DE3102015C2 - - Google Patents
Info
- Publication number
- DE3102015C2 DE3102015C2 DE3102015A DE3102015A DE3102015C2 DE 3102015 C2 DE3102015 C2 DE 3102015C2 DE 3102015 A DE3102015 A DE 3102015A DE 3102015 A DE3102015 A DE 3102015A DE 3102015 C2 DE3102015 C2 DE 3102015C2
- Authority
- DE
- Germany
- Prior art keywords
- coating
- weight
- copper powder
- anthracene
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 claims description 59
- 238000000576 coating method Methods 0.000 claims description 59
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 claims description 18
- 239000000654 additive Substances 0.000 claims description 16
- 239000012799 electrically-conductive coating Substances 0.000 claims description 13
- 230000000996 additive effect Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 229920001568 phenolic resin Polymers 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 10
- NXYLTUWDTBZQGX-UHFFFAOYSA-N ctk8h6630 Chemical compound C1=CC=C2C=C3C(N=C4C=CC=5C(C4=N4)=CC6=CC=CC=C6C=5)=C4C=CC3=CC2=C1 NXYLTUWDTBZQGX-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011872 intimate mixture Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- CCFAKBRKTKVJPO-UHFFFAOYSA-N 1-anthroic acid Chemical compound C1=CC=C2C=C3C(C(=O)O)=CC=CC3=CC2=C1 CCFAKBRKTKVJPO-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- CUHDKWXSCRPNQZ-UHFFFAOYSA-L [Cu++].[O-]C(=O)c1cccc2cc3ccccc3cc12.[O-]C(=O)c1cccc2cc3ccccc3cc12 Chemical compound [Cu++].[O-]C(=O)c1cccc2cc3ccccc3cc12.[O-]C(=O)c1cccc2cc3ccccc3cc12 CUHDKWXSCRPNQZ-UHFFFAOYSA-L 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- LZGCHNNAWUTUOV-UHFFFAOYSA-N anthracene copper Chemical compound [Cu].C1=CC=CC2=CC3=CC=CC=C3C=C12 LZGCHNNAWUTUOV-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP660980A JPS56103260A (en) | 1980-01-22 | 1980-01-22 | Conductive paint containing copper powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3102015A1 DE3102015A1 (de) | 1981-12-10 |
| DE3102015C2 true DE3102015C2 (en, 2012) | 1991-06-20 |
Family
ID=11643087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813102015 Granted DE3102015A1 (de) | 1980-01-22 | 1981-01-22 | Elektrisch leitendes beschichtungsmaterial und leiterplatte unter verwendung eines solchen beschichtungsmaterials |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4353816A (en, 2012) |
| JP (1) | JPS56103260A (en, 2012) |
| DE (1) | DE3102015A1 (en, 2012) |
| FR (1) | FR2474045A1 (en, 2012) |
| GB (1) | GB2068976B (en, 2012) |
| NL (1) | NL191351C (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10065540A1 (de) * | 2000-12-28 | 2002-03-28 | Infineon Technologies Ag | Leiterbahn und Verfahren zur Herstellung |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4434084A (en) | 1981-09-23 | 1984-02-28 | E. I. Du Pont De Nemours And Company | Base metal conductor cathode coating for tantalum capacitors |
| US4603162A (en) * | 1983-06-17 | 1986-07-29 | Matsushita Electric Industrial Co., Ltd. | Radiation curable resin, paint or ink vehicle composition comprising said resin and magnetic recording medium or resistor element using said resin |
| JPS604552A (ja) * | 1983-06-23 | 1985-01-11 | Mitsubishi Gas Chem Co Inc | 導電性組成物 |
| US4535012A (en) * | 1983-09-30 | 1985-08-13 | Electro Materials Corp. Of America | Fast curing solderable conductor |
| DE3466118D1 (en) * | 1983-11-30 | 1987-10-15 | Nissan Chemical Ind Ltd | Electrically conductive composition |
| US4548879A (en) * | 1984-05-21 | 1985-10-22 | Rohm And Haas Company | Solderable polymer thick films |
| DE3564636D1 (en) * | 1984-07-31 | 1988-09-29 | Mitsubishi Petrochemical Co | Copper-type conductive coating composition |
| JPS61159793A (ja) * | 1984-12-31 | 1986-07-19 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
| JPS6276600A (ja) * | 1985-09-29 | 1987-04-08 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
| US4735676A (en) * | 1986-01-14 | 1988-04-05 | Asahi Chemical Research Laboratory Co., Ltd. | Method for forming electric circuits on a base board |
| US4724040A (en) * | 1986-01-14 | 1988-02-09 | Asahi Chemical Research Laboratory Co., Ltd. | Method for producing electric circuits on a base boad |
| US4837050A (en) * | 1986-09-30 | 1989-06-06 | Asahi Chemical Research Laboratory Co., Ltd. | Method for producing electrically conductive circuits on a base board |
| JPH01214100A (ja) * | 1988-02-21 | 1989-08-28 | Asahi Chem Res Lab Ltd | 電磁波シールド回路及びその製造方法 |
| US4999135A (en) * | 1989-04-17 | 1991-03-12 | Hiroshi Matsuda | Rust-proof sealing composition |
| US4975221A (en) * | 1989-05-12 | 1990-12-04 | National Starch And Chemical Investment Holding Corporation | High purity epoxy formulations for use as die attach adhesives |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| DE69417684T2 (de) | 1993-10-29 | 1999-09-09 | Dai-Ichi Kogyo Seiyaku Co. | Leitfähige Pastenzusammensetzung zum Füllen von Kontaktlöchern, Leiterplatte unter Anwendung dieser leifähigen Paste und Verfahren zur Herstellung |
| US6838021B2 (en) * | 2000-12-15 | 2005-01-04 | Scm Metal Products, Inc. | Irregular shaped copper particles and methods of use |
| US20060108567A1 (en) * | 2002-07-23 | 2006-05-25 | Charati Sanjay G | Conductive poly (arylene ether) compositions and methods of making the same |
| US8999200B2 (en) * | 2002-07-23 | 2015-04-07 | Sabic Global Technologies B.V. | Conductive thermoplastic composites and methods of making |
| DE602006001393D1 (de) * | 2006-03-06 | 2008-07-17 | Umicore Ag & Co Kg | Zusammensetzung zur Befestigung von Hochleistungshalbleiter |
| CN101919005A (zh) | 2007-09-13 | 2010-12-15 | 汉高股份两合公司 | 导电组合物 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2564823A (en) * | 1948-02-27 | 1951-08-21 | Oneida Ltd | Electropolish interrupter |
| US3412043A (en) * | 1966-08-05 | 1968-11-19 | Dexter Corp | Electrically conductive resinous compositions |
| US3983075A (en) * | 1974-06-21 | 1976-09-28 | Kennecott Copper Corporation | Copper filled conductive epoxy |
| DE2614840A1 (de) * | 1976-04-06 | 1977-10-20 | Electro Kinetic Systems Inc | Elektrisch leitfaehige harzmassen und verfahren zu ihrer herstellung |
| US4247594A (en) * | 1979-04-30 | 1981-01-27 | Marshall & Pike Enterprises Inc. | Electrically conductive resinous composition |
-
1980
- 1980-01-22 JP JP660980A patent/JPS56103260A/ja active Granted
-
1981
- 1981-01-19 US US06/226,098 patent/US4353816A/en not_active Expired - Lifetime
- 1981-01-21 FR FR8101086A patent/FR2474045A1/fr active Granted
- 1981-01-21 NL NL8100286A patent/NL191351C/xx not_active IP Right Cessation
- 1981-01-22 GB GB8101972A patent/GB2068976B/en not_active Expired
- 1981-01-22 DE DE19813102015 patent/DE3102015A1/de active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10065540A1 (de) * | 2000-12-28 | 2002-03-28 | Infineon Technologies Ag | Leiterbahn und Verfahren zur Herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2068976B (en) | 1984-02-29 |
| DE3102015A1 (de) | 1981-12-10 |
| FR2474045A1 (fr) | 1981-07-24 |
| NL8100286A (nl) | 1981-08-17 |
| US4353816A (en) | 1982-10-12 |
| FR2474045B1 (en, 2012) | 1983-12-30 |
| JPS6136796B2 (en, 2012) | 1986-08-20 |
| JPS56103260A (en) | 1981-08-18 |
| GB2068976A (en) | 1981-08-19 |
| NL191351C (nl) | 1995-06-01 |
| NL191351B (nl) | 1995-01-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8181 | Inventor (new situation) |
Free format text: IWASA, YAMAHIRO, HACHIOJI, TOKIO/TOKYO, JP |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |