DE3102206A1 - Montagekopf zum montieren von elektronischen bauteilen - Google Patents

Montagekopf zum montieren von elektronischen bauteilen

Info

Publication number
DE3102206A1
DE3102206A1 DE19813102206 DE3102206A DE3102206A1 DE 3102206 A1 DE3102206 A1 DE 3102206A1 DE 19813102206 DE19813102206 DE 19813102206 DE 3102206 A DE3102206 A DE 3102206A DE 3102206 A1 DE3102206 A1 DE 3102206A1
Authority
DE
Germany
Prior art keywords
suction pipette
arms
ejector
mounting head
head according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19813102206
Other languages
German (de)
English (en)
Other versions
DE3102206C2 (instruction
Inventor
Johann 8193 Degerndorf Melf
Josef 8137 Höhenrain Wacker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19813153475 priority Critical patent/DE3153475C2/de
Priority to DE19813153389 priority patent/DE3153389C2/de
Priority to DE19813102206 priority patent/DE3102206A1/de
Priority to DE19813153476 priority patent/DE3153476C2/de
Publication of DE3102206A1 publication Critical patent/DE3102206A1/de
Application granted granted Critical
Publication of DE3102206C2 publication Critical patent/DE3102206C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
DE19813102206 1981-01-23 1981-01-23 Montagekopf zum montieren von elektronischen bauteilen Granted DE3102206A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19813153475 DE3153475C2 (en) 1981-01-23 1981-01-23 Assembly head for electronic components
DE19813153389 DE3153389C2 (instruction) 1981-01-23 1981-01-23
DE19813102206 DE3102206A1 (de) 1981-01-23 1981-01-23 Montagekopf zum montieren von elektronischen bauteilen
DE19813153476 DE3153476C2 (en) 1981-01-23 1981-01-23 Assembly head for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813102206 DE3102206A1 (de) 1981-01-23 1981-01-23 Montagekopf zum montieren von elektronischen bauteilen

Publications (2)

Publication Number Publication Date
DE3102206A1 true DE3102206A1 (de) 1982-08-19
DE3102206C2 DE3102206C2 (instruction) 1992-11-19

Family

ID=6123221

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813102206 Granted DE3102206A1 (de) 1981-01-23 1981-01-23 Montagekopf zum montieren von elektronischen bauteilen

Country Status (1)

Country Link
DE (1) DE3102206A1 (instruction)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3217672A1 (de) * 1982-05-11 1983-11-17 Siemens AG, 1000 Berlin und 8000 München Montagekopf fuer handhabungsgeraete
US4646432A (en) * 1984-04-06 1987-03-03 Usm Corporation Placement mechanism
US4703965A (en) * 1986-02-25 1987-11-03 Micro Component Technology, Inc. Integrated circuit placement device vacuum head
US4728135A (en) * 1983-12-20 1988-03-01 Matsushita Electric Industrial Co., Ltd. Component sucking and holding machine
US4762354A (en) * 1985-11-12 1988-08-09 Zevatech Ag Device for picking and transporting components
US4815779A (en) * 1987-08-21 1989-03-28 American Telephone And Telegraph Co. Method and apparatus for part pickup
CN108231647A (zh) * 2016-12-15 2018-06-29 鋐源光电科技（厦门）有限公司 用于发光二极管芯片的缓冲吸嘴
CN108598037A (zh) * 2018-07-10 2018-09-28 上海赢朔电子科技股份有限公司 一种固晶机吸嘴快速对位机构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1064127B (de) 1956-02-04 1959-08-27 Blaupunkt Werke Gmbh Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen
US3657790A (en) 1969-04-02 1972-04-25 Hughes Aircraft Co Apparatus for handling and bonding flip-chips to printed circuit substrates
DE2834836A1 (de) * 1977-12-08 1979-06-13 Universal Instruments Corp Vorrichtung zum aufbringen elektronischer bauelemente auf einen hybrid- leitertraeger
DE2944810A1 (de) * 1978-11-09 1980-05-14 Tokyo Shibaura Electric Co Verfahren und vorrichtung zum montieren von elektronischen bauteilen
GB2049161A (en) 1979-04-30 1980-12-17 Martin D Air circulating device for mixing room air

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1064127B (de) 1956-02-04 1959-08-27 Blaupunkt Werke Gmbh Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen
US3657790A (en) 1969-04-02 1972-04-25 Hughes Aircraft Co Apparatus for handling and bonding flip-chips to printed circuit substrates
DE2834836A1 (de) * 1977-12-08 1979-06-13 Universal Instruments Corp Vorrichtung zum aufbringen elektronischer bauelemente auf einen hybrid- leitertraeger
DE2944810A1 (de) * 1978-11-09 1980-05-14 Tokyo Shibaura Electric Co Verfahren und vorrichtung zum montieren von elektronischen bauteilen
GB2049161A (en) 1979-04-30 1980-12-17 Martin D Air circulating device for mixing room air

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3217672A1 (de) * 1982-05-11 1983-11-17 Siemens AG, 1000 Berlin und 8000 München Montagekopf fuer handhabungsgeraete
US4728135A (en) * 1983-12-20 1988-03-01 Matsushita Electric Industrial Co., Ltd. Component sucking and holding machine
US4646432A (en) * 1984-04-06 1987-03-03 Usm Corporation Placement mechanism
US4762354A (en) * 1985-11-12 1988-08-09 Zevatech Ag Device for picking and transporting components
US4703965A (en) * 1986-02-25 1987-11-03 Micro Component Technology, Inc. Integrated circuit placement device vacuum head
US4815779A (en) * 1987-08-21 1989-03-28 American Telephone And Telegraph Co. Method and apparatus for part pickup
CN108231647A (zh) * 2016-12-15 2018-06-29 鋐源光电科技（厦门）有限公司 用于发光二极管芯片的缓冲吸嘴
CN108231647B (zh) * 2016-12-15 2021-05-11 鋐源光电科技（厦门）有限公司 用于发光二极管芯片的缓冲吸嘴
CN108598037A (zh) * 2018-07-10 2018-09-28 上海赢朔电子科技股份有限公司 一种固晶机吸嘴快速对位机构

Also Published As

Publication number Publication date
DE3102206C2 (instruction) 1992-11-19

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D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee