DE2527213C2 - Verfahren zur Herstellung leitfähiger Durchverbindungen innerhalb von Bohrungen in flexiblen gedruckten Schaltungen durch Verbindungselemente in Form von Hohlnieten - Google Patents

Verfahren zur Herstellung leitfähiger Durchverbindungen innerhalb von Bohrungen in flexiblen gedruckten Schaltungen durch Verbindungselemente in Form von Hohlnieten

Info

Publication number
DE2527213C2
DE2527213C2 DE19752527213 DE2527213A DE2527213C2 DE 2527213 C2 DE2527213 C2 DE 2527213C2 DE 19752527213 DE19752527213 DE 19752527213 DE 2527213 A DE2527213 A DE 2527213A DE 2527213 C2 DE2527213 C2 DE 2527213C2
Authority
DE
Germany
Prior art keywords
bores
connections
flexible printed
connecting elements
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19752527213
Other languages
German (de)
English (en)
Other versions
DE2527213A1 (de
Inventor
Giuseppe Quattordio Alessandria Codrino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CAVIS CAVETTI ISOLATI SpA TORINO IT
Original Assignee
CAVIS CAVETTI ISOLATI SpA TORINO IT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CAVIS CAVETTI ISOLATI SpA TORINO IT filed Critical CAVIS CAVETTI ISOLATI SpA TORINO IT
Publication of DE2527213A1 publication Critical patent/DE2527213A1/de
Application granted granted Critical
Publication of DE2527213C2 publication Critical patent/DE2527213C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
DE19752527213 1974-06-17 1975-06-16 Verfahren zur Herstellung leitfähiger Durchverbindungen innerhalb von Bohrungen in flexiblen gedruckten Schaltungen durch Verbindungselemente in Form von Hohlnieten Expired DE2527213C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2677774 1974-06-17

Publications (2)

Publication Number Publication Date
DE2527213A1 DE2527213A1 (de) 1976-01-02
DE2527213C2 true DE2527213C2 (de) 1984-06-14

Family

ID=10249028

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752527213 Expired DE2527213C2 (de) 1974-06-17 1975-06-16 Verfahren zur Herstellung leitfähiger Durchverbindungen innerhalb von Bohrungen in flexiblen gedruckten Schaltungen durch Verbindungselemente in Form von Hohlnieten

Country Status (5)

Country Link
JP (1) JPS5112680A (en:Method)
BR (1) BR7503809A (en:Method)
DE (1) DE2527213C2 (en:Method)
ES (1) ES213168Y (en:Method)
FR (1) FR2275001A1 (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2205202A (en) * 1987-05-29 1988-11-30 Allied Corp Improved electrical connection devices for use with flat cable
DE19757719C2 (de) * 1997-12-23 2001-08-16 Delphi Automotive Systems Gmbh Verfahren und Vorrichtung zum Verbinden von flexiblen gedruckten Schaltungen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2937358A (en) * 1955-04-18 1960-05-17 Gen Electric Printed circuit sandwiched in glass
US2883447A (en) * 1958-04-28 1959-04-21 Frank L Dahl Universally adaptable conductivecircuit board
US3501831A (en) * 1968-06-17 1970-03-24 Rogers Corp Eyelet
DE1951778B2 (de) * 1969-10-14 1971-08-15 Anordnung aus einer reihe uebereinander gestapelter flexib ler mit leitungsbahnen versehenen isolierstoffolien
JPS49114774A (en:Method) * 1973-03-10 1974-11-01
JPS5194560A (en:Method) * 1975-02-17 1976-08-19

Also Published As

Publication number Publication date
JPS5112680A (ja) 1976-01-31
DE2527213A1 (de) 1976-01-02
FR2275001B1 (en:Method) 1981-06-19
FR2275001A1 (fr) 1976-01-09
ES213168U (es) 1976-06-16
ES213168Y (es) 1976-11-01
BR7503809A (pt) 1976-07-06

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: DIEHL, P., DIPL.-ING., PAT.-ANW., 1000 BERLIN

8125 Change of the main classification

Ipc: H05K 3/42

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee