DE2511058A1 - Befestigungsanordnung - Google Patents

Befestigungsanordnung

Info

Publication number
DE2511058A1
DE2511058A1 DE19752511058 DE2511058A DE2511058A1 DE 2511058 A1 DE2511058 A1 DE 2511058A1 DE 19752511058 DE19752511058 DE 19752511058 DE 2511058 A DE2511058 A DE 2511058A DE 2511058 A1 DE2511058 A1 DE 2511058A1
Authority
DE
Germany
Prior art keywords
platform
arrangement according
heated
sleeve
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752511058
Other languages
German (de)
English (en)
Inventor
Jun Steven Butler
Arthur Harley Clawson
Robert Jackie Ward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Duracell Inc USA
Original Assignee
PR Mallory and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PR Mallory and Co Inc filed Critical PR Mallory and Co Inc
Publication of DE2511058A1 publication Critical patent/DE2511058A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
DE19752511058 1974-03-13 1975-03-13 Befestigungsanordnung Pending DE2511058A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US450563A US3920949A (en) 1974-03-13 1974-03-13 Beam leaded device welding machine

Publications (1)

Publication Number Publication Date
DE2511058A1 true DE2511058A1 (de) 1975-09-18

Family

ID=23788588

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752511058 Pending DE2511058A1 (de) 1974-03-13 1975-03-13 Befestigungsanordnung

Country Status (6)

Country Link
US (1) US3920949A (https=)
JP (1) JPS50127567A (https=)
CA (1) CA1038088A (https=)
DE (1) DE2511058A1 (https=)
FR (1) FR2264456A1 (https=)
GB (1) GB1505357A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2834836A1 (de) * 1977-12-08 1979-06-13 Universal Instruments Corp Vorrichtung zum aufbringen elektronischer bauelemente auf einen hybrid- leitertraeger

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Industrial Co Ltd Device for mounting electronic part
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
US4320865A (en) * 1980-03-21 1982-03-23 National Semiconductor Corporation Apparatus for attachment of die to heat sink
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
US7430081B2 (en) * 2002-02-28 2008-09-30 Emcore Corporation Sub-micron adjustable mount for supporting a component and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179693A (en) * 1937-10-30 1939-11-14 Gen Motors Corp Welding electrode
US2346088A (en) * 1943-02-05 1944-04-04 Stackpole Carbon Co Self-aligning electrode
US3384283A (en) * 1964-10-16 1968-05-21 Axion Corp Vibratory wire bonding method and apparatus
US3466514A (en) * 1967-06-26 1969-09-09 Ibm Method and apparatus for positioning objects in preselected orientations
US3617682A (en) * 1969-06-23 1971-11-02 Gen Electric Semiconductor chip bonder
BE757111A (fr) * 1969-10-07 1971-03-16 Western Electric Co Procede pour manipuler des dispositifs a micropoutres a un poste d'essai
US3696229A (en) * 1970-04-14 1972-10-03 Thomas L Angelucci Bonding tool for through the tool observation bonding and method of bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2834836A1 (de) * 1977-12-08 1979-06-13 Universal Instruments Corp Vorrichtung zum aufbringen elektronischer bauelemente auf einen hybrid- leitertraeger

Also Published As

Publication number Publication date
US3920949A (en) 1975-11-18
CA1038088A (en) 1978-09-05
JPS50127567A (https=) 1975-10-07
FR2264456A1 (https=) 1975-10-10
GB1505357A (en) 1978-03-30

Similar Documents

Publication Publication Date Title
DE69634185T2 (de) Testeinrichtung
DE2915006C2 (de) Vorrichtung zum Kleben von Werkstücken
DE4325565C2 (de) Verfahren und Vorrichtung zur Beförderung eines Leiterrahmens
DE2804398A1 (de) Koordinatenmessmaschine und verfahren zu deren betrieb
DE2914333A1 (de) Vorrichtung zur nachpruefung evtl. verformungen einer kraftfahrzeug- karosserie
DE4230044A1 (de) Roboter zum antreiben eines automobils auf einem fahrwerkdynamometer
DE2163970B2 (de) Pruefeinrichtung zur pruefung von leiterplatten
DE2460425A1 (de) Einrichtung zum bewegen eines werkzeuges gegenueber einem werkstueck
DE2557171A1 (de) Automatische bearbeitungsmaschine
DE2511058A1 (de) Befestigungsanordnung
DE102007019895A1 (de) Handler zum Testen von gepackten Chips
DE2526067A1 (de) Therapeutisches geraet
DE2628428B2 (de) Adapter zum Verbinden von Anschluß- und/oder Prüfpunkten einer Baugruppe mit einer MeBschaltung
DE102010054606A1 (de) Spritzgussmaschine
DE2833307A1 (de) Vorrichtung zum einsetzen von anschlussleitungen elektronischer bauteile
DE2337303B2 (de) Automatische Verbindungsvorrichtung insbesondere zum Zusammenbau von Halbleiteranordnungen
DE2164026A1 (de) Biegevorrichtung und Verfahren zum Herstellen von Biegungen
DE2331907A1 (de) Automatische einstellvorrichtung in modulbauweise
DE69520141T2 (de) Verfahren und vorrichtung zur reparatur des chassis und/oder der karosserie eines kraftfahrzeuges
DE3242270A1 (de) Verfahren und einrichtung zur automatischen kontrolle und dem winkelgerechten abkanten von fahrrad-rahmen
DE19756900A1 (de) Testvorrichtung für Halbleiterbauelemente
DE1180848B (de) Vorrichtung zum Zusammensetzen von glasumhuellten Halbleiterdioden
CN108857217B (zh) 一种点焊通用模具
DE102007005151A1 (de) Mehrfach-Bestückkopf mit kollektivem Drehantrieb und verfahrbarem Hubantrieb für Bauelement-Halteeinrichtungen
DE60101988T2 (de) Sehnenspannvorrichtung

Legal Events

Date Code Title Description
OHJ Non-payment of the annual fee