GB1505357A - Apparatus for welding elements to a substrate - Google Patents

Apparatus for welding elements to a substrate

Info

Publication number
GB1505357A
GB1505357A GB9948/75A GB994875A GB1505357A GB 1505357 A GB1505357 A GB 1505357A GB 9948/75 A GB9948/75 A GB 9948/75A GB 994875 A GB994875 A GB 994875A GB 1505357 A GB1505357 A GB 1505357A
Authority
GB
United Kingdom
Prior art keywords
substrate
platform
base member
welding
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB9948/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Duracell Inc USA
Original Assignee
PR Mallory and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PR Mallory and Co Inc filed Critical PR Mallory and Co Inc
Publication of GB1505357A publication Critical patent/GB1505357A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
GB9948/75A 1974-03-13 1975-03-10 Apparatus for welding elements to a substrate Expired GB1505357A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US450563A US3920949A (en) 1974-03-13 1974-03-13 Beam leaded device welding machine

Publications (1)

Publication Number Publication Date
GB1505357A true GB1505357A (en) 1978-03-30

Family

ID=23788588

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9948/75A Expired GB1505357A (en) 1974-03-13 1975-03-10 Apparatus for welding elements to a substrate

Country Status (6)

Country Link
US (1) US3920949A (https=)
JP (1) JPS50127567A (https=)
CA (1) CA1038088A (https=)
DE (1) DE2511058A1 (https=)
FR (1) FR2264456A1 (https=)
GB (1) GB1505357A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Industrial Co Ltd Device for mounting electronic part
US4295596A (en) * 1979-12-19 1981-10-20 Western Electric Company, Inc. Methods and apparatus for bonding an article to a metallized substrate
US4320865A (en) * 1980-03-21 1982-03-23 National Semiconductor Corporation Apparatus for attachment of die to heat sink
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
US7430081B2 (en) * 2002-02-28 2008-09-30 Emcore Corporation Sub-micron adjustable mount for supporting a component and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179693A (en) * 1937-10-30 1939-11-14 Gen Motors Corp Welding electrode
US2346088A (en) * 1943-02-05 1944-04-04 Stackpole Carbon Co Self-aligning electrode
US3384283A (en) * 1964-10-16 1968-05-21 Axion Corp Vibratory wire bonding method and apparatus
US3466514A (en) * 1967-06-26 1969-09-09 Ibm Method and apparatus for positioning objects in preselected orientations
US3617682A (en) * 1969-06-23 1971-11-02 Gen Electric Semiconductor chip bonder
BE757111A (fr) * 1969-10-07 1971-03-16 Western Electric Co Procede pour manipuler des dispositifs a micropoutres a un poste d'essai
US3696229A (en) * 1970-04-14 1972-10-03 Thomas L Angelucci Bonding tool for through the tool observation bonding and method of bonding

Also Published As

Publication number Publication date
US3920949A (en) 1975-11-18
CA1038088A (en) 1978-09-05
JPS50127567A (https=) 1975-10-07
FR2264456A1 (https=) 1975-10-10
DE2511058A1 (de) 1975-09-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee