DE2720653A1 - Verfahren und schaltungsanordnung zur korrektur der spannungsabhaengigkeit von halbleiterwiderstaenden - Google Patents
Verfahren und schaltungsanordnung zur korrektur der spannungsabhaengigkeit von halbleiterwiderstaendenInfo
- Publication number
- DE2720653A1 DE2720653A1 DE19772720653 DE2720653A DE2720653A1 DE 2720653 A1 DE2720653 A1 DE 2720653A1 DE 19772720653 DE19772720653 DE 19772720653 DE 2720653 A DE2720653 A DE 2720653A DE 2720653 A1 DE2720653 A1 DE 2720653A1
- Authority
- DE
- Germany
- Prior art keywords
- epitaxial layer
- voltage
- resistance
- circuit arrangement
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000005468 ion implantation Methods 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 9
- 150000002500 ions Chemical class 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 230000007704 transition Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/40—Resistors
- H10D1/43—Resistors having PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/326—Application of electric currents or fields, e.g. for electroforming
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Analogue/Digital Conversion (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7615001A FR2351505A1 (fr) | 1976-05-13 | 1976-05-13 | Procede de correction du coefficient en tension de resistances semi-conductrices, implantees ou diffusees |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2720653A1 true DE2720653A1 (de) | 1977-12-01 |
DE2720653C2 DE2720653C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-16 |
Family
ID=9173307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19772720653 Granted DE2720653A1 (de) | 1976-05-13 | 1977-05-07 | Verfahren und schaltungsanordnung zur korrektur der spannungsabhaengigkeit von halbleiterwiderstaenden |
Country Status (5)
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3328958A1 (de) * | 1982-08-25 | 1984-03-01 | Philips Nv | Integrierter widerstand |
US5451908A (en) * | 1993-09-02 | 1995-09-19 | Temic Telefunken Microelectronic Gmbh | Circuit arrangement with controlled pinch resistors |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4229753A (en) * | 1977-08-18 | 1980-10-21 | International Business Machines Corporation | Voltage compensation of temperature coefficient of resistance in an integrated circuit resistor |
SE7900379L (sv) * | 1978-01-25 | 1979-07-26 | Western Electric Co | Halvledare-integrerad-krets |
JPS5516489A (en) * | 1978-07-24 | 1980-02-05 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor resistance device |
DE3009042A1 (de) * | 1979-03-19 | 1980-10-02 | Trw Inc | Halbleiterwiderstand |
JPS55140260A (en) * | 1979-04-16 | 1980-11-01 | Fujitsu Ltd | Semiconductor device |
DE3276513D1 (en) * | 1982-11-26 | 1987-07-09 | Ibm | Self-biased resistor structure and application to interface circuits realization |
DE3376045D1 (en) * | 1983-10-19 | 1988-04-21 | Itt Ind Gmbh Deutsche | Monolithic integrated circuit with at least one integrated resistor |
JPS63244765A (ja) * | 1987-03-31 | 1988-10-12 | Toshiba Corp | 拡散抵抗を有する集積回路 |
JPH0423355A (ja) * | 1990-05-15 | 1992-01-27 | Hitachi Ltd | 半導体装置 |
DE10135169B4 (de) * | 2001-07-19 | 2004-02-19 | Robert Bosch Gmbh | Widerstandsanordnung und Strommesser |
US8384157B2 (en) | 2006-05-10 | 2013-02-26 | International Rectifier Corporation | High ohmic integrated resistor with improved linearity |
JP2012109535A (ja) | 2010-10-20 | 2012-06-07 | Asahi Kasei Electronics Co Ltd | 抵抗素子及び反転バッファ回路 |
JP6269936B2 (ja) * | 2013-12-26 | 2018-01-31 | 横河電機株式会社 | 集積回路 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270258A (en) * | 1963-07-05 | 1966-08-30 | Int Rectifier Corp | Field effect transistor |
DE2435606A1 (de) * | 1974-07-24 | 1976-02-05 | Siemens Ag | Reihenschaltung |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS515759A (ja) * | 1974-07-03 | 1976-01-17 | Hitachi Ltd | Sokoki |
JPS515277A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-07-04 | 1976-01-16 | Tatsuo Okazaki |
-
1976
- 1976-05-13 FR FR7615001A patent/FR2351505A1/fr active Granted
-
1977
- 1977-04-25 GB GB17024/77A patent/GB1517266A/en not_active Expired
- 1977-05-07 DE DE19772720653 patent/DE2720653A1/de active Granted
- 1977-05-10 JP JP5274977A patent/JPS52137988A/ja active Granted
- 1977-05-11 IT IT23418/77A patent/IT1115304B/it active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270258A (en) * | 1963-07-05 | 1966-08-30 | Int Rectifier Corp | Field effect transistor |
DE2435606A1 (de) * | 1974-07-24 | 1976-02-05 | Siemens Ag | Reihenschaltung |
Non-Patent Citations (6)
Title |
---|
"Wescon Technical Papers", Bd. 15, 1971, Ref. 8080-28/2, S.1-7 * |
Datenbuch Fa Teledyne Semicond. "JFET, applications and speif", Juni 1972 * |
Electronics, 6.11.1972, S. 98-101 * |
Feldeffekt-Transistoren, J. Wüsthube, 1969, S. 14-17 und S. 21-23 * |
Halbleiter SChaltungstechnik, U. Tietze, Ch. Schenk, 1971, S. 130-133 * |
Journ. Vac. Sci. Techn., Vol. 10, Nr. 6, Nov-Dez 1973, S. 944-947 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3328958A1 (de) * | 1982-08-25 | 1984-03-01 | Philips Nv | Integrierter widerstand |
US5451908A (en) * | 1993-09-02 | 1995-09-19 | Temic Telefunken Microelectronic Gmbh | Circuit arrangement with controlled pinch resistors |
Also Published As
Publication number | Publication date |
---|---|
JPS575059B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-01-28 |
DE2720653C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-16 |
IT1115304B (it) | 1986-02-03 |
GB1517266A (en) | 1978-07-12 |
JPS52137988A (en) | 1977-11-17 |
FR2351505A1 (fr) | 1977-12-09 |
FR2351505B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |