JPS5447483A - Holder of plate form objects - Google Patents
Holder of plate form objectsInfo
- Publication number
- JPS5447483A JPS5447483A JP11261377A JP11261377A JPS5447483A JP S5447483 A JPS5447483 A JP S5447483A JP 11261377 A JP11261377 A JP 11261377A JP 11261377 A JP11261377 A JP 11261377A JP S5447483 A JPS5447483 A JP S5447483A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holding face
- holding
- face
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
PURPOSE: To hold a plate form object by providing a hole for injecting fluid at a desired angle in the center of holding face and providing strip form stoppers directing toward the circumferential edge of the holding face around the hole.
CONSTITUTION: Fluid is supplied in the tube 15 provided on the back of a holding part 11 and is injected through a hole 14. The hole 14 is in the central part of a holding face 13 and assumes a desired angle to the face 13. On the other hand, strip form stoppers 16 such as of rubber, etc. are provided toward the circumferential edge. When this holder is positoned over a wafer or the like and air or other is spouted thorugh the hole 14, a negative pressure is produced on the holding face, by which the wafer is sucked without any damage. Hence, when this is utilized for rotary dicing operation, direct contact with the substrate may be averted in all handlings, thus damages reduce and working apeed becaomes constant
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11261377A JPS5447483A (en) | 1977-09-21 | 1977-09-21 | Holder of plate form objects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11261377A JPS5447483A (en) | 1977-09-21 | 1977-09-21 | Holder of plate form objects |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5447483A true JPS5447483A (en) | 1979-04-14 |
Family
ID=14591108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11261377A Pending JPS5447483A (en) | 1977-09-21 | 1977-09-21 | Holder of plate form objects |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5447483A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60124836A (en) * | 1983-12-09 | 1985-07-03 | Nec Corp | Manufacture of semiconductor integrated circuit device |
| JPS61254437A (en) * | 1985-04-27 | 1986-11-12 | Fujitsu Ltd | Wafer chuck |
| JPS638135A (en) * | 1986-06-30 | 1988-01-13 | Nippon Denso Co Ltd | Chuck device |
| JP2005150528A (en) * | 2003-11-18 | 2005-06-09 | Disco Abrasive Syst Ltd | Grinding apparatus |
| WO2022158486A1 (en) * | 2021-01-22 | 2022-07-28 | 株式会社コガネイ | Contactless conveyance device |
| TWI836454B (en) * | 2021-05-31 | 2024-03-21 | 日商雷恩自動機股份有限公司 | Dough transfer device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137575A (en) * | 1974-09-27 | 1976-03-29 | Hitachi Ltd | BERUNUUI CHATSUKU |
| JPS5226159A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Wafer carrying method |
-
1977
- 1977-09-21 JP JP11261377A patent/JPS5447483A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137575A (en) * | 1974-09-27 | 1976-03-29 | Hitachi Ltd | BERUNUUI CHATSUKU |
| JPS5226159A (en) * | 1975-08-25 | 1977-02-26 | Hitachi Ltd | Wafer carrying method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60124836A (en) * | 1983-12-09 | 1985-07-03 | Nec Corp | Manufacture of semiconductor integrated circuit device |
| JPS61254437A (en) * | 1985-04-27 | 1986-11-12 | Fujitsu Ltd | Wafer chuck |
| JPS6233182B2 (en) * | 1985-04-27 | 1987-07-20 | Fujitsu Ltd | |
| JPS638135A (en) * | 1986-06-30 | 1988-01-13 | Nippon Denso Co Ltd | Chuck device |
| JP2005150528A (en) * | 2003-11-18 | 2005-06-09 | Disco Abrasive Syst Ltd | Grinding apparatus |
| WO2022158486A1 (en) * | 2021-01-22 | 2022-07-28 | 株式会社コガネイ | Contactless conveyance device |
| TWI836454B (en) * | 2021-05-31 | 2024-03-21 | 日商雷恩自動機股份有限公司 | Dough transfer device |
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