GB1405453A - Alignment and holding device and method - Google Patents

Alignment and holding device and method

Info

Publication number
GB1405453A
GB1405453A GB315272A GB315272A GB1405453A GB 1405453 A GB1405453 A GB 1405453A GB 315272 A GB315272 A GB 315272A GB 315272 A GB315272 A GB 315272A GB 1405453 A GB1405453 A GB 1405453A
Authority
GB
United Kingdom
Prior art keywords
wafer
suction
machine
conduit
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB315272A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucas Electrical Co Ltd
Original Assignee
Lucas Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Electrical Co Ltd filed Critical Lucas Electrical Co Ltd
Priority to GB315272A priority Critical patent/GB1405453A/en
Priority to DE19732302897 priority patent/DE2302897A1/en
Priority to NL7300915A priority patent/NL7300915A/xx
Priority to JP875473A priority patent/JPS5012966A/ja
Publication of GB1405453A publication Critical patent/GB1405453A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Abstract

1405453 Vacuum workholders LUCAS ELECTRICAL CO Ltd 12 Jan 1973 [22 Jan 1972] 3152/72 Heading B3D [Also in Division B5] A device for aligning and holding a semiconductor wafer for a scribing operation comprises a hollow body having two opposed transparent surfaces 3, 4 one of which has a plurality of apertures 5 therethrough and a plurality of alignment marks 6 thereon, and conduit means 8 for enabling a reduced pressure to be produced in the hollow body so that a semi-conductor wafer to be scribed can be releasably attached to the apertured surface, the wafer to be scribed being aligned with the marks by viewing through the body and then attached by applying the reduced pressure. The body consists of an aluminium ring 2 closed at its end by discs 3, 4 of clear acrylic plastics material. The disc 4 is plain and the disc 3 is provided with the apertures 5 and alignment marks 6. An aperture 7 in the ring connects the interior of the body to the conduit 8, and a bore 9 engages a peg on the chuck of the machine to orient the device in the machine. In use, a semi-conductor wafer is held by suction on a plate (not shown) with its etched surface exposed, the etched surface containing a plurality of mesa diodes. The device is placed over the wafer with its apertured surface engaging the etched surface and is aligned therewith by viewing through the body. Suction is then applied through conduit 8 to hold the body against the exposed surface and the suction in the plate released so that the device with the wafer can be mounted in the machine for scribing. In another embodiment, the discs (3, 4) are of quartz glass and a plate replaces the locations hole (9).
GB315272A 1972-01-22 1972-01-22 Alignment and holding device and method Expired GB1405453A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB315272A GB1405453A (en) 1972-01-22 1972-01-22 Alignment and holding device and method
DE19732302897 DE2302897A1 (en) 1972-01-22 1973-01-22 DEVICE AND METHOD FOR ORIENTING A SEMICONDUCTOR PLATE
NL7300915A NL7300915A (en) 1972-01-22 1973-01-22
JP875473A JPS5012966A (en) 1972-01-22 1973-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB315272A GB1405453A (en) 1972-01-22 1972-01-22 Alignment and holding device and method

Publications (1)

Publication Number Publication Date
GB1405453A true GB1405453A (en) 1975-09-10

Family

ID=9752924

Family Applications (1)

Application Number Title Priority Date Filing Date
GB315272A Expired GB1405453A (en) 1972-01-22 1972-01-22 Alignment and holding device and method

Country Status (4)

Country Link
JP (1) JPS5012966A (en)
DE (1) DE2302897A1 (en)
GB (1) GB1405453A (en)
NL (1) NL7300915A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744697A (en) * 2012-07-17 2012-10-24 天脊煤化工集团股份有限公司 Alignment device for ash lock upper valve guide cylinder of Lurgi gasifier

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6110761Y2 (en) * 1980-10-31 1986-04-05
JPS61263136A (en) * 1985-05-15 1986-11-21 Nitto Electric Ind Co Ltd Support table for thin plate article
JPH07110455B2 (en) * 1992-10-27 1995-11-29 住友電気工業株式会社 Wafer fixing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744697A (en) * 2012-07-17 2012-10-24 天脊煤化工集团股份有限公司 Alignment device for ash lock upper valve guide cylinder of Lurgi gasifier

Also Published As

Publication number Publication date
NL7300915A (en) 1973-07-24
JPS5012966A (en) 1975-02-10
DE2302897A1 (en) 1973-07-19

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee