JPS5755298B2 - - Google Patents

Info

Publication number
JPS5755298B2
JPS5755298B2 JP51007581A JP758176A JPS5755298B2 JP S5755298 B2 JPS5755298 B2 JP S5755298B2 JP 51007581 A JP51007581 A JP 51007581A JP 758176 A JP758176 A JP 758176A JP S5755298 B2 JPS5755298 B2 JP S5755298B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51007581A
Other versions
JPS5199975A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5199975A publication Critical patent/JPS5199975A/ja
Publication of JPS5755298B2 publication Critical patent/JPS5755298B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
JP51007581A 1975-01-29 1976-01-28 Expired JPS5755298B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7502802A FR2299724A1 (fr) 1975-01-29 1975-01-29 Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres

Publications (2)

Publication Number Publication Date
JPS5199975A JPS5199975A (ja) 1976-09-03
JPS5755298B2 true JPS5755298B2 (ja) 1982-11-24

Family

ID=9150472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51007581A Expired JPS5755298B2 (ja) 1975-01-29 1976-01-28

Country Status (6)

Country Link
US (1) US4109096A (ja)
JP (1) JPS5755298B2 (ja)
DE (1) DE2603383A1 (ja)
FR (1) FR2299724A1 (ja)
GB (1) GB1483322A (ja)
NL (1) NL187219C (ja)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
JPS575887Y2 (ja) * 1976-08-23 1982-02-03
JPS54114565U (ja) * 1978-01-31 1979-08-11
US4283839A (en) * 1978-07-26 1981-08-18 Western Electric Co., Inc. Method of bonding semiconductor devices to carrier tapes
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
US4195195A (en) * 1978-09-28 1980-03-25 The United States Of America As Represented By The Secretary Of The Army Tape automated bonding test board
US4609936A (en) * 1979-09-19 1986-09-02 Motorola, Inc. Semiconductor chip with direct-bonded external leadframe
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2495836A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
JPS56110660U (ja) * 1980-12-23 1981-08-27
US4390598A (en) * 1982-04-05 1983-06-28 Fairchild Camera & Instrument Corp. Lead format for tape automated bonding
FR2529385B1 (fr) * 1982-06-29 1985-12-13 Thomson Csf Microboitier d'encapsulation de circuits integres logiques fonctionnant en tres haute frequence
US4490902A (en) * 1982-09-03 1985-01-01 General Motors Corporation Lead frame for molded integrated circuit package
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
US4663651A (en) * 1986-04-14 1987-05-05 Gte Products Corporation Segmented lead frame strip for IC chip carrier
US4736882A (en) * 1986-07-22 1988-04-12 Olin Corporation Thermode design for tab and method of use
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
JPS63148670A (ja) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd リ−ドフレ−ム材
US4846700A (en) * 1987-04-06 1989-07-11 Dennis Richard K Lead frame for semi-conductor device
US4782589A (en) * 1987-04-06 1988-11-08 Dennis Richard K Process of connecting lead frame to a semi-conductor device and a device to effect same
KR970003915B1 (ko) * 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
US5138438A (en) * 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
FR2629272B1 (fr) * 1988-03-22 1990-11-09 Bull Sa Support de circuit integre de haute densite et appareil d'etamage selectif des conducteurs du support
US4867715A (en) * 1988-05-02 1989-09-19 Delco Electronics Corporation Interconnection lead with redundant bonding regions
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
JP2878929B2 (ja) * 1993-06-03 1999-04-05 株式会社東芝 半導体装置
KR100282003B1 (ko) * 1997-10-15 2001-02-15 윤종용 칩 스케일 패키지
US6212077B1 (en) 1999-01-25 2001-04-03 International Business Machines Corporation Built-in inspection template for a printed circuit
US6728068B1 (en) 1999-05-07 2004-04-27 Seagate Technology Llc Head gimbal assembly interconnecting leads having improved robustness and lower stiffness
US6373125B1 (en) 2000-02-23 2002-04-16 International Business Machines Corporation Chip scale package with direct attachment of chip to lead frame
JP3403699B2 (ja) * 2000-05-31 2003-05-06 宮崎沖電気株式会社 半導体装置および半導体装置の製造方法
US6929504B2 (en) * 2003-02-21 2005-08-16 Sylva Industries Ltd. Combined electrical connector and radiator for high current applications
JP4393303B2 (ja) * 2003-09-05 2010-01-06 キヤノン株式会社 半導体装置の製造方法
KR100634238B1 (ko) * 2005-08-12 2006-10-16 삼성전자주식회사 테이프 캐리어 패키지용 탭 테이프
KR101358751B1 (ko) * 2007-10-16 2014-02-07 삼성전자주식회사 반도체 패키지
IT1402273B1 (it) * 2010-07-29 2013-08-28 St Microelectronics Srl Elemento a semiconduttore con un die semiconduttore e telai di connettori
US8803185B2 (en) * 2012-02-21 2014-08-12 Peiching Ling Light emitting diode package and method of fabricating the same
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1530105A (fr) * 1967-06-22 1968-06-21 Ibm Assemblage de circuit imprimé
US3422213A (en) * 1966-04-21 1969-01-14 Webb James E Connector strips
GB1249360A (en) * 1967-12-30 1971-10-13 Sony Corp Lead assembly and method of making the same
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3519890A (en) * 1968-04-01 1970-07-07 North American Rockwell Low stress lead
US3947867A (en) * 1970-12-21 1976-03-30 Signetics Corporation Two part package for a semiconductor die
US3859715A (en) * 1970-12-21 1975-01-14 Signetics Corp System and method for attaching semiconductor dice to leads
FR2205800B1 (ja) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US3905038A (en) * 1973-02-26 1975-09-09 Signetics Corp Semiconductor assembly and method
US3855693A (en) * 1973-04-18 1974-12-24 Honeywell Inf Systems Method for assembling microelectronic apparatus
FR2238247B1 (ja) * 1973-06-27 1976-11-12 Honeywell Bull Soc Ind

Also Published As

Publication number Publication date
JPS5199975A (ja) 1976-09-03
GB1483322A (en) 1977-08-17
NL187219C (nl) 1991-07-01
DE2603383C2 (ja) 1987-08-06
NL7600824A (nl) 1976-08-02
FR2299724B1 (ja) 1977-10-28
US4109096A (en) 1978-08-22
NL187219B (nl) 1991-02-01
DE2603383A1 (de) 1976-08-05
FR2299724A1 (fr) 1976-08-27

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