DE225569C - - Google Patents
Info
- Publication number
- DE225569C DE225569C DENDAT225569D DE225569DA DE225569C DE 225569 C DE225569 C DE 225569C DE NDAT225569 D DENDAT225569 D DE NDAT225569D DE 225569D A DE225569D A DE 225569DA DE 225569 C DE225569 C DE 225569C
- Authority
- DE
- Germany
- Prior art keywords
- mica
- split
- splitting
- piece
- bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010445 mica Substances 0.000 claims description 24
- 229910052618 mica group Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 7
- 238000003776 cleavage reaction Methods 0.000 claims description 2
- 230000007017 scission Effects 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 3
- 241001664469 Tibicina haematodes Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/32—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist
- B28D1/322—Splitting of the working materials
Landscapes
- Engineering & Computer Science (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE225569C true DE225569C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family
ID=486197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DENDAT225569D Active DE225569C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE225569C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3110299A (en) * | 1959-05-04 | 1963-11-12 | Gen Electric | Treatment of laminated material |
| FR2785217A1 (fr) * | 1998-10-30 | 2000-05-05 | Soitec Silicon On Insulator | Procede et dispositif pour separer en deux tranches une plaque de materiau notamment semi-conducteur |
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0
- DE DENDAT225569D patent/DE225569C/de active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3110299A (en) * | 1959-05-04 | 1963-11-12 | Gen Electric | Treatment of laminated material |
| FR2785217A1 (fr) * | 1998-10-30 | 2000-05-05 | Soitec Silicon On Insulator | Procede et dispositif pour separer en deux tranches une plaque de materiau notamment semi-conducteur |
| WO2000026000A1 (fr) * | 1998-10-30 | 2000-05-11 | S.O.I.Tec Silicon On Insulator Technologies | Procede et dispositif pour separer en deux tranches une plaque de materiau notamment semi-conducteur |
| US6468879B1 (en) | 1998-10-30 | 2002-10-22 | S.O.I. Tec Silicon On Insulator Technologies | Method and device for separating a plate of material, in particular semiconductor material, into two wafers |