DE2228523A1 - Verbindungsanordnung und verfahren zu ihrer herstellung - Google Patents
Verbindungsanordnung und verfahren zu ihrer herstellungInfo
- Publication number
- DE2228523A1 DE2228523A1 DE19722228523 DE2228523A DE2228523A1 DE 2228523 A1 DE2228523 A1 DE 2228523A1 DE 19722228523 DE19722228523 DE 19722228523 DE 2228523 A DE2228523 A DE 2228523A DE 2228523 A1 DE2228523 A1 DE 2228523A1
- Authority
- DE
- Germany
- Prior art keywords
- support plate
- line
- openings
- pieces
- line pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims description 51
- 239000004020 conductor Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 15
- 238000004382 potting Methods 0.000 claims description 14
- 239000003566 sealing material Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 description 23
- 230000003287 optical effect Effects 0.000 description 16
- 239000011159 matrix material Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000004377 microelectronic Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000005553 drilling Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000009969 flowable effect Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004873 anchoring Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 244000059549 Borneo rubber Species 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
- G02B6/3612—Wiring methods or machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Package Frames And Binding Bands (AREA)
- Materials For Medical Uses (AREA)
- Optical Couplings Of Light Guides (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15214071A | 1971-06-11 | 1971-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2228523A1 true DE2228523A1 (de) | 1973-01-04 |
Family
ID=22541667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19722228523 Pending DE2228523A1 (de) | 1971-06-11 | 1972-06-12 | Verbindungsanordnung und verfahren zu ihrer herstellung |
Country Status (12)
| Country | Link |
|---|---|
| AT (1) | AT332480B (enExample) |
| BE (1) | BE784702A (enExample) |
| BR (1) | BR7203728D0 (enExample) |
| CA (1) | CA991755A (enExample) |
| DE (1) | DE2228523A1 (enExample) |
| ES (2) | ES403731A1 (enExample) |
| FR (1) | FR2140666B1 (enExample) |
| GB (1) | GB1358353A (enExample) |
| HK (1) | HK22679A (enExample) |
| IT (1) | IT956367B (enExample) |
| NL (1) | NL7207635A (enExample) |
| SE (1) | SE374232B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017210979A1 (de) * | 2017-06-28 | 2019-01-03 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung eines elektrischen Bauteils und elektrisches Bauteil |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312631A1 (de) * | 1987-10-21 | 1989-04-26 | PRESSKONTAKT Ing. grad. Hartmuth Thaler KG | Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten |
| CA1314065C (en) * | 1987-12-02 | 1993-03-02 | Andre P. Crane | In-line connector |
| EP2991460B1 (en) * | 2014-08-29 | 2018-11-21 | Nokia Technologies OY | An apparatus and associated methods for deformable electronics |
-
1972
- 1972-05-26 GB GB2491372A patent/GB1358353A/en not_active Expired
- 1972-05-30 CA CA143,472A patent/CA991755A/en not_active Expired
- 1972-06-06 NL NL7207635A patent/NL7207635A/xx not_active Application Discontinuation
- 1972-06-08 IT IT2541572A patent/IT956367B/it active
- 1972-06-09 BR BR372872A patent/BR7203728D0/pt unknown
- 1972-06-09 FR FR7220967A patent/FR2140666B1/fr not_active Expired
- 1972-06-09 BE BE784702A patent/BE784702A/xx unknown
- 1972-06-10 ES ES403731A patent/ES403731A1/es not_active Expired
- 1972-06-12 AT AT505272A patent/AT332480B/de active
- 1972-06-12 DE DE19722228523 patent/DE2228523A1/de active Pending
- 1972-06-12 SE SE770472A patent/SE374232B/xx unknown
-
1974
- 1974-10-28 ES ES431420A patent/ES431420A1/es not_active Expired
-
1979
- 1979-03-29 HK HK22679A patent/HK22679A/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017210979A1 (de) * | 2017-06-28 | 2019-01-03 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung eines elektrischen Bauteils und elektrisches Bauteil |
| DE102017210979B4 (de) * | 2017-06-28 | 2024-02-15 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung eines elektrischen Bauteils und elektrisches Bauteil |
Also Published As
| Publication number | Publication date |
|---|---|
| BR7203728D0 (pt) | 1973-08-09 |
| AT332480B (de) | 1976-09-27 |
| ATA505272A (de) | 1976-01-15 |
| FR2140666B1 (enExample) | 1979-06-15 |
| IT956367B (it) | 1973-10-10 |
| ES403731A1 (es) | 1975-11-16 |
| FR2140666A1 (enExample) | 1973-01-19 |
| GB1358353A (en) | 1974-07-03 |
| HK22679A (en) | 1979-04-06 |
| CA991755A (en) | 1976-06-22 |
| ES431420A1 (es) | 1976-11-01 |
| SE374232B (enExample) | 1975-02-24 |
| NL7207635A (enExample) | 1972-12-13 |
| BE784702A (fr) | 1972-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHA | Expiration of time for request for examination |