DE3151113A1 - "elektroden fuer leistungs-halbleiterzelle" - Google Patents

"elektroden fuer leistungs-halbleiterzelle"

Info

Publication number
DE3151113A1
DE3151113A1 DE19813151113 DE3151113A DE3151113A1 DE 3151113 A1 DE3151113 A1 DE 3151113A1 DE 19813151113 DE19813151113 DE 19813151113 DE 3151113 A DE3151113 A DE 3151113A DE 3151113 A1 DE3151113 A1 DE 3151113A1
Authority
DE
Germany
Prior art keywords
electrodes
cell
dipl
grooves
semiconductor cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813151113
Other languages
German (de)
English (en)
Inventor
Claude 75010 Paris Chauvet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeumont Schneider SA
Original Assignee
Jeumont Schneider SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeumont Schneider SA filed Critical Jeumont Schneider SA
Publication of DE3151113A1 publication Critical patent/DE3151113A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
DE19813151113 1980-12-24 1981-12-23 "elektroden fuer leistungs-halbleiterzelle" Withdrawn DE3151113A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8027448A FR2496987A1 (fr) 1980-12-24 1980-12-24 Electrodes pour pastille semi-conductrice de puissance

Publications (1)

Publication Number Publication Date
DE3151113A1 true DE3151113A1 (de) 1982-08-19

Family

ID=9249477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813151113 Withdrawn DE3151113A1 (de) 1980-12-24 1981-12-23 "elektroden fuer leistungs-halbleiterzelle"

Country Status (4)

Country Link
DE (1) DE3151113A1 (cg-RX-API-DMAC7.html)
FR (1) FR2496987A1 (cg-RX-API-DMAC7.html)
GB (1) GB2090058B (cg-RX-API-DMAC7.html)
SE (1) SE8107624L (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5305338A (en) * 1990-09-25 1994-04-19 Mitsubishi Denki Kabushiki Kaisha Switch device for laser

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1099874A (en) * 1964-04-20 1968-01-17 Asea Ab Semi-conductor devices for high currents
DE2012440A1 (de) * 1969-03-15 1971-02-04 Mitsubishi Denki Kabushiki Kaisha, Tokio Halbleiterelement

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1099874A (en) * 1964-04-20 1968-01-17 Asea Ab Semi-conductor devices for high currents
DE2012440A1 (de) * 1969-03-15 1971-02-04 Mitsubishi Denki Kabushiki Kaisha, Tokio Halbleiterelement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KRUMM, H. et al: Semiconductor Chip Cooling System. In: IBM Technical Disclosure Bulletin, 1980, Vol. 23, Nr. 5, S. 1987-1988 *

Also Published As

Publication number Publication date
FR2496987A1 (fr) 1982-06-25
FR2496987B1 (cg-RX-API-DMAC7.html) 1984-02-03
GB2090058B (en) 1985-08-21
GB2090058A (en) 1982-06-30
SE8107624L (sv) 1982-06-25

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: PRINZ, E., DIPL.-ING. LEISER, G., DIPL.-ING., PAT.

8125 Change of the main classification

Ipc: H01L 23/36

8130 Withdrawal