DE3032931C2 - Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten - Google Patents

Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten

Info

Publication number
DE3032931C2
DE3032931C2 DE3032931A DE3032931A DE3032931C2 DE 3032931 C2 DE3032931 C2 DE 3032931C2 DE 3032931 A DE3032931 A DE 3032931A DE 3032931 A DE3032931 A DE 3032931A DE 3032931 C2 DE3032931 C2 DE 3032931C2
Authority
DE
Germany
Prior art keywords
press
multilayer
temperature
circuit boards
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3032931A
Other languages
German (de)
English (en)
Other versions
DE3032931A1 (de
Inventor
Peter 7291 Wittlensweiler Bernsau
Hans 7294 Schopfloch Bohn
Fred 7295 Dornstetten Staubitzer
Wolfgang 7290 Freudenstadt Stein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Buerkle GmbH
Original Assignee
Robert Buerkle GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Buerkle GmbH filed Critical Robert Buerkle GmbH
Priority to DE3032931A priority Critical patent/DE3032931C2/de
Priority to EP81106606A priority patent/EP0046978A3/fr
Priority to JP56137144A priority patent/JPS57149799A/ja
Priority to US06/298,722 priority patent/US4392909A/en
Publication of DE3032931A1 publication Critical patent/DE3032931A1/de
Application granted granted Critical
Publication of DE3032931C2 publication Critical patent/DE3032931C2/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/34—Heating or cooling presses or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Press Drives And Press Lines (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
DE3032931A 1980-09-02 1980-09-02 Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten Expired DE3032931C2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE3032931A DE3032931C2 (de) 1980-09-02 1980-09-02 Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten
EP81106606A EP0046978A3 (fr) 1980-09-02 1981-08-26 Procédé de fabrication de plaquettes de circuit à couches multiples et appareillage
JP56137144A JPS57149799A (en) 1980-09-02 1981-09-02 Method and device for producing multilayer printed circuit board
US06/298,722 US4392909A (en) 1980-09-02 1981-09-02 Method and device for producing multilayer printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3032931A DE3032931C2 (de) 1980-09-02 1980-09-02 Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten

Publications (2)

Publication Number Publication Date
DE3032931A1 DE3032931A1 (de) 1982-03-25
DE3032931C2 true DE3032931C2 (de) 1982-07-29

Family

ID=6110886

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3032931A Expired DE3032931C2 (de) 1980-09-02 1980-09-02 Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten

Country Status (4)

Country Link
US (1) US4392909A (fr)
EP (1) EP0046978A3 (fr)
JP (1) JPS57149799A (fr)
DE (1) DE3032931C2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3343745A1 (de) * 1983-12-02 1985-06-13 Siemens AG, 1000 Berlin und 8000 München Mehrlagenschaltungen aus thermoplast-kupfer-verbund
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4649497A (en) * 1983-06-03 1987-03-10 John Fluke Mfg. Co., Inc. Computer-produced circuit board
US4543147A (en) * 1984-08-20 1985-09-24 Tetrahedron Associates, Inc. Laminating process and apparatus
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
WO1988003743A1 (fr) * 1986-11-13 1988-05-19 Johnston James A Procede et appareil de fabrication de cartes de circuits imprimes
IT1214084B (it) * 1987-09-11 1990-01-10 Sintris Srl Macchina sinterizzatrice automatica con dispositivi di raffreddamento dello stampo
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
JP2503630B2 (ja) * 1989-02-15 1996-06-05 松下電工株式会社 多層プリント基板の製造方法
DE4107249A1 (de) * 1991-03-07 1992-09-10 Roemmler H Resopal Werk Gmbh Verfahren und vorrichtung zur herstellung von hochdruck-schichtpressstoffplatten
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6224912B1 (en) 1996-04-03 2001-05-01 The Rogo Institute Cancer-cell proliferation-suppressing material produced by cancer cells restricted by entrapment
US5950303A (en) * 1998-04-03 1999-09-14 The United States Of America As Represented By The Secretary Of The Air Force Method and fixturing to perform two side laminations of stacked substrates forming 3-D modules
DE19831377A1 (de) * 1998-07-13 2000-01-27 Buerkle Gmbh Robert Mehretagenpresse für laminierte Plastikkarten
IT1310557B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
WO2004075855A2 (fr) 2003-02-26 2004-09-10 Biomed Solutions, Llc Procede de traitement in vivo de cibles biologiques specifiques dans un fluide corporel
US20050053586A1 (en) 2003-09-04 2005-03-10 Bryan Conn Entrapped stem cells and uses thereof
US20050126703A1 (en) * 2003-12-11 2005-06-16 Pergo (Europe) Ab Process for the manufacture of a decorative laminate
JP5583570B2 (ja) * 2010-12-20 2014-09-03 株式会社日立製作所 ホットプレス装置および多層プリント基板のプレス方法
FR2971369B1 (fr) * 2011-02-04 2013-03-08 Commissariat Energie Atomique Procede de fabrication d'une monocouche autoassemblee d'injection
DE102012207174B4 (de) 2012-04-30 2014-08-28 Bundesdruckerei Gmbh Vorrichtung zum Laminieren von Laminiergut, Verfahren zum Montieren eines Presspolsters in der Vorrichtung und Verfahren zum Detektieren eines Risses in dem Presspolster
DE102014209661A1 (de) 2014-05-21 2015-11-26 Bundesdruckerei Gmbh Presswerkzeug und Verwendung einer Keramikfolie als Presswerkzeug sowie Verfahren zur Herstellung einer Keramikfolie
US9900983B2 (en) * 2014-06-18 2018-02-20 Intel Corporation Modular printed circuit board electrical integrity and uses
WO2017142662A1 (fr) * 2016-02-16 2017-08-24 Intel Corporation Intégrité électrique de carte de circuit imprimé modulaire et utilisations
US10285283B2 (en) * 2016-06-03 2019-05-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
TWI749632B (zh) * 2020-07-10 2021-12-11 台郡科技股份有限公司 具有壓合治具盒之疊板壓合系統及方法
CN112188758B (zh) * 2020-09-08 2024-07-02 深圳市兴森快捷电路科技股份有限公司 印制电路板压合方法及装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2903040A (en) * 1957-01-18 1959-09-08 Hyman G Schonzeit Laminating apparatus
DE1108157B (de) * 1957-02-11 1961-06-08 Hermann Schwarz K G Druckmittelraum fuer Elemente des Grubenausbaus
DE1100923B (de) * 1959-11-16 1961-03-02 Becker & Van Huellen Anlage zum Pressen von plattenfoermigen Werkstuecken aus Holz, Kunststoff, Faserstoffen od. dgl. unter Verwendung von Unterlageblechen
GB994894A (en) * 1961-01-28 1965-06-10 Shigenari Soda Improvements relating to the treatment of resinous material
US3374129A (en) * 1963-05-02 1968-03-19 Sanders Associates Inc Method of producing printed circuits
US3508330A (en) * 1967-04-06 1970-04-28 Gen Dynamics Corp Method of fabricating multitube electronic circuit boards
US3654097A (en) * 1969-07-22 1972-04-04 Gen Dynamics Corp Method of making multilayer printed circuits
CH509877A (de) * 1970-11-27 1971-07-15 Alusuisse Verfahren und Vorrichtung zur Herstellung von mehrschichtigen Verbundplatten
NL166171C (nl) * 1971-06-07 1981-01-15 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van, uit meerdere lagen opgebouwde, gedrukte schakelingen en inrichting ter realisering van deze werkwijze.
US3960635A (en) * 1971-06-07 1976-06-01 N.V. Hollandse Signaalapparaten Method for the fabrication of printed circuits
FR2224293A1 (en) * 1973-04-05 1974-10-31 Drouet Diamond Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats
DE2411650B2 (de) * 1974-03-12 1976-02-19 G. Siempelkamp & Co, 4150Krefeld Anordnung zum herstellen von schichtkoerpern aus mehreren schichten mit kunstharzimpraegnierten papieren als oberflaechenschichten unter anwendung von druck und waerme
JPS50133455A (fr) * 1974-04-15 1975-10-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3343745A1 (de) * 1983-12-02 1985-06-13 Siemens AG, 1000 Berlin und 8000 München Mehrlagenschaltungen aus thermoplast-kupfer-verbund
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur

Also Published As

Publication number Publication date
US4392909A (en) 1983-07-12
JPS57149799A (en) 1982-09-16
EP0046978A3 (fr) 1983-06-01
DE3032931A1 (de) 1982-03-25
EP0046978A2 (fr) 1982-03-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8330 Complete disclaimer