GB1461464A - Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate - Google Patents
Apparatus for holding a substrate during ion-beam etching of a thin film on the substrateInfo
- Publication number
- GB1461464A GB1461464A GB1143674A GB1143674A GB1461464A GB 1461464 A GB1461464 A GB 1461464A GB 1143674 A GB1143674 A GB 1143674A GB 1143674 A GB1143674 A GB 1143674A GB 1461464 A GB1461464 A GB 1461464A
- Authority
- GB
- United Kingdom
- Prior art keywords
- turntable
- disc
- substrate
- friction disc
- lead screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0421—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- ing And Chemical Polishing (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2313096A DE2313096A1 (de) | 1973-03-16 | 1973-03-16 | Probenhalterung fuer das aetzen von duennen schichten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1461464A true GB1461464A (en) | 1977-01-13 |
Family
ID=5874944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1143674A Expired GB1461464A (en) | 1973-03-16 | 1974-03-14 | Apparatus for holding a substrate during ion-beam etching of a thin film on the substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5536070B2 (https=) |
| DE (1) | DE2313096A1 (https=) |
| FR (1) | FR2221815B1 (https=) |
| GB (1) | GB1461464A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4511194A (en) * | 1982-03-26 | 1985-04-16 | U.S. Philips Corporation | Magazine and disc holders for supporting discs in the magazine |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2316723A1 (fr) * | 1975-07-03 | 1977-01-28 | Zaitseva Aita | Dispositif d'amenee de pieces en vue de leur traitement par un faisceau d'ions |
| JPS61134378U (https=) * | 1985-02-13 | 1986-08-21 | ||
| FR2701463B1 (fr) * | 1993-02-15 | 1995-05-05 | Alain Gentric | Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement. |
| DE102005021831A1 (de) * | 2005-05-11 | 2006-11-23 | Mühlbauer Ag | Vorrichtung zum Transportieren von Plättchen |
| AT510606B1 (de) * | 2011-02-09 | 2012-05-15 | Leica Mikrosysteme Gmbh | Vorrichtung und verfahren zur probenpräparation |
-
1973
- 1973-03-16 DE DE2313096A patent/DE2313096A1/de active Pending
-
1974
- 1974-03-14 GB GB1143674A patent/GB1461464A/en not_active Expired
- 1974-03-15 JP JP2927374A patent/JPS5536070B2/ja not_active Expired
- 1974-03-18 FR FR7409052A patent/FR2221815B1/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4511194A (en) * | 1982-03-26 | 1985-04-16 | U.S. Philips Corporation | Magazine and disc holders for supporting discs in the magazine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49127298A (https=) | 1974-12-05 |
| FR2221815A1 (https=) | 1974-10-11 |
| FR2221815B1 (https=) | 1978-06-09 |
| DE2313096A1 (de) | 1974-09-26 |
| JPS5536070B2 (https=) | 1980-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |