JPS575887Y2 - - Google Patents

Info

Publication number
JPS575887Y2
JPS575887Y2 JP1976113137U JP11313776U JPS575887Y2 JP S575887 Y2 JPS575887 Y2 JP S575887Y2 JP 1976113137 U JP1976113137 U JP 1976113137U JP 11313776 U JP11313776 U JP 11313776U JP S575887 Y2 JPS575887 Y2 JP S575887Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976113137U
Other versions
JPS5330873U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976113137U priority Critical patent/JPS575887Y2/ja
Publication of JPS5330873U publication Critical patent/JPS5330873U/ja
Priority to US06/039,820 priority patent/US4536786A/en
Application granted granted Critical
Publication of JPS575887Y2 publication Critical patent/JPS575887Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP1976113137U 1976-08-23 1976-08-23 Expired JPS575887Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1976113137U JPS575887Y2 (ja) 1976-08-23 1976-08-23
US06/039,820 US4536786A (en) 1976-08-23 1979-05-17 Lead electrode connection in a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976113137U JPS575887Y2 (ja) 1976-08-23 1976-08-23

Publications (2)

Publication Number Publication Date
JPS5330873U JPS5330873U (ja) 1978-03-16
JPS575887Y2 true JPS575887Y2 (ja) 1982-02-03

Family

ID=14604485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976113137U Expired JPS575887Y2 (ja) 1976-08-23 1976-08-23

Country Status (2)

Country Link
US (1) US4536786A (ja)
JP (1) JPS575887Y2 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619632A (en) * 1979-07-26 1981-02-24 Seiko Epson Corp Lead terminal
JPS6142842U (ja) * 1985-07-31 1986-03-19 シャープ株式会社 半導体装置の位置合せ装置
US4795077A (en) * 1988-05-23 1989-01-03 Motorola Inc. Bonding method and apparatus
US4948030A (en) * 1989-01-30 1990-08-14 Motorola, Inc. Bond connection for components
DE69114217T2 (de) * 1990-08-22 1996-04-11 Nippon Electric Co Träger für filmmontierte Halbleiter-Vorrichtung.
JPH04307943A (ja) * 1991-04-05 1992-10-30 Mitsubishi Electric Corp 半導体装置
US5907187A (en) * 1994-07-18 1999-05-25 Kabushiki Kaisha Toshiba Electronic component and electronic component connecting structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3450965A (en) * 1966-05-28 1969-06-17 Sony Corp Semiconductor having reinforced lead structure
US3871015A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform connector joints
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
GB1363431A (en) * 1970-11-24 1974-08-14 Lucas Industries Ltd Method of electrically connecting a semiconductor chip to a sub strate
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3689803A (en) * 1971-03-30 1972-09-05 Ibm Integrated circuit structure having a unique surface metallization layout
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
US4010488A (en) * 1975-11-21 1977-03-01 Western Electric Company, Inc. Electronic apparatus with optional coupling

Also Published As

Publication number Publication date
US4536786A (en) 1985-08-20
JPS5330873U (ja) 1978-03-16

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