IT1402273B1 - Elemento a semiconduttore con un die semiconduttore e telai di connettori - Google Patents

Elemento a semiconduttore con un die semiconduttore e telai di connettori

Info

Publication number
IT1402273B1
IT1402273B1 ITVI2010A000212A ITVI20100212A IT1402273B1 IT 1402273 B1 IT1402273 B1 IT 1402273B1 IT VI2010A000212 A ITVI2010A000212 A IT VI2010A000212A IT VI20100212 A ITVI20100212 A IT VI20100212A IT 1402273 B1 IT1402273 B1 IT 1402273B1
Authority
IT
Italy
Prior art keywords
semiconductor
connector frames
semiconductor element
semiconductor die
die
Prior art date
Application number
ITVI2010A000212A
Other languages
English (en)
Inventor
Piparo Alessandro Lo
Agatino Minotti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITVI2010A000212A priority Critical patent/IT1402273B1/it
Priority to US13/070,075 priority patent/US8471370B2/en
Publication of ITVI20100212A1 publication Critical patent/ITVI20100212A1/it
Application granted granted Critical
Publication of IT1402273B1 publication Critical patent/IT1402273B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
ITVI2010A000212A 2010-07-29 2010-07-29 Elemento a semiconduttore con un die semiconduttore e telai di connettori IT1402273B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITVI2010A000212A IT1402273B1 (it) 2010-07-29 2010-07-29 Elemento a semiconduttore con un die semiconduttore e telai di connettori
US13/070,075 US8471370B2 (en) 2010-07-29 2011-03-23 Semiconductor element with semiconductor die and lead frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITVI2010A000212A IT1402273B1 (it) 2010-07-29 2010-07-29 Elemento a semiconduttore con un die semiconduttore e telai di connettori

Publications (2)

Publication Number Publication Date
ITVI20100212A1 ITVI20100212A1 (it) 2012-01-30
IT1402273B1 true IT1402273B1 (it) 2013-08-28

Family

ID=43479486

Family Applications (1)

Application Number Title Priority Date Filing Date
ITVI2010A000212A IT1402273B1 (it) 2010-07-29 2010-07-29 Elemento a semiconduttore con un die semiconduttore e telai di connettori

Country Status (2)

Country Link
US (1) US8471370B2 (it)
IT (1) IT1402273B1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014221142A1 (de) * 2014-10-17 2016-04-21 Robert Bosch Gmbh Modul mit Sinteranbindung
US9873250B2 (en) * 2016-03-14 2018-01-23 Stmicroelectronics, Inc. Microfluidic assembly with mechanical bonds
JP6992913B2 (ja) * 2018-11-05 2022-01-13 富士電機株式会社 リードフレーム配線構造及び半導体モジュール
CN111628067A (zh) * 2020-05-27 2020-09-04 深圳桑椹电子商务有限公司 一种led基板的制造方法及结构

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3564352A (en) * 1968-12-30 1971-02-16 Fairchild Camera Instr Co Strip design for a low cost plastic transistor
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
GB1557685A (en) * 1976-02-02 1979-12-12 Fairchild Camera Instr Co Optically coupled isolator device
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US5166098A (en) * 1988-03-05 1992-11-24 Deutsche Itt Industries Gmbh Method of manufacturing an encapsulated semiconductor device with a can type housing
US4994412A (en) * 1990-02-09 1991-02-19 Motorola Inc. Self-centering electrode for power devices
US5343072A (en) * 1990-08-20 1994-08-30 Rohm Co., Ltd. Method and leadframe for making electronic components
JPH05315490A (ja) * 1992-05-07 1993-11-26 Fuji Electric Co Ltd 半導体素子
US5977618A (en) * 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
JP2560974B2 (ja) * 1993-06-04 1996-12-04 日本電気株式会社 半導体装置
US5506174A (en) * 1994-07-12 1996-04-09 General Instrument Corp. Automated assembly of semiconductor devices using a pair of lead frames
KR100282003B1 (ko) * 1997-10-15 2001-02-15 윤종용 칩 스케일 패키지
US6396127B1 (en) * 1998-09-25 2002-05-28 International Rectifier Corporation Semiconductor package
SG87769A1 (en) * 1998-09-29 2002-04-16 Texas Instr Singapore Pte Ltd Direct attachment of semiconductor chip to organic substrate
US6317327B1 (en) * 2001-01-04 2001-11-13 Chin-Feng Lin Diode cooling arrangement
JP2004079760A (ja) * 2002-08-19 2004-03-11 Nec Electronics Corp 半導体装置及びその組立方法
DE102006005420B4 (de) * 2006-02-03 2010-07-15 Infineon Technologies Ag Stapelbares Halbleiterbauteil und Verfahren zur Herstellung desselben
US8686554B2 (en) * 2007-03-13 2014-04-01 International Rectifier Corporation Vertically mountable semiconductor device package
JP2008270302A (ja) * 2007-04-16 2008-11-06 Sanyo Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
US20120025358A1 (en) 2012-02-02
ITVI20100212A1 (it) 2012-01-30
US8471370B2 (en) 2013-06-25

Similar Documents

Publication Publication Date Title
EP2682985A4 (en) SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
EP2767553A4 (en) POLYMER CONNECTION AND ELECTRONIC ELEMENT
EP2945200A4 (en) TRANSISTOR ARRANGEMENT AND MANUFACTURING METHOD THEREFOR
EP2819152A4 (en) SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
EP2858109A4 (en) SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
DK2715253T3 (da) Ejektorer og fremstillingsfremgangsmåder
EP2770540A4 (en) METHOD FOR LINKING SEMICONDUCTOR ELEMENTS AND LINK STRUCTURE
EP2688100A4 (en) SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
EP2876668A4 (en) SEMICONDUCTOR FOIL AND SEMICONDUCTOR ELEMENT
EP3024024A4 (en) SEMICONDUCTOR MODULE
DK2488043T3 (da) Forbedret ernæringstablet
EP2506316A4 (en) SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
EP2800152A4 (en) GROUP III NITRIDE SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THEREOF
EP2978027A4 (en) PHOTOVOLTAIC ELEMENT AND METHOD FOR MANUFACTURING THE SAME
EP2978026A4 (en) PHOTOVOLTAIC ELEMENT AND METHOD OF MANUFACTURING THE SAME
HUE045601T2 (hu) Kristályrács modul és eljárás annak elõállítására
BR112013011368A2 (pt) elemento de forma
EP2482315A4 (en) SEMICONDUCTOR ELEMENT
IT1402273B1 (it) Elemento a semiconduttore con un die semiconduttore e telai di connettori
IT1395525B1 (it) Elemento di seduta
FR3011126B1 (fr) Module photovoltaique a connectique amelioree
FR3003963B1 (fr) Module d interface
BR112014015216A2 (pt) elemento termoelétrico
EP2684217A4 (en) SEMICONDUCTOR COMPONENT
IT1399531B1 (it) Elemento di seduta