DE2555662A1 - Waermeableitendes halbleiterbauelement - Google Patents

Waermeableitendes halbleiterbauelement

Info

Publication number
DE2555662A1
DE2555662A1 DE19752555662 DE2555662A DE2555662A1 DE 2555662 A1 DE2555662 A1 DE 2555662A1 DE 19752555662 DE19752555662 DE 19752555662 DE 2555662 A DE2555662 A DE 2555662A DE 2555662 A1 DE2555662 A1 DE 2555662A1
Authority
DE
Germany
Prior art keywords
disc
plates
plate
semiconductor
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19752555662
Other languages
German (de)
English (en)
Inventor
Jun Sebastian William Kessler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE2555662A1 publication Critical patent/DE2555662A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE19752555662 1975-01-09 1975-12-11 Waermeableitendes halbleiterbauelement Withdrawn DE2555662A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/539,850 US3984861A (en) 1975-01-09 1975-01-09 Transcallent semiconductor device

Publications (1)

Publication Number Publication Date
DE2555662A1 true DE2555662A1 (de) 1976-07-15

Family

ID=24152914

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752555662 Withdrawn DE2555662A1 (de) 1975-01-09 1975-12-11 Waermeableitendes halbleiterbauelement

Country Status (3)

Country Link
US (1) US3984861A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5195779A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2555662A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386362A (en) * 1979-12-26 1983-05-31 Rca Corporation Center gate semiconductor device having pipe cooling means
JPS5911657A (ja) * 1982-07-12 1984-01-21 Kansai Electric Power Co Inc:The サイリスタ用冷却装置
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
US6525420B2 (en) * 2001-01-30 2003-02-25 Thermal Corp. Semiconductor package with lid heat spreader
EP1308686A1 (en) * 2001-11-06 2003-05-07 Agilent Technologies, Inc. (a Delaware corporation) Thermal management
US7180179B2 (en) * 2004-06-18 2007-02-20 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
US7002247B2 (en) * 2004-06-18 2006-02-21 International Business Machines Corporation Thermal interposer for thermal management of semiconductor devices
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US9086229B1 (en) 2006-10-13 2015-07-21 Hrl Laboratories, Llc Optical components from micro-architected trusses
US9229162B1 (en) 2006-10-13 2016-01-05 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8453717B1 (en) 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) * 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
US9758382B1 (en) 2011-01-31 2017-09-12 Hrl Laboratories, Llc Three-dimensional ordered diamond cellular structures and method of making the same
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device
JPS4887779A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-02-01 1973-11-17
US3852804A (en) * 1973-05-02 1974-12-03 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface
US3852805A (en) * 1973-06-18 1974-12-03 Gen Electric Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
US3826957A (en) * 1973-07-02 1974-07-30 Gen Electric Double-sided heat-pipe cooled power semiconductor device assembly using compression rods

Also Published As

Publication number Publication date
JPS5195779A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-08-21
US3984861A (en) 1976-10-05

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Legal Events

Date Code Title Description
8130 Withdrawal