JPS50127567A - - Google Patents
Info
- Publication number
- JPS50127567A JPS50127567A JP50029995A JP2999575A JPS50127567A JP S50127567 A JPS50127567 A JP S50127567A JP 50029995 A JP50029995 A JP 50029995A JP 2999575 A JP2999575 A JP 2999575A JP S50127567 A JPS50127567 A JP S50127567A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/658,969 US4034691A (en) | 1975-03-04 | 1976-02-18 | Sewing machine with a sub-table device |
| GB7684/76A GB1508702A (en) | 1975-03-12 | 1976-02-26 | Sewing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US450563A US3920949A (en) | 1974-03-13 | 1974-03-13 | Beam leaded device welding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50127567A true JPS50127567A (https=) | 1975-10-07 |
Family
ID=23788588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50029995A Pending JPS50127567A (https=) | 1974-03-13 | 1975-03-12 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3920949A (https=) |
| JP (1) | JPS50127567A (https=) |
| CA (1) | CA1038088A (https=) |
| DE (1) | DE2511058A1 (https=) |
| FR (1) | FR2264456A1 (https=) |
| GB (1) | GB1505357A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
| US4315128A (en) * | 1978-04-07 | 1982-02-09 | Kulicke And Soffa Industries Inc. | Electrically heated bonding tool for the manufacture of semiconductor devices |
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Industrial Co Ltd | Device for mounting electronic part |
| US4295596A (en) * | 1979-12-19 | 1981-10-20 | Western Electric Company, Inc. | Methods and apparatus for bonding an article to a metallized substrate |
| US4320865A (en) * | 1980-03-21 | 1982-03-23 | National Semiconductor Corporation | Apparatus for attachment of die to heat sink |
| US5059559A (en) * | 1987-11-02 | 1991-10-22 | Hitachi, Ltd. | Method of aligning and bonding tab inner leads |
| US7430081B2 (en) * | 2002-02-28 | 2008-09-30 | Emcore Corporation | Sub-micron adjustable mount for supporting a component and method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2179693A (en) * | 1937-10-30 | 1939-11-14 | Gen Motors Corp | Welding electrode |
| US2346088A (en) * | 1943-02-05 | 1944-04-04 | Stackpole Carbon Co | Self-aligning electrode |
| US3384283A (en) * | 1964-10-16 | 1968-05-21 | Axion Corp | Vibratory wire bonding method and apparatus |
| US3466514A (en) * | 1967-06-26 | 1969-09-09 | Ibm | Method and apparatus for positioning objects in preselected orientations |
| US3617682A (en) * | 1969-06-23 | 1971-11-02 | Gen Electric | Semiconductor chip bonder |
| BE757111A (fr) * | 1969-10-07 | 1971-03-16 | Western Electric Co | Procede pour manipuler des dispositifs a micropoutres a un poste d'essai |
| US3696229A (en) * | 1970-04-14 | 1972-10-03 | Thomas L Angelucci | Bonding tool for through the tool observation bonding and method of bonding |
-
1974
- 1974-03-13 US US450563A patent/US3920949A/en not_active Expired - Lifetime
-
1975
- 1975-02-18 CA CA220,375A patent/CA1038088A/en not_active Expired
- 1975-03-10 GB GB9948/75A patent/GB1505357A/en not_active Expired
- 1975-03-12 FR FR7507701A patent/FR2264456A1/fr not_active Withdrawn
- 1975-03-12 JP JP50029995A patent/JPS50127567A/ja active Pending
- 1975-03-13 DE DE19752511058 patent/DE2511058A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3920949A (en) | 1975-11-18 |
| CA1038088A (en) | 1978-09-05 |
| FR2264456A1 (https=) | 1975-10-10 |
| DE2511058A1 (de) | 1975-09-18 |
| GB1505357A (en) | 1978-03-30 |