DE2313096A1 - Probenhalterung fuer das aetzen von duennen schichten - Google Patents

Probenhalterung fuer das aetzen von duennen schichten

Info

Publication number
DE2313096A1
DE2313096A1 DE2313096A DE2313096A DE2313096A1 DE 2313096 A1 DE2313096 A1 DE 2313096A1 DE 2313096 A DE2313096 A DE 2313096A DE 2313096 A DE2313096 A DE 2313096A DE 2313096 A1 DE2313096 A1 DE 2313096A1
Authority
DE
Germany
Prior art keywords
drive
sample holder
sample
axis
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2313096A
Other languages
German (de)
English (en)
Inventor
Klaus Drews
Jens-Peter Dr Krumme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Original Assignee
Philips Patentverwaltung GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Patentverwaltung GmbH filed Critical Philips Patentverwaltung GmbH
Priority to DE2313096A priority Critical patent/DE2313096A1/de
Priority to GB1143674A priority patent/GB1461464A/en
Priority to JP2927374A priority patent/JPS5536070B2/ja
Priority to FR7409052A priority patent/FR2221815B1/fr
Publication of DE2313096A1 publication Critical patent/DE2313096A1/de
Priority to US05/644,069 priority patent/US3993909A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • ing And Chemical Polishing (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Drying Of Semiconductors (AREA)
DE2313096A 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten Pending DE2313096A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE2313096A DE2313096A1 (de) 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten
GB1143674A GB1461464A (en) 1973-03-16 1974-03-14 Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate
JP2927374A JPS5536070B2 (https=) 1973-03-16 1974-03-15
FR7409052A FR2221815B1 (https=) 1973-03-16 1974-03-18
US05/644,069 US3993909A (en) 1973-03-16 1975-12-24 Substrate holder for etching thin films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2313096A DE2313096A1 (de) 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten

Publications (1)

Publication Number Publication Date
DE2313096A1 true DE2313096A1 (de) 1974-09-26

Family

ID=5874944

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2313096A Pending DE2313096A1 (de) 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten

Country Status (4)

Country Link
JP (1) JPS5536070B2 (https=)
DE (1) DE2313096A1 (https=)
FR (1) FR2221815B1 (https=)
GB (1) GB1461464A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701463A1 (fr) * 1993-02-15 1994-08-19 Gentric Alain Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement.
DE102005021831A1 (de) * 2005-05-11 2006-11-23 Mühlbauer Ag Vorrichtung zum Transportieren von Plättchen
AT510606B1 (de) * 2011-02-09 2012-05-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur probenpräparation

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2316723A1 (fr) * 1975-07-03 1977-01-28 Zaitseva Aita Dispositif d'amenee de pieces en vue de leur traitement par un faisceau d'ions
GB2119236A (en) * 1982-03-26 1983-11-16 Philips Electronic Associated Magazine and disc holders for supporting discs in the magazine
JPS61134378U (https=) * 1985-02-13 1986-08-21

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701463A1 (fr) * 1993-02-15 1994-08-19 Gentric Alain Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement.
EP0612101A1 (fr) * 1993-02-15 1994-08-24 France Telecom Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement
US5400892A (en) * 1993-02-15 1995-03-28 Alain Gentric Selector device for feeding an object such as a substrate to a processing station
DE102005021831A1 (de) * 2005-05-11 2006-11-23 Mühlbauer Ag Vorrichtung zum Transportieren von Plättchen
AT510606B1 (de) * 2011-02-09 2012-05-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur probenpräparation
EP2487479A2 (de) 2011-02-09 2012-08-15 Leica Mikrosysteme GmbH Vorrichtung und Verfahren zur Probenpräparation
EP2487479A3 (de) * 2011-02-09 2017-07-19 Leica Mikrosysteme GmbH Vorrichtung und Verfahren zur Probenpräparation

Also Published As

Publication number Publication date
JPS49127298A (https=) 1974-12-05
FR2221815A1 (https=) 1974-10-11
GB1461464A (en) 1977-01-13
FR2221815B1 (https=) 1978-06-09
JPS5536070B2 (https=) 1980-09-18

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