DE2260217A1 - Halbleitervorrichtung mit hoher leistung - Google Patents

Halbleitervorrichtung mit hoher leistung

Info

Publication number
DE2260217A1
DE2260217A1 DE2260217A DE2260217A DE2260217A1 DE 2260217 A1 DE2260217 A1 DE 2260217A1 DE 2260217 A DE2260217 A DE 2260217A DE 2260217 A DE2260217 A DE 2260217A DE 2260217 A1 DE2260217 A1 DE 2260217A1
Authority
DE
Germany
Prior art keywords
semiconductor device
contacts
semiconductor element
electrodes
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2260217A
Other languages
German (de)
English (en)
Inventor
Jean Marie Gensous
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Original Assignee
Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM filed Critical Societe Europeenne de Semi Conducteurs de Microelectronique SA SESCOSEM
Publication of DE2260217A1 publication Critical patent/DE2260217A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
DE2260217A 1971-12-08 1972-12-08 Halbleitervorrichtung mit hoher leistung Pending DE2260217A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7144032A FR2162275A1 (en) 1971-12-08 1971-12-08 Encapsulated high power semiconductor - with improved heat dissipation

Publications (1)

Publication Number Publication Date
DE2260217A1 true DE2260217A1 (de) 1973-06-14

Family

ID=9087133

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2260217A Pending DE2260217A1 (de) 1971-12-08 1972-12-08 Halbleitervorrichtung mit hoher leistung

Country Status (3)

Country Link
DE (1) DE2260217A1 (OSRAM)
FR (1) FR2162275A1 (OSRAM)
IT (1) IT971532B (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188637A (en) * 1976-07-06 1980-02-12 Licentia Patent-Verwaltungs-G.M.B.H. Disc-shaped semiconductor device having an annular housing of elastomer material
DE3113850A1 (de) * 1980-04-07 1982-01-14 Hitachi, Ltd., Tokyo Halbleiteranordnung
DE3405786A1 (de) * 1983-09-13 1985-04-04 Honda Giken Kogyo K.K., Tokio/Tokyo Transformator mit gleichrichter

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316534B (OSRAM) * 1965-07-09 1969-10-27 Asea Ab
GB1189062A (en) * 1967-03-23 1970-04-22 Motorola Inc Semiconductor Rectifier Assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188637A (en) * 1976-07-06 1980-02-12 Licentia Patent-Verwaltungs-G.M.B.H. Disc-shaped semiconductor device having an annular housing of elastomer material
DE3113850A1 (de) * 1980-04-07 1982-01-14 Hitachi, Ltd., Tokyo Halbleiteranordnung
DE3405786A1 (de) * 1983-09-13 1985-04-04 Honda Giken Kogyo K.K., Tokio/Tokyo Transformator mit gleichrichter

Also Published As

Publication number Publication date
FR2162275A1 (en) 1973-07-20
FR2162275B1 (OSRAM) 1974-06-07
IT971532B (it) 1974-05-10

Similar Documents

Publication Publication Date Title
DE10100620B4 (de) Leistungsmodul
DE2542518C3 (OSRAM)
DE102006009021B4 (de) Halbleiterbauelement mit Elektrodenteil
DE102017209770A1 (de) Leistungsmodul mit doppelseitiger Kühlung
DE1439742A1 (de) Sonnenzellenanordnung
DE2845022A1 (de) Elektronisches schaltungsbauelement
DE2021943A1 (de) Elektrisches Bauteil mit planarer Anschlusselektrode
DE112019005313T5 (de) Halbleiterbauteil
DE1962003A1 (de) Halbleiteranordnung mit Waermeableitung
DE112016006908B4 (de) Leistungshalbleitervorrichtung
DE2248303A1 (de) Halbleiterbauelement
DE1915501C3 (de) Verfahren zum Verbinden einer integrierten Schaltung mit äußeren elektrischen Zuleitungen
DE3604074A1 (de) Zuendschaltgeraet
DE102019124593A1 (de) Kühlsystem
DE1564107A1 (de) Gekapselte Halbleiteranordnung
DE2260217A1 (de) Halbleitervorrichtung mit hoher leistung
DE1764013A1 (de) Halbleiterbauelement
DE69634816T2 (de) Methode zur herstellung eines halbleiterbauteils für oberflächenmontage, geeignet für vergleichsweise hohe spannungen und ein solches halbleiterbauteil
DE3113850C2 (de) Halbleiterbauelement
DE2165143C3 (de) Elektrodenanordnung für einen stabförmigen, piezoelektrischen Biegungsschwinger
DE112016007133T5 (de) Halbleitervorrichtung
DE3931634A1 (de) Halbleiterbauelement
DE2525390A1 (de) Steuerbares halbleiterbauelement
DE1283969B (de) Halbleiterbauelement mit elektrisch isolierendem Zwischenkoerper zwischen dem Halbleiterkoerper und einem Gehaeuseteil, sowie Verfahren zu seiner Herstellung
EP0313555B1 (de) Stapelförmige diodenanordnung mit hoher spannungsfestigkeit