DE307475C - - Google Patents

Info

Publication number
DE307475C
DE307475C DENDAT307475D DE307475DA DE307475C DE 307475 C DE307475 C DE 307475C DE NDAT307475 D DENDAT307475 D DE NDAT307475D DE 307475D A DE307475D A DE 307475DA DE 307475 C DE307475 C DE 307475C
Authority
DE
Germany
Prior art keywords
wooden
board
wooden board
pen
pointer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT307475D
Other languages
German (de)
English (en)
Publication of DE307475C publication Critical patent/DE307475C/de
Active legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00—Marking-out or setting-out work
    • B25H7/04—Devices, e.g. scribers, for marking

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drawing Aids And Blackboards (AREA)
DENDAT307475D Active DE307475C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Publications (1)

Publication Number Publication Date
DE307475C true DE307475C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family

ID=560809

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT307475D Active DE307475C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Country Status (1)

Country Link
DE (1) DE307475C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6460265B2 (en) * 1998-11-12 2002-10-08 International Business Machines Corporation Double-sided wafer exposure method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6460265B2 (en) * 1998-11-12 2002-10-08 International Business Machines Corporation Double-sided wafer exposure method and device

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