-electronique comportant sur un substrat une pluralite d'elements interconnectes |
US6002267A (en) * | 1997-07-23 | 1999-12-14 | International Business Machines Corp. | In-line voltage plane tests for multi-chip modules |
JP3717660B2 (ja) * | 1998-04-28 | 2005-11-16 | 株式会社ルネサステクノロジ | フィルムキャリア及びバーンイン方法 |
JP2000138104A (ja) * | 1998-08-26 | 2000-05-16 | Yazaki Corp | 回路保護素子の検査構造 |
KR100313185B1 (ko) * | 1998-09-29 | 2001-11-07 | 포만 제프리 엘 | 집적 회로 소자의 전기적 액세스 및 상호 접속 방법과 그 장치 |
US5990488A (en) * | 1999-01-04 | 1999-11-23 | Advanced Micro Devices, Inc. | Useable drop-in strategy for correct electrical analysis of semiconductor devices |
US6685823B2 (en) | 2000-10-16 | 2004-02-03 | Uniroyal Chemical Company, Inc. | C-nitrosoaniline compounds and their blends as polymerization inhibitors |
JP2003309183A (ja) * | 2002-04-17 | 2003-10-31 | Toshiba Corp | 半導体システム、半導体システムの接続テスト方法及び半導体システムの製造方法 |
US7026646B2 (en) * | 2002-06-20 | 2006-04-11 | Micron Technology, Inc. | Isolation circuit |
US6630685B1 (en) * | 2002-06-24 | 2003-10-07 | Micron Technology, Inc. | Probe look ahead: testing parts not currently under a probehead |
US6940288B2 (en) * | 2003-06-04 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Apparatus and method for monitoring and predicting failures in system interconnect |
US20040246008A1 (en) * | 2003-06-04 | 2004-12-09 | Barr Andrew H. | Apparatus and method for detecting and rejecting high impedance interconnect failures in manufacturing process |
US7160741B2 (en) * | 2003-11-06 | 2007-01-09 | Chartered Semiconductor Manufacturing Ltd. | Planar voltage contrast test structure and method |
US7768268B2 (en) * | 2007-12-27 | 2010-08-03 | Hitachi Global Storage Technologies Netherlands, B.V. | Verification of a ground connection fabrication process for ESD resistors in magnetic heads |
KR101520457B1 (ko) * | 2009-02-12 | 2015-05-18 | 삼성전자주식회사 | 웨이퍼 검사 방법 및 웨이퍼 검사 장비 |
US8357932B2 (en) | 2010-03-25 | 2013-01-22 | International Business Machines Corporation | Test pad structure for reuse of interconnect level masks |
US8114707B2 (en) * | 2010-03-25 | 2012-02-14 | International Business Machines Corporation | Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip |
CN102254839B (zh) * | 2010-05-21 | 2015-09-02 | 刘圣平 | 一种集成电路芯外简易集成方法及框架 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3835530A (en) * | 1967-06-05 | 1974-09-17 | Texas Instruments Inc | Method of making semiconductor devices |
GB1305010A (de) * | 1968-09-25 | 1973-01-31 | ||
US3699543A (en) * | 1968-11-04 | 1972-10-17 | Energy Conversion Devices Inc | Combination film deposited switch unit and integrated circuits |
US3675090A (en) * | 1968-11-04 | 1972-07-04 | Energy Conversion Devices Inc | Film deposited semiconductor devices |
US3634927A (en) * | 1968-11-29 | 1972-01-18 | Energy Conversion Devices Inc | Method of selective wiring of integrated electronic circuits and the article formed thereby |
US3781683A (en) * | 1971-03-30 | 1973-12-25 | Ibm | Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration |
US3803483A (en) * | 1972-05-05 | 1974-04-09 | Ibm | Semiconductor structure for testing of metallization networks on insulative substrates supporting semiconductor chips |
US3789205A (en) * | 1972-09-28 | 1974-01-29 | Ibm | Method of testing mosfet planar boards |
US4234888A (en) * | 1973-07-26 | 1980-11-18 | Hughes Aircraft Company | Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns |
DE2633175A1 (de) * | 1976-07-23 | 1978-01-26 | Staiger Feinmech | Verfahren zur durchfuehrung von arbeitsschritten an mehreren schaltkreistraegern und vorrichtung zur durchfuehrung dieses verfahrens |
DE2739615A1 (de) * | 1977-09-02 | 1979-03-08 | Computer Ges Konstanz | Grossintegrierter halbleiter-speicherbaustein in form einer unzerteilten halbleiterscheibe |
JPS5460874A (en) * | 1977-10-03 | 1979-05-16 | Secr Defence Brit | Wafer |
US4183460A (en) * | 1977-12-23 | 1980-01-15 | Burroughs Corporation | In-situ test and diagnostic circuitry and method for CML chips |
AU530415B2 (en) * | 1978-06-02 | 1983-07-14 | International Standard Electric Corp. | Integrated circuits |
EP0007993A1 (de) * | 1978-07-12 | 1980-02-20 | Siemens Aktiengesellschaft | Leiterplatte zur Halterung und elektrischen Verbindung von Halbleiterchips |
US4220917A (en) * | 1978-07-31 | 1980-09-02 | International Business Machines Corporation | Test circuitry for module interconnection network |
US4241307A (en) * | 1978-08-18 | 1980-12-23 | International Business Machines Corporation | Module interconnection testing scheme |
US4295149A (en) * | 1978-12-29 | 1981-10-13 | International Business Machines Corporation | Master image chip organization technique or method |
-
1981
- 1981-01-16 US US06/225,580 patent/US4479088A/en not_active Expired - Fee Related
- 1981-12-22 EP EP82900480A patent/EP0070861B1/de not_active Expired - Lifetime
- 1981-12-22 DE DE8282900480T patent/DE3175139D1/de not_active Expired - Lifetime
- 1981-12-22 DE DE8585109028T patent/DE3177218D1/de not_active Expired - Fee Related
- 1981-12-22 EP EP85109029A patent/EP0175085B1/de not_active Expired - Lifetime
- 1981-12-22 WO PCT/US1981/001724 patent/WO1982002603A1/en active IP Right Grant
- 1981-12-22 JP JP50044682A patent/JPS58500095A/ja active Granted
- 1981-12-22 EP EP85109028A patent/EP0175870B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS58500095A (ja) | 1983-01-13 |
EP0070861A1 (de) | 1983-02-09 |
US4479088A (en) | 1984-10-23 |
EP0070861A4 (de) | 1984-06-13 |
EP0175870A3 (en) | 1987-04-15 |
WO1982002603A1 (en) | 1982-08-05 |
EP0175085A3 (en) | 1987-04-15 |
EP0175870A2 (de) | 1986-04-02 |
EP0175085A2 (de) | 1986-03-26 |
EP0070861B1 (de) | 1986-08-13 |
DE3175139D1 (en) | 1986-09-18 |
EP0175870B1 (de) | 1990-10-03 |
JPH0454971B2 (de) | 1992-09-01 |
EP0175085B1 (de) | 1989-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |