DE2752655C2 - - Google Patents
Info
- Publication number
- DE2752655C2 DE2752655C2 DE2752655A DE2752655A DE2752655C2 DE 2752655 C2 DE2752655 C2 DE 2752655C2 DE 2752655 A DE2752655 A DE 2752655A DE 2752655 A DE2752655 A DE 2752655A DE 2752655 C2 DE2752655 C2 DE 2752655C2
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- electronic component
- conductor tracks
- opening
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19772752655 DE2752655A1 (de) | 1977-09-23 | 1977-11-25 | Elektronisches bauelement |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2742882A DE2742882C2 (de) | 1977-09-23 | 1977-09-23 | Elektronisches Bauelement |
| DE19772752655 DE2752655A1 (de) | 1977-09-23 | 1977-11-25 | Elektronisches bauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2752655A1 DE2752655A1 (de) | 1979-06-07 |
| DE2752655C2 true DE2752655C2 (enrdf_load_stackoverflow) | 1988-03-24 |
Family
ID=6024628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19772752655 Granted DE2752655A1 (de) | 1977-09-23 | 1977-11-25 | Elektronisches bauelement |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE2752655A1 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4118398A1 (de) * | 1991-06-05 | 1992-12-10 | Ant Nachrichtentech | Elektronik-baugruppe mit metallgehaeuse |
| DE4416460A1 (de) * | 1994-05-10 | 1995-11-30 | Hella Kg Hueck & Co | Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
| JPS60223149A (ja) * | 1984-04-19 | 1985-11-07 | Hitachi Ltd | 半導体装置 |
| DE3433779A1 (de) * | 1984-09-14 | 1986-03-27 | Robert Bosch Gmbh, 7000 Stuttgart | Schutzschicht fuer halbleiterschaltungen |
| JPH0740600B2 (ja) * | 1987-04-30 | 1995-05-01 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL164425C (nl) * | 1971-02-05 | 1980-12-15 | Philips Nv | Halfgeleiderinrichting voorzien van een koellichaam. |
| DE2124887C3 (de) * | 1971-05-19 | 1980-04-17 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung |
| DE2414297C3 (de) * | 1974-03-25 | 1980-01-17 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente |
-
1977
- 1977-11-25 DE DE19772752655 patent/DE2752655A1/de active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4118398A1 (de) * | 1991-06-05 | 1992-12-10 | Ant Nachrichtentech | Elektronik-baugruppe mit metallgehaeuse |
| DE4416460A1 (de) * | 1994-05-10 | 1995-11-30 | Hella Kg Hueck & Co | Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2752655A1 (de) | 1979-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE4421077B4 (de) | Halbleitergehäuse und Verfahren zu dessen Herstellung | |
| DE3201802A1 (de) | Bondverfahren fuer elektronische bauelemente | |
| DE19650296A1 (de) | Verfahren zum Herstellen eines Halbleiterbauelements | |
| DE2345149A1 (de) | Elektronisches hybrid-bauteil mit halbleiter-chips | |
| DE3623419A1 (de) | Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers | |
| DE3810899C2 (enrdf_load_stackoverflow) | ||
| DE2619833A1 (de) | Verfahren zum anordnen einer schaltung fuer eine elektronische uhr | |
| DE4304788C2 (de) | Verfahren zur Herstellung einer Leiterstruktur mit sich kreuzenden elektrischen Leitern auf der Oberfläche einer Glasscheibe | |
| DE2752655C2 (enrdf_load_stackoverflow) | ||
| DE2008366A1 (de) | Grundelement für elektronische Schaltungstafeln | |
| DE19929606A1 (de) | Integrierte Schaltung und Verfahren zu ihrer Herstellung | |
| DE3305952A1 (de) | Verfahren zum anbringen einer platte mit integrierter schaltung auf einem substrat | |
| EP0867932A2 (de) | Verfahren zur Herstellung von Bonddrahtverbindungen | |
| DE3828700A1 (de) | Kupferplattierter bleirahmen fuer halbleiter-kunststoff-gehaeuse | |
| DE3243689A1 (de) | Halbleitervorrichtung | |
| DE4129964C2 (de) | Verfahren zur Herstellung einer elektrisch leitenden Befestigung einer integrierten Schaltung auf einer gedruckten Schaltung | |
| DE3619636A1 (de) | Gehaeuse fuer integrierte schaltkreise | |
| DE3536431A1 (de) | Loeten von oberflaechenmontierbaren bauelementen | |
| DE2354256A1 (de) | Verfahren zum kontaktieren eines halbleiterbauelementes | |
| DE69511992T2 (de) | Halbleiteranordnung und Verfahren zur Herstellung | |
| DE112004002761T5 (de) | Eine nicht verbleite Halbleiterbaugruppe und ein Verfahren, um diese zusammenzusetzen | |
| DE69331649T2 (de) | TAB Band und sein Herstellungsverfahren | |
| DE3124760A1 (de) | Elektronische hybridschaltung | |
| DE1162167B (de) | Verfahren zum Loeten von auf einer isolierenden Platte aufgebrachten Leiterzuegen | |
| DE19756179A1 (de) | Für einen Halbleiterchip-Baustein dienender Leiterrahmen mit Montageplatz für einen Halbleiterchip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8176 | Proceedings suspended because of application no: |
Ref document number: 2742882 Country of ref document: DE Format of ref document f/p: P |
|
| 8178 | Suspension cancelled | ||
| AF | Is addition to no. |
Ref country code: DE Ref document number: 2742882 Format of ref document f/p: P |
|
| 8162 | Independent application | ||
| 8120 | Willingness to grant licences paragraph 23 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |