DE3123239C2 - - Google Patents

Info

Publication number
DE3123239C2
DE3123239C2 DE3123239A DE3123239A DE3123239C2 DE 3123239 C2 DE3123239 C2 DE 3123239C2 DE 3123239 A DE3123239 A DE 3123239A DE 3123239 A DE3123239 A DE 3123239A DE 3123239 C2 DE3123239 C2 DE 3123239C2
Authority
DE
Germany
Prior art keywords
substrate
zone
semiconductor device
potential
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3123239A
Other languages
German (de)
English (en)
Other versions
DE3123239A1 (de
Inventor
Yukimasa Yokohama Jp Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3123239A1 publication Critical patent/DE3123239A1/de
Application granted granted Critical
Publication of DE3123239C2 publication Critical patent/DE3123239C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6708—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates

Landscapes

  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Bipolar Transistors (AREA)
DE19813123239 1980-07-25 1981-06-11 Mos-halbleitervorrichtung Granted DE3123239A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10229080A JPS5727070A (en) 1980-07-25 1980-07-25 Mos type semiconductor device

Publications (2)

Publication Number Publication Date
DE3123239A1 DE3123239A1 (de) 1982-03-04
DE3123239C2 true DE3123239C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-01-28

Family

ID=14323474

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813123239 Granted DE3123239A1 (de) 1980-07-25 1981-06-11 Mos-halbleitervorrichtung

Country Status (4)

Country Link
US (1) US4489339A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5727070A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3123239A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2487582B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077826B2 (ja) * 1983-08-25 1995-01-30 忠弘 大見 半導体集積回路
US4918498A (en) * 1987-05-12 1990-04-17 General Electric Company Edgeless semiconductor device
GB2211989A (en) * 1987-11-05 1989-07-12 Marconi Electronic Devices Field effect transistors
US5168337A (en) * 1988-02-19 1992-12-01 Nippondenso Co., Ltd. Polycrystalline diode and a method for making the same
US4876583A (en) * 1988-03-21 1989-10-24 The United States Of America As Represented By The Secretary Of The Air Force Radiation-induced substrate photo-current compensation apparatus
US4989057A (en) * 1988-05-26 1991-01-29 Texas Instruments Incorporated ESD protection for SOI circuits
US4906587A (en) * 1988-07-29 1990-03-06 Texas Instruments Incorporated Making a silicon-on-insulator transistor with selectable body node to source node connection
JP2510710B2 (ja) * 1988-12-13 1996-06-26 三菱電機株式会社 絶縁体基板上の半導体層に形成されたｍｏｓ型電界効果トランジスタ
US5001528A (en) * 1989-01-31 1991-03-19 The United States Of America As Represented By The Secretary Of The Air Force Radiation hardened CMOS on SOI or SOS devices
US5006911A (en) * 1989-10-02 1991-04-09 Motorola, Inc. Transistor device with high density contacts
USH1435H (en) * 1991-10-21 1995-05-02 Cherne Richard D SOI CMOS device having body extension for providing sidewall channel stop and bodytie
US5293052A (en) * 1992-03-23 1994-03-08 Harris Corporation SOT CMOS device having differentially doped body extension for providing improved backside leakage channel stop
JP2000269509A (ja) * 1999-01-11 2000-09-29 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6368903B1 (en) * 2000-03-17 2002-04-09 International Business Machines Corporation SOI low capacitance body contact
US7732287B2 (en) * 2006-05-02 2010-06-08 Honeywell International Inc. Method of forming a body-tie
US7964897B2 (en) 2008-07-22 2011-06-21 Honeywell International Inc. Direct contact to area efficient body tie process flow

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1175601A (en) * 1966-03-28 1969-12-23 Matsushita Electronics Corp Insulated-Gate Field-Effect Transistor
GB1254302A (en) * 1968-03-11 1971-11-17 Associated Semiconductor Mft Improvements in insulated gate field effect transistors
DE2445985A1 (de) * 1974-09-26 1976-04-08 Siemens Ag Transistoranordnung vom enhancementtyp oder depletion-typ
GB1527773A (en) * 1974-10-18 1978-10-11 Matsushita Electric Ind Co Ltd Mos type semiconductor device
US4053916A (en) * 1975-09-04 1977-10-11 Westinghouse Electric Corporation Silicon on sapphire MOS transistor

Also Published As

Publication number Publication date
DE3123239A1 (de) 1982-03-04
US4489339A (en) 1984-12-18
FR2487582A1 (fr) 1982-01-29
JPS5727070A (en) 1982-02-13
FR2487582B1 (fr) 1985-07-19

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8128 New person/name/address of the agent

Representative=s name: HENKEL, G., DR.PHIL. FEILER, L., DR.RER.NAT. HAENZ

8127 New person/name/address of the applicant

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee