DE29909262U1 - Trägerbaugruppe für eine CPU - Google Patents
Trägerbaugruppe für eine CPUInfo
- Publication number
- DE29909262U1 DE29909262U1 DE29909262U DE29909262U DE29909262U1 DE 29909262 U1 DE29909262 U1 DE 29909262U1 DE 29909262 U DE29909262 U DE 29909262U DE 29909262 U DE29909262 U DE 29909262U DE 29909262 U1 DE29909262 U1 DE 29909262U1
- Authority
- DE
- Germany
- Prior art keywords
- cpu
- carrier assembly
- carrier
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU31249/99A AU713440B3 (en) | 1999-05-25 | 1999-05-25 | A support structure for a central processing unit |
US09/318,764 US6151214A (en) | 1999-05-25 | 1999-05-26 | Bearing structure of a central processing unit |
DE29909262U DE29909262U1 (de) | 1999-05-25 | 1999-05-27 | Trägerbaugruppe für eine CPU |
GB9912580A GB2350480A (en) | 1999-05-25 | 1999-05-28 | A mount with heatsink for a central processing unit |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU31249/99A AU713440B3 (en) | 1999-05-25 | 1999-05-25 | A support structure for a central processing unit |
US09/318,764 US6151214A (en) | 1999-05-25 | 1999-05-26 | Bearing structure of a central processing unit |
DE29909262U DE29909262U1 (de) | 1999-05-25 | 1999-05-27 | Trägerbaugruppe für eine CPU |
GB9912580A GB2350480A (en) | 1999-05-25 | 1999-05-28 | A mount with heatsink for a central processing unit |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29909262U1 true DE29909262U1 (de) | 1999-08-12 |
Family
ID=27422934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29909262U Expired - Lifetime DE29909262U1 (de) | 1999-05-25 | 1999-05-27 | Trägerbaugruppe für eine CPU |
Country Status (4)
Country | Link |
---|---|
US (1) | US6151214A (de) |
AU (1) | AU713440B3 (de) |
DE (1) | DE29909262U1 (de) |
GB (1) | GB2350480A (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4156132B2 (ja) * | 1999-06-15 | 2008-09-24 | 株式会社Pfu | 半導体モジュール装置 |
JP2001110967A (ja) * | 1999-10-07 | 2001-04-20 | Fujikura Ltd | 電子素子の放熱構造 |
US6352104B1 (en) * | 1999-10-19 | 2002-03-05 | International Business Machines Corporation | Heat sink with enhanced heat spreading and compliant interface for better heat transfer |
JP4386219B2 (ja) * | 2000-03-31 | 2009-12-16 | 富士通株式会社 | 放熱機構及び当該放熱機構を有する電子機器 |
US6421239B1 (en) * | 2000-06-06 | 2002-07-16 | Chaun-Choung Technology Corp. | Integral heat dissipating device |
US6542366B2 (en) * | 2000-12-28 | 2003-04-01 | Gateway, Inc. | Circuit board support |
JP2002261476A (ja) * | 2001-02-28 | 2002-09-13 | Toshiba Corp | 冷却モジュールの接地構造及び方法並びに該構造を有する電子機器 |
TW582568U (en) * | 2001-12-12 | 2004-04-01 | Hon Hai Prec Ind Co Ltd | Fixing apparatus of back-plate |
TW551543U (en) * | 2002-10-28 | 2003-09-01 | Shuttle Inc | CPU heat dissipation base body |
US20040188079A1 (en) * | 2003-03-31 | 2004-09-30 | Arima Computer Corporation | Heat-dissipation module for chip |
TWM245517U (en) * | 2003-10-30 | 2004-10-01 | Quanta Comp Inc | Computer device and its modular structure |
TW200537279A (en) * | 2004-05-13 | 2005-11-16 | Mitac Technology Corp | Heat sink module having heat conduction cover plate |
US7277293B2 (en) * | 2005-04-11 | 2007-10-02 | Inventec Corporation | Heat sink conduction apparatus |
US7570490B2 (en) * | 2005-08-31 | 2009-08-04 | Ati Technologies Ulc | Variable spring rate thermal management apparatus attachment mechanism |
CN1983109B (zh) * | 2005-12-15 | 2010-05-12 | 富准精密工业(深圳)有限公司 | 电子装置组合 |
US7382621B2 (en) * | 2006-01-24 | 2008-06-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Video graphics array (VGA) card assembly |
JP4699967B2 (ja) * | 2006-09-21 | 2011-06-15 | 株式会社ソニー・コンピュータエンタテインメント | 情報処理装置 |
JP2009043097A (ja) * | 2007-08-09 | 2009-02-26 | Fujitsu Ltd | 電子機器および放熱ユニット |
CN102200807A (zh) * | 2010-03-25 | 2011-09-28 | 鸿富锦精密工业(深圳)有限公司 | 扩充卡隔热罩 |
CN102738096B (zh) * | 2011-04-08 | 2017-01-25 | 神讯电脑(昆山)有限公司 | 散热结构 |
TWM433583U (en) * | 2012-02-29 | 2012-07-11 | Aopen Inc | Fixing device and combination thereof with heat dissipation module |
TWI607299B (zh) | 2013-06-04 | 2017-12-01 | 建碁股份有限公司 | 電子裝置及其連接單元 |
JP6527250B2 (ja) | 2015-06-10 | 2019-06-05 | ジェンサーム インコーポレイテッドGentherm Incorporated | 低温プレートアセンブリ一体化車両バッテリ熱電素子と熱電素子の組立方法 |
US20200031242A1 (en) * | 2015-06-10 | 2020-01-30 | Gentherm Inc. | Thermoelectric module with thermal isolation features for vehicle battery |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4745456A (en) * | 1986-09-11 | 1988-05-17 | Thermalloy Incorporated | Heat sink clip assembly |
US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
US5289337A (en) * | 1992-02-21 | 1994-02-22 | Intel Corporation | Heatspreader for cavity down multi-chip module with flip chip |
US5430611A (en) * | 1993-07-06 | 1995-07-04 | Hewlett-Packard Company | Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate |
US5430609A (en) * | 1993-09-02 | 1995-07-04 | Kikinis; Dan | Microprocessor cooling in a portable computer |
US5386338A (en) * | 1993-12-20 | 1995-01-31 | Thermalloy, Inc. | Heat sink attachment assembly |
EP0678917B1 (de) * | 1994-04-22 | 2003-06-25 | Nec Corporation | Trägerelement für Kühlvorrichtung und elektronisches Gehäuse mit einem solchen Element |
FR2729045B1 (fr) * | 1994-12-29 | 1997-01-24 | Bull Sa | Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes |
US5598320A (en) * | 1995-03-06 | 1997-01-28 | Ast Research, Inc. | Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices |
GB2309827B (en) * | 1996-01-30 | 1998-04-22 | Samsung Electronics Co Ltd | Surface complemental heat dissipation device |
US5708564A (en) * | 1996-05-07 | 1998-01-13 | Lin; Andy | Heat sink mounting structure |
US5883782A (en) * | 1997-03-05 | 1999-03-16 | Intel Corporation | Apparatus for attaching a heat sink to a PCB mounted semiconductor package |
US5755276A (en) * | 1997-06-10 | 1998-05-26 | Chiou; Ming Chin | CPU heat sink fastener |
US5903434A (en) * | 1997-06-10 | 1999-05-11 | Chiou; Ming Chin | CPU heat sink clamping device |
US5880930A (en) * | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
-
1999
- 1999-05-25 AU AU31249/99A patent/AU713440B3/en not_active Ceased
- 1999-05-26 US US09/318,764 patent/US6151214A/en not_active Expired - Fee Related
- 1999-05-27 DE DE29909262U patent/DE29909262U1/de not_active Expired - Lifetime
- 1999-05-28 GB GB9912580A patent/GB2350480A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2350480A (en) | 2000-11-29 |
AU713440B3 (en) | 1999-12-02 |
US6151214A (en) | 2000-11-21 |
GB9912580D0 (en) | 1999-07-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 19990923 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20021023 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20050617 |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20070628 |
|
R071 | Expiry of right |