DE2302897A1 - Vorrichtung und verfahren zum orientieren eines halbleiterplaettchens - Google Patents

Vorrichtung und verfahren zum orientieren eines halbleiterplaettchens

Info

Publication number
DE2302897A1
DE2302897A1 DE19732302897 DE2302897A DE2302897A1 DE 2302897 A1 DE2302897 A1 DE 2302897A1 DE 19732302897 DE19732302897 DE 19732302897 DE 2302897 A DE2302897 A DE 2302897A DE 2302897 A1 DE2302897 A1 DE 2302897A1
Authority
DE
Germany
Prior art keywords
plate
orientation
etched
hollow body
orienting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732302897
Other languages
German (de)
English (en)
Inventor
Keith Frederick Pitcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucas Electrical Co Ltd
Original Assignee
Lucas Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Electrical Co Ltd filed Critical Lucas Electrical Co Ltd
Publication of DE2302897A1 publication Critical patent/DE2302897A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005Vacuum work holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19732302897 1972-01-22 1973-01-22 Vorrichtung und verfahren zum orientieren eines halbleiterplaettchens Pending DE2302897A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB315272A GB1405453A (en) 1972-01-22 1972-01-22 Alignment and holding device and method

Publications (1)

Publication Number Publication Date
DE2302897A1 true DE2302897A1 (de) 1973-07-19

Family

ID=9752924

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732302897 Pending DE2302897A1 (de) 1972-01-22 1973-01-22 Vorrichtung und verfahren zum orientieren eines halbleiterplaettchens

Country Status (4)

Country Link
JP (1) JPS5012966A (enrdf_load_stackoverflow)
DE (1) DE2302897A1 (enrdf_load_stackoverflow)
GB (1) GB1405453A (enrdf_load_stackoverflow)
NL (1) NL7300915A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0595071A1 (en) * 1992-10-27 1994-05-04 Sumitomo Electric Industries, Limited Wafer holding apparatus for holding a wafer

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6110761Y2 (enrdf_load_stackoverflow) * 1980-10-31 1986-04-05
JPS61263136A (ja) * 1985-05-15 1986-11-21 Nitto Electric Ind Co Ltd 薄板物品の支持テ−ブル
CN102744697A (zh) * 2012-07-17 2012-10-24 天脊煤化工集团股份有限公司 一种鲁奇炉灰锁上阀导向筒找正装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0595071A1 (en) * 1992-10-27 1994-05-04 Sumitomo Electric Industries, Limited Wafer holding apparatus for holding a wafer
US5417408A (en) * 1992-10-27 1995-05-23 Sumitomo Electric Industries, Ltd. Wafer holding apparatus for holding a wafer

Also Published As

Publication number Publication date
NL7300915A (enrdf_load_stackoverflow) 1973-07-24
GB1405453A (en) 1975-09-10
JPS5012966A (enrdf_load_stackoverflow) 1975-02-10

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