DE2752655A1 - Elektronisches bauelement - Google Patents

Elektronisches bauelement

Info

Publication number
DE2752655A1
DE2752655A1 DE19772752655 DE2752655A DE2752655A1 DE 2752655 A1 DE2752655 A1 DE 2752655A1 DE 19772752655 DE19772752655 DE 19772752655 DE 2752655 A DE2752655 A DE 2752655A DE 2752655 A1 DE2752655 A1 DE 2752655A1
Authority
DE
Germany
Prior art keywords
component
electronic
heat sink
carrier
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19772752655
Other languages
German (de)
English (en)
Other versions
DE2752655C2 (enrdf_load_stackoverflow
Inventor
Rolf Hohmann
H Eckhard Dr Ing Krueger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2742882A external-priority patent/DE2742882C2/de
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE19772752655 priority Critical patent/DE2752655A1/de
Publication of DE2752655A1 publication Critical patent/DE2752655A1/de
Application granted granted Critical
Publication of DE2752655C2 publication Critical patent/DE2752655C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19772752655 1977-09-23 1977-11-25 Elektronisches bauelement Granted DE2752655A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772752655 DE2752655A1 (de) 1977-09-23 1977-11-25 Elektronisches bauelement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2742882A DE2742882C2 (de) 1977-09-23 1977-09-23 Elektronisches Bauelement
DE19772752655 DE2752655A1 (de) 1977-09-23 1977-11-25 Elektronisches bauelement

Publications (2)

Publication Number Publication Date
DE2752655A1 true DE2752655A1 (de) 1979-06-07
DE2752655C2 DE2752655C2 (enrdf_load_stackoverflow) 1988-03-24

Family

ID=6024628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772752655 Granted DE2752655A1 (de) 1977-09-23 1977-11-25 Elektronisches bauelement

Country Status (1)

Country Link
DE (1) DE2752655A1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300693A1 (de) * 1982-02-05 1983-09-22 Hitachi, Ltd., Tokyo Halbleiteranordnung und verfahren zu ihrer herstellung
DE3514253A1 (de) * 1984-04-19 1985-10-31 Hitachi, Ltd., Tokio/Tokyo Halbleitereinrichtung
DE3433779A1 (de) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Schutzschicht fuer halbleiterschaltungen
DE3814469A1 (de) * 1987-04-30 1988-11-17 Mitsubishi Electric Corp Halbleiteranordnung und verfahren zu ihrer herstellung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
DE4416460C2 (de) * 1994-05-10 1996-04-11 Hella Kg Hueck & Co Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2202802A1 (de) * 1971-02-05 1972-08-17 Philips Nv Halbleiteranordnung
DE2124887A1 (de) * 1971-05-19 1972-12-07 Philips Patentverwaltung Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente
DE2444418A1 (de) * 1974-09-17 1976-04-01 Siemens Ag Gehaeuse fuer halbleitereinheit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2202802A1 (de) * 1971-02-05 1972-08-17 Philips Nv Halbleiteranordnung
DE2124887A1 (de) * 1971-05-19 1972-12-07 Philips Patentverwaltung Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
DE2414297A1 (de) * 1974-03-25 1975-10-02 Siemens Ag Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente
DE2444418A1 (de) * 1974-09-17 1976-04-01 Siemens Ag Gehaeuse fuer halbleitereinheit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
In Betracht gezogenes älteres Patent: DE-PS 27 42 882 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300693A1 (de) * 1982-02-05 1983-09-22 Hitachi, Ltd., Tokyo Halbleiteranordnung und verfahren zu ihrer herstellung
DE3514253A1 (de) * 1984-04-19 1985-10-31 Hitachi, Ltd., Tokio/Tokyo Halbleitereinrichtung
DE3433779A1 (de) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Schutzschicht fuer halbleiterschaltungen
DE3814469A1 (de) * 1987-04-30 1988-11-17 Mitsubishi Electric Corp Halbleiteranordnung und verfahren zu ihrer herstellung

Also Published As

Publication number Publication date
DE2752655C2 (enrdf_load_stackoverflow) 1988-03-24

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