FR2162275B1 - - Google Patents
Info
- Publication number
- FR2162275B1 FR2162275B1 FR7144032A FR7144032A FR2162275B1 FR 2162275 B1 FR2162275 B1 FR 2162275B1 FR 7144032 A FR7144032 A FR 7144032A FR 7144032 A FR7144032 A FR 7144032A FR 2162275 B1 FR2162275 B1 FR 2162275B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7144032A FR2162275A1 (en) | 1971-12-08 | 1971-12-08 | Encapsulated high power semiconductor - with improved heat dissipation |
| IT32475/72A IT971532B (it) | 1971-12-08 | 1972-12-05 | Perfezionamenti ai dispositivi semiconduttori |
| DE2260217A DE2260217A1 (de) | 1971-12-08 | 1972-12-08 | Halbleitervorrichtung mit hoher leistung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7144032A FR2162275A1 (en) | 1971-12-08 | 1971-12-08 | Encapsulated high power semiconductor - with improved heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2162275A1 FR2162275A1 (en) | 1973-07-20 |
| FR2162275B1 true FR2162275B1 (OSRAM) | 1974-06-07 |
Family
ID=9087133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7144032A Granted FR2162275A1 (en) | 1971-12-08 | 1971-12-08 | Encapsulated high power semiconductor - with improved heat dissipation |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2260217A1 (OSRAM) |
| FR (1) | FR2162275A1 (OSRAM) |
| IT (1) | IT971532B (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2630320A1 (de) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse |
| JPS56142645A (en) * | 1980-04-07 | 1981-11-07 | Hitachi Ltd | Semiconductor device |
| JPS6060172U (ja) * | 1983-09-13 | 1985-04-26 | 本田技研工業株式会社 | 整流器付トランス装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE316534B (OSRAM) * | 1965-07-09 | 1969-10-27 | Asea Ab | |
| GB1189062A (en) * | 1967-03-23 | 1970-04-22 | Motorola Inc | Semiconductor Rectifier Assembly |
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1971
- 1971-12-08 FR FR7144032A patent/FR2162275A1/fr active Granted
-
1972
- 1972-12-05 IT IT32475/72A patent/IT971532B/it active
- 1972-12-08 DE DE2260217A patent/DE2260217A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2260217A1 (de) | 1973-06-14 |
| FR2162275A1 (en) | 1973-07-20 |
| IT971532B (it) | 1974-05-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |