DE2729116C2 - Wäßriges Bad zum elektrolytischen Abscheiden von Palladium oder seinen Legierungen und Verfahren zur Herstellung dieses Bads - Google Patents
Wäßriges Bad zum elektrolytischen Abscheiden von Palladium oder seinen Legierungen und Verfahren zur Herstellung dieses BadsInfo
- Publication number
- DE2729116C2 DE2729116C2 DE19772729116 DE2729116A DE2729116C2 DE 2729116 C2 DE2729116 C2 DE 2729116C2 DE 19772729116 DE19772729116 DE 19772729116 DE 2729116 A DE2729116 A DE 2729116A DE 2729116 C2 DE2729116 C2 DE 2729116C2
- Authority
- DE
- Germany
- Prior art keywords
- bath
- palladium
- deep
- acid
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 50
- 229910052763 palladium Inorganic materials 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 11
- 229910045601 alloy Inorganic materials 0.000 title claims description 5
- 239000000956 alloy Substances 0.000 title claims description 5
- 230000008021 deposition Effects 0.000 title claims description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims description 6
- 150000002941 palladium compounds Chemical class 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 5
- -1 aliphatic amines Chemical class 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 claims description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 3
- 239000002738 chelating agent Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 2
- 235000011180 diphosphates Nutrition 0.000 claims description 2
- 235000021317 phosphate Nutrition 0.000 claims description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 2
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical class NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims 2
- 239000000337 buffer salt Substances 0.000 claims 2
- 230000000536 complexating effect Effects 0.000 claims 2
- 239000008139 complexing agent Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical class [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 claims 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims 1
- YRZBVIGIGZTWGT-UHFFFAOYSA-N [2-(diphosphonoamino)ethyl-phosphonoamino]phosphonic acid Chemical compound OP(O)(=O)N(P(O)(O)=O)CCN(P(O)(O)=O)P(O)(O)=O YRZBVIGIGZTWGT-UHFFFAOYSA-N 0.000 claims 1
- 150000001242 acetic acid derivatives Chemical class 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 150000001447 alkali salts Chemical class 0.000 claims 1
- 238000005275 alloying Methods 0.000 claims 1
- 235000011114 ammonium hydroxide Nutrition 0.000 claims 1
- 150000001642 boronic acid derivatives Chemical class 0.000 claims 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims 1
- 150000001860 citric acid derivatives Chemical class 0.000 claims 1
- 150000002823 nitrates Chemical class 0.000 claims 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims 1
- 150000002826 nitrites Chemical class 0.000 claims 1
- 229960003330 pentetic acid Drugs 0.000 claims 1
- 229920000768 polyamine Polymers 0.000 claims 1
- 150000003892 tartrate salts Chemical class 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002244 precipitate Substances 0.000 description 10
- 238000005868 electrolysis reaction Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101150003085 Pdcl gene Proteins 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH832276A CH597372A5 (US07576130-20090818-C00114.png) | 1976-06-28 | 1976-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2729116A1 DE2729116A1 (de) | 1978-01-05 |
| DE2729116C2 true DE2729116C2 (de) | 1987-01-29 |
Family
ID=4338548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19772729116 Expired DE2729116C2 (de) | 1976-06-28 | 1977-06-28 | Wäßriges Bad zum elektrolytischen Abscheiden von Palladium oder seinen Legierungen und Verfahren zur Herstellung dieses Bads |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH597372A5 (US07576130-20090818-C00114.png) |
| DE (1) | DE2729116C2 (US07576130-20090818-C00114.png) |
| FR (1) | FR2356747A1 (US07576130-20090818-C00114.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3118908C2 (de) * | 1981-05-13 | 1986-07-10 | Degussa Ag, 6000 Frankfurt | Galvanisches Palladiumbad |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1035850A (en) * | 1964-06-12 | 1966-07-13 | Johnson Matthey Co Ltd | Improvements in and relating to the electrodeposition of palladium |
| CH479715A (fr) * | 1967-09-08 | 1969-10-15 | Sel Rex Corp | Procédé de placage électrolytique de palladium, et bain pour la mise en oeuvre de ce procédé |
| CH572989A5 (US07576130-20090818-C00114.png) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
| DE2506467C2 (de) * | 1975-02-07 | 1986-07-17 | Schering AG, 1000 Berlin und 4709 Bergkamen | Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen |
-
1976
- 1976-06-28 CH CH832276A patent/CH597372A5/xx not_active IP Right Cessation
-
1977
- 1977-06-27 FR FR7719674A patent/FR2356747A1/fr active Granted
- 1977-06-28 DE DE19772729116 patent/DE2729116C2/de not_active Expired
Non-Patent Citations (1)
| Title |
|---|
| NICHTS-ERMITTELT |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2729116A1 (de) | 1978-01-05 |
| CH597372A5 (US07576130-20090818-C00114.png) | 1978-03-31 |
| FR2356747B1 (US07576130-20090818-C00114.png) | 1981-04-30 |
| FR2356747A1 (fr) | 1978-01-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |