DE2603383C2 - - Google Patents

Info

Publication number
DE2603383C2
DE2603383C2 DE2603383A DE2603383A DE2603383C2 DE 2603383 C2 DE2603383 C2 DE 2603383C2 DE 2603383 A DE2603383 A DE 2603383A DE 2603383 A DE2603383 A DE 2603383A DE 2603383 C2 DE2603383 C2 DE 2603383C2
Authority
DE
Germany
Prior art keywords
section
strip
conductor
main section
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2603383A
Other languages
German (de)
English (en)
Other versions
DE2603383A1 (de
Inventor
Gerard Chatillon Bagneux Fr Dehaine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL PARIS FR Cie
Original Assignee
INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL PARIS FR Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL PARIS FR Cie filed Critical INTERNATIONALE POUR L'INFORMATIQUE CII-HONEYWELL BULL PARIS FR Cie
Publication of DE2603383A1 publication Critical patent/DE2603383A1/de
Application granted granted Critical
Publication of DE2603383C2 publication Critical patent/DE2603383C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
DE19762603383 1975-01-29 1976-01-29 Traeger fuer die verarbeitung von ic-chips Granted DE2603383A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7502802A FR2299724A1 (fr) 1975-01-29 1975-01-29 Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres

Publications (2)

Publication Number Publication Date
DE2603383A1 DE2603383A1 (de) 1976-08-05
DE2603383C2 true DE2603383C2 (OSRAM) 1987-08-06

Family

ID=9150472

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762603383 Granted DE2603383A1 (de) 1975-01-29 1976-01-29 Traeger fuer die verarbeitung von ic-chips

Country Status (6)

Country Link
US (1) US4109096A (OSRAM)
JP (1) JPS5755298B2 (OSRAM)
DE (1) DE2603383A1 (OSRAM)
FR (1) FR2299724A1 (OSRAM)
GB (1) GB1483322A (OSRAM)
NL (1) NL187219C (OSRAM)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
JPS575887Y2 (OSRAM) * 1976-08-23 1982-02-03
JPS54114565U (OSRAM) * 1978-01-31 1979-08-11
US4283839A (en) * 1978-07-26 1981-08-18 Western Electric Co., Inc. Method of bonding semiconductor devices to carrier tapes
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
US4195195A (en) * 1978-09-28 1980-03-25 The United States Of America As Represented By The Secretary Of The Army Tape automated bonding test board
US4609936A (en) * 1979-09-19 1986-09-02 Motorola, Inc. Semiconductor chip with direct-bonded external leadframe
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
FR2495836A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
JPS56110660U (OSRAM) * 1980-12-23 1981-08-27
US4390598A (en) * 1982-04-05 1983-06-28 Fairchild Camera & Instrument Corp. Lead format for tape automated bonding
FR2529385B1 (fr) * 1982-06-29 1985-12-13 Thomson Csf Microboitier d'encapsulation de circuits integres logiques fonctionnant en tres haute frequence
US4490902A (en) * 1982-09-03 1985-01-01 General Motors Corporation Lead frame for molded integrated circuit package
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
US4663651A (en) * 1986-04-14 1987-05-05 Gte Products Corporation Segmented lead frame strip for IC chip carrier
US4736882A (en) * 1986-07-22 1988-04-12 Olin Corporation Thermode design for tab and method of use
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
JPS63148670A (ja) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd リ−ドフレ−ム材
US4782589A (en) * 1987-04-06 1988-11-08 Dennis Richard K Process of connecting lead frame to a semi-conductor device and a device to effect same
US4846700A (en) * 1987-04-06 1989-07-11 Dennis Richard K Lead frame for semi-conductor device
KR970003915B1 (ko) * 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
FR2629272B1 (fr) * 1988-03-22 1990-11-09 Bull Sa Support de circuit integre de haute densite et appareil d'etamage selectif des conducteurs du support
US4867715A (en) * 1988-05-02 1989-09-19 Delco Electronics Corporation Interconnection lead with redundant bonding regions
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
JP2878929B2 (ja) * 1993-06-03 1999-04-05 株式会社東芝 半導体装置
KR100282003B1 (ko) * 1997-10-15 2001-02-15 윤종용 칩 스케일 패키지
US6212077B1 (en) * 1999-01-25 2001-04-03 International Business Machines Corporation Built-in inspection template for a printed circuit
US6728068B1 (en) 1999-05-07 2004-04-27 Seagate Technology Llc Head gimbal assembly interconnecting leads having improved robustness and lower stiffness
US6373125B1 (en) 2000-02-23 2002-04-16 International Business Machines Corporation Chip scale package with direct attachment of chip to lead frame
JP3403699B2 (ja) * 2000-05-31 2003-05-06 宮崎沖電気株式会社 半導体装置および半導体装置の製造方法
RU2216886C1 (ru) * 2002-03-01 2003-11-20 Федеральное государственное унитарное предприятие Московское опытно-конструкторское бюро "Марс" Радиоэлектронный блок
RU2215384C1 (ru) * 2002-03-01 2003-10-27 Федеральное государственное унитарное предприятие Московское опытно-конструкторское бюро "Марс" Переходная колодка и способ ее изготовления
US6929504B2 (en) * 2003-02-21 2005-08-16 Sylva Industries Ltd. Combined electrical connector and radiator for high current applications
JP4393303B2 (ja) * 2003-09-05 2010-01-06 キヤノン株式会社 半導体装置の製造方法
KR100634238B1 (ko) * 2005-08-12 2006-10-16 삼성전자주식회사 테이프 캐리어 패키지용 탭 테이프
KR101358751B1 (ko) * 2007-10-16 2014-02-07 삼성전자주식회사 반도체 패키지
IT1402273B1 (it) * 2010-07-29 2013-08-28 St Microelectronics Srl Elemento a semiconduttore con un die semiconduttore e telai di connettori
US8803185B2 (en) * 2012-02-21 2014-08-12 Peiching Ling Light emitting diode package and method of fabricating the same
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1530105A (fr) * 1967-06-22 1968-06-21 Ibm Assemblage de circuit imprimé
US3422213A (en) * 1966-04-21 1969-01-14 Webb James E Connector strips
GB1249360A (en) * 1967-12-30 1971-10-13 Sony Corp Lead assembly and method of making the same
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3519890A (en) * 1968-04-01 1970-07-07 North American Rockwell Low stress lead
US3947867A (en) * 1970-12-21 1976-03-30 Signetics Corporation Two part package for a semiconductor die
US3859715A (en) * 1970-12-21 1975-01-14 Signetics Corp System and method for attaching semiconductor dice to leads
FR2205800B1 (OSRAM) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US3905038A (en) * 1973-02-26 1975-09-09 Signetics Corp Semiconductor assembly and method
US3855693A (en) * 1973-04-18 1974-12-24 Honeywell Inf Systems Method for assembling microelectronic apparatus
FR2238247B1 (OSRAM) * 1973-06-27 1976-11-12 Honeywell Bull Soc Ind

Also Published As

Publication number Publication date
FR2299724A1 (fr) 1976-08-27
DE2603383A1 (de) 1976-08-05
NL187219B (nl) 1991-02-01
JPS5755298B2 (OSRAM) 1982-11-24
NL7600824A (nl) 1976-08-02
US4109096A (en) 1978-08-22
NL187219C (nl) 1991-07-01
FR2299724B1 (OSRAM) 1977-10-28
JPS5199975A (OSRAM) 1976-09-03
GB1483322A (en) 1977-08-17

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Legal Events

Date Code Title Description
OGA New person/name/address of the applicant
OD Request for examination
D2 Grant after examination
8364 No opposition during term of opposition