DE2752655C2 - - Google Patents

Info

Publication number
DE2752655C2
DE2752655C2 DE2752655A DE2752655A DE2752655C2 DE 2752655 C2 DE2752655 C2 DE 2752655C2 DE 2752655 A DE2752655 A DE 2752655A DE 2752655 A DE2752655 A DE 2752655A DE 2752655 C2 DE2752655 C2 DE 2752655C2
Authority
DE
Germany
Prior art keywords
carrier
electronic component
conductor tracks
opening
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2752655A
Other languages
German (de)
Other versions
DE2752655A1 (en
Inventor
H. Eckhard Dr.-Ing. 3207 Harsum De Krueger
Rolf 3202 Bad Salzdetfurth De Hohmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blaupunkt Werke GmbH
Original Assignee
Blaupunkt Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2742882A external-priority patent/DE2742882C2/en
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE19772752655 priority Critical patent/DE2752655A1/en
Publication of DE2752655A1 publication Critical patent/DE2752655A1/en
Application granted granted Critical
Publication of DE2752655C2 publication Critical patent/DE2752655C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

Die vorliegende Erfindung betrifft eine Baueinheit nach dem Ober­ begriff des Anspruchs 1.The present invention relates to an assembly according to the Ober Concept of claim 1.

Werden bei einer solchen Baueinheit die Bauelemente mittels Bond- Verfahren mit den Leiterbahnen verbunden, so besteht die Gefahr, daß die im Rahmen eines automatischen Fertigungsprozesses herge­ stellten Drahtbrücken bald danach zur Seite fallen und Anlaß zu Fehlschlüssen geben.If the components of such a unit are bonded Method connected to the conductor tracks, there is a risk of that in the context of an automatic manufacturing process put wire jumpers to the side soon afterwards and gave occasion Give wrong conclusions.

Ein ausreichend stabiler Stand des gebondeten Golddrahtes läßt sich erreichen, wenn die Baueinheit nach dem Ober­ begriff entsprechend den Merkmalen des Kennzeichens des Anspruchs 1 ausgebildet ist.A sufficiently stable position of the bonded Gold wire can be reached if the assembly is to the upper understood according to the features of the characterizing part of claim 1 is trained.

Für eine derartige Ausbildung findet sich im Stand der Technik keine Anregung. Nach der DE-OS 22 02 802 und der DE-OS 21 24 887 ist eine vor Fehlschlüssen sichere Baueinheit bisher nur mittels einem nach dem Bump-Soldering-Verfahren hergestellte Verbindung zwischen den Halbleiterbauelementen und der gedruckten Schaltung herstellbar. Nach dem älteren Patent DE-PS 27 42 882 wird für das Bond-Ver­ fahren das Halbleiterbauelement auf einem aus dem Kühlträger her­ ausgedrückten Plateaubereich festgelegt, der in entsprechende Aus­ sparungen in der mit der gedruckten Schaltung bedruckten Platine hineinragt. There is no such training in the prior art Suggestion. According to DE-OS 22 02 802 and DE-OS 21 24 887 is one So far, secure unit against false conclusions has only been possible with the bump soldering process between the Semiconductor components and the printed circuit can be produced. According to the older patent DE-PS 27 42 882 for the bond Ver drive the semiconductor component from the cooling carrier expressed plateau area set in corresponding off savings in the printed circuit board protrudes.  

Gemäß einer vorteilhaften Ausgestaltung der Erfindung ist der Kühkörper als Blech ausgebildet und mit der den Träger bildenden Folie flächenhaft verklebt. According to an advantageous embodiment of the invention Heat sink formed as a sheet and with the film forming the carrier glued flat.  

Die Vorteile der vorliegenden Erfindung liegen insbesondere darin, daß der Kühlkörper neben einer sehr guten Wärmeableitung eine hervorragende mechanische Stabilität der gesamten Baueinheit gewährleistet. Darüber hinaus lassen sich erfindungsgemäß aufgebaute Baueinheiten auch in End­ losfertigungsverfahren, bei denen die elektronischen Bauelemente, die den Träger bildende Folie und das Kühlblech von Rollen abgewickelt und in einer Fertigungsstation zusammengeführt und zusammengefügt werden, herstellen.The advantages of the present invention are in particular that the heat sink, in addition to excellent heat dissipation, is excellent guaranteed mechanical stability of the entire unit. About that In addition, units constructed according to the invention can also be used in end manufacturing processes in which the electronic components that the film forming the carrier and the heat sink are unwound from rolls and are brought together and put together in a production station, produce.

Nachfolgend wird ein Ausführungsbeispiel der Erfindung an einer Figur, in der ein in den Durch­ bruch eines als Film ausgebildeten Trägers eingefügtes und auf dem Kühlblech befestigtes elektronisches Bauelement im Querschnitt darge­ stellt ist, näher erläutert.Below is an embodiment of the invention on a figure in which a through break a carrier formed as a film inserted and on the Cooling plate attached electronic component in cross section Darge is explained.

Dabei bedeutet 1 einen mit einem Durchbruch 2 versehenen und als Folie ausgebildeten Träger, auf dem Leiterbahnen 8 festgelegt sind. An der Unterseite des Trägers 1 ist ein Kühlblech 4 festgeklebt. Ein elek­ tronisches Bauelement 3 ist auf dem den Durchbruch 2 des Trägers 1 über­ deckenden Bereich 5 des Kühlblechs 4 durch Kleben fest­ gelegt. Dabei ist das elektronische Bauelement 3 über Anschlußdrähte 6 nach dem Bondverfahren mit den Leiterbahnen 8 verbunden. Ferner ist es möglich, elektronische Bauelemente 3, die bereits vom Hersteller mit Anschlußbahnen versehen geliefert werden, auf dem Bereich 5 festzu­ kleben und mit den Leiterbahnen 8 durch Bonden zu verbinden. 1 means a support provided with an opening 2 and designed as a film, on which conductor tracks 8 are fixed. A cooling plate 4 is glued to the underside of the carrier 1 . An electronic component 3 is fixed on the opening 2 of the carrier 1 over covering area 5 of the cooling plate 4 by gluing. In this case, the electronic component 3 is connected to the conductor tracks 8 via connecting wires 6 using the bonding method. Furthermore, it is possible to glue electronic components 3 , which are already supplied by the manufacturer with connecting tracks, to the area 5 and to connect them to the conductor tracks 8 by bonding.

Das elektronische Bauelement 3 und seine Anschlußdrähte 6 werden nach einem Funktionstest unter üblichen Betriebsbedingungen mit einer elek­ trisch isolierenden Abdeckmasse 7 überdeckt. Hierfür sind unter Wärme­ einwirkung aushärtende zweikomponentige Kunstharze besonders gut geeignet. Die Abdeckmasse 7 schützt das elektronische Bauelement 3 und die Anschlußdrähte 6 vor störenden mechanischen und chemischen Einwir­ kungen. The electronic component 3 and its connecting wires 6 are covered after a function test under normal operating conditions with an electrically insulating covering compound 7 . Heat-curing two-component synthetic resins are particularly suitable for this. The masking compound 7 protects the electronic component 3 and the connecting wires 6 from interfering mechanical and chemical effects.

Als Material für die Kühlbleche 4 sind aufgrund ihrer sehr guten Wärme­ leitfähigkeit insbesondere die Metalle Kupfer und Aluminium geeignet. Zur Verbesserung der Wärmeabstrahlung durch die Kühlbleche 4 kann deren Emissionsvermögen durch eine entsprechende Färbung der Oberfläche erhöht werden.The metals copper and aluminum are particularly suitable as the material for the cooling plates 4 due to their very good thermal conductivity. To improve the heat radiation from the cooling plates 4 , their emissivity can be increased by appropriate coloring of the surface.

Claims (2)

1. Baueinheit mit einem elektronischen Bauelement, welches in einem Durchbruch eines Trägers eingefügt und auf einem an der Unter­ seite des Trägers den Durchbruch überdeckend festgelegten Kühl­ körper befestigt ist und mit auf der Oberseite des Trägers ange­ ordneten Leiterbahnen verbunden ist, dadurch gekennzeichnet, daß als Träger (1) eine 200 µm bis 500 µm starke Folie dient und daß das elektronische Bauelement (3) über Anschlußdrähte (6) nach dem Bondverfahren mit den Leiterbahnen (8) verbunden ist.1. Unit with an electronic component, which is inserted in an opening of a carrier and fixed on a bottom of the carrier covering the opening covering fixed cooling body and is connected to the top of the carrier arranged conductor tracks, characterized in that Carrier ( 1 ) is a 200 µm to 500 µm thick film and that the electronic component ( 3 ) is connected to the conductor tracks ( 8 ) via connecting wires ( 6 ) by the bonding process. 2. Bauelement nach Anspruch 1, dadurch gekennzeichnet, daß der Kühlkörper (4) mit der den Träger (1) bildenden Folie flächenhaft verklebt ist.2. Component according to claim 1, characterized in that the heat sink ( 4 ) with the support ( 1 ) forming film is glued areal.
DE19772752655 1977-09-23 1977-11-25 Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink Granted DE2752655A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772752655 DE2752655A1 (en) 1977-09-23 1977-11-25 Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2742882A DE2742882C2 (en) 1977-09-23 1977-09-23 Electronic component
DE19772752655 DE2752655A1 (en) 1977-09-23 1977-11-25 Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink

Publications (2)

Publication Number Publication Date
DE2752655A1 DE2752655A1 (en) 1979-06-07
DE2752655C2 true DE2752655C2 (en) 1988-03-24

Family

ID=6024628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772752655 Granted DE2752655A1 (en) 1977-09-23 1977-11-25 Electronic-component assembly for automated mass-production - has component in hole in support foil closed on one side by metal-plane heat sink

Country Status (1)

Country Link
DE (1) DE2752655A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4118398A1 (en) * 1991-06-05 1992-12-10 Ant Nachrichtentech Electronic assembly with circuit board in metallic housing e.g. for satellite - cools by conduction into metallic core without insulation under chip and against heat sink
DE4416460A1 (en) * 1994-05-10 1995-11-30 Hella Kg Hueck & Co Circuit arrangement, in particular for fan control for motor vehicles

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521350B1 (en) * 1982-02-05 1986-01-24 Hitachi Ltd SEMICONDUCTOR CHIP HOLDER
JPS60223149A (en) * 1984-04-19 1985-11-07 Hitachi Ltd Semiconductor device
DE3433779A1 (en) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Protective layer for semiconductor circuits
JPH0740600B2 (en) * 1987-04-30 1995-05-01 三菱電機株式会社 Semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL164425C (en) * 1971-02-05 1980-12-15 Philips Nv SEMICONDUCTOR DEVICE FITTED WITH A COOLING BODY.
DE2124887C3 (en) * 1971-05-19 1980-04-17 Philips Patentverwaltung Gmbh, 2000 Hamburg Electrical component, preferably semiconductor component, with foil contact
DE2414297C3 (en) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the semi-automatic production of intermediate carriers for semiconductor components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4118398A1 (en) * 1991-06-05 1992-12-10 Ant Nachrichtentech Electronic assembly with circuit board in metallic housing e.g. for satellite - cools by conduction into metallic core without insulation under chip and against heat sink
DE4416460A1 (en) * 1994-05-10 1995-11-30 Hella Kg Hueck & Co Circuit arrangement, in particular for fan control for motor vehicles

Also Published As

Publication number Publication date
DE2752655A1 (en) 1979-06-07

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