DE2555662A1 - Waermeableitendes halbleiterbauelement - Google Patents
Waermeableitendes halbleiterbauelementInfo
- Publication number
- DE2555662A1 DE2555662A1 DE19752555662 DE2555662A DE2555662A1 DE 2555662 A1 DE2555662 A1 DE 2555662A1 DE 19752555662 DE19752555662 DE 19752555662 DE 2555662 A DE2555662 A DE 2555662A DE 2555662 A1 DE2555662 A1 DE 2555662A1
- Authority
- DE
- Germany
- Prior art keywords
- disc
- plates
- plate
- semiconductor
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims description 44
- 235000012431 wafers Nutrition 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 9
- 239000010937 tungsten Substances 0.000 claims description 9
- 239000002775 capsule Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/539,850 US3984861A (en) | 1975-01-09 | 1975-01-09 | Transcallent semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2555662A1 true DE2555662A1 (de) | 1976-07-15 |
Family
ID=24152914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19752555662 Withdrawn DE2555662A1 (de) | 1975-01-09 | 1975-12-11 | Waermeableitendes halbleiterbauelement |
Country Status (3)
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4386362A (en) * | 1979-12-26 | 1983-05-31 | Rca Corporation | Center gate semiconductor device having pipe cooling means |
JPS5911657A (ja) * | 1982-07-12 | 1984-01-21 | Kansai Electric Power Co Inc:The | サイリスタ用冷却装置 |
US4559580A (en) * | 1983-11-04 | 1985-12-17 | Sundstrand Corporation | Semiconductor package with internal heat exchanger |
US5008735A (en) * | 1989-12-07 | 1991-04-16 | General Instrument Corporation | Packaged diode for high temperature operation |
US5386143A (en) * | 1991-10-25 | 1995-01-31 | Digital Equipment Corporation | High performance substrate, electronic package and integrated circuit cooling process |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
US6525420B2 (en) * | 2001-01-30 | 2003-02-25 | Thermal Corp. | Semiconductor package with lid heat spreader |
EP1308686A1 (en) * | 2001-11-06 | 2003-05-07 | Agilent Technologies, Inc. (a Delaware corporation) | Thermal management |
US7180179B2 (en) * | 2004-06-18 | 2007-02-20 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
US7002247B2 (en) * | 2004-06-18 | 2006-02-21 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
JP4305406B2 (ja) * | 2005-03-18 | 2009-07-29 | 三菱電機株式会社 | 冷却構造体 |
US9086229B1 (en) | 2006-10-13 | 2015-07-21 | Hrl Laboratories, Llc | Optical components from micro-architected trusses |
US9229162B1 (en) | 2006-10-13 | 2016-01-05 | Hrl Laboratories, Llc | Three-dimensional ordered diamond cellular structures and method of making the same |
US8579018B1 (en) | 2009-03-23 | 2013-11-12 | Hrl Laboratories, Llc | Lightweight sandwich panel heat pipe |
US8573289B1 (en) | 2009-07-20 | 2013-11-05 | Hrl Laboratories, Llc | Micro-architected materials for heat exchanger applications |
US8453717B1 (en) | 2009-07-20 | 2013-06-04 | Hrl Laboratories, Llc | Micro-architected materials for heat sink applications |
US9546826B1 (en) | 2010-01-21 | 2017-01-17 | Hrl Laboratories, Llc | Microtruss based thermal heat spreading structures |
US8921702B1 (en) * | 2010-01-21 | 2014-12-30 | Hrl Laboratories, Llc | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments |
US8857182B1 (en) | 2010-05-19 | 2014-10-14 | Hrl Laboratories, Llc | Power generation through artificial transpiration |
US8771330B1 (en) | 2010-05-19 | 2014-07-08 | Hrl Laboratories, Llc | Personal artificial transpiration cooling system |
US9758382B1 (en) | 2011-01-31 | 2017-09-12 | Hrl Laboratories, Llc | Three-dimensional ordered diamond cellular structures and method of making the same |
US9405067B2 (en) | 2013-03-13 | 2016-08-02 | Hrl Laboratories, Llc | Micro-truss materials having in-plane material property variations |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3739235A (en) * | 1972-01-31 | 1973-06-12 | Rca Corp | Transcalent semiconductor device |
JPS4887779A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-02-01 | 1973-11-17 | ||
US3852804A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly |
US3852803A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat sink cooled power semiconductor device assembly having liquid metal interface |
US3852805A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit |
US3826957A (en) * | 1973-07-02 | 1974-07-30 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly using compression rods |
-
1975
- 1975-01-09 US US05/539,850 patent/US3984861A/en not_active Expired - Lifetime
- 1975-12-11 DE DE19752555662 patent/DE2555662A1/de not_active Withdrawn
-
1976
- 1976-01-08 JP JP51001971A patent/JPS5195779A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5195779A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-08-21 |
US3984861A (en) | 1976-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8130 | Withdrawal |