AT332480B - Punkt-zu-punkt-verbindungssystem und verfahren zu seiner herstellung - Google Patents

Punkt-zu-punkt-verbindungssystem und verfahren zu seiner herstellung

Info

Publication number
AT332480B
AT332480B AT505272A AT505272A AT332480B AT 332480 B AT332480 B AT 332480B AT 505272 A AT505272 A AT 505272A AT 505272 A AT505272 A AT 505272A AT 332480 B AT332480 B AT 332480B
Authority
AT
Austria
Prior art keywords
point
production
connection system
point connection
connection
Prior art date
Application number
AT505272A
Other languages
English (en)
Other versions
ATA505272A (de
Inventor
Sr R C Swengel
T A Lemke
F P Villiard
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Publication of ATA505272A publication Critical patent/ATA505272A/de
Application granted granted Critical
Publication of AT332480B publication Critical patent/AT332480B/de

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3608Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • G02B6/3612Wiring methods or machines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3644Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09609Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10977Encapsulated connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials For Medical Uses (AREA)
  • Combinations Of Printed Boards (AREA)
  • Package Frames And Binding Bands (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Optical Couplings Of Light Guides (AREA)
AT505272A 1971-06-11 1972-06-12 Punkt-zu-punkt-verbindungssystem und verfahren zu seiner herstellung AT332480B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15214071A 1971-06-11 1971-06-11

Publications (2)

Publication Number Publication Date
ATA505272A ATA505272A (de) 1976-01-15
AT332480B true AT332480B (de) 1976-09-27

Family

ID=22541667

Family Applications (1)

Application Number Title Priority Date Filing Date
AT505272A AT332480B (de) 1971-06-11 1972-06-12 Punkt-zu-punkt-verbindungssystem und verfahren zu seiner herstellung

Country Status (12)

Country Link
AT (1) AT332480B (de)
BE (1) BE784702A (de)
BR (1) BR7203728D0 (de)
CA (1) CA991755A (de)
DE (1) DE2228523A1 (de)
ES (2) ES403731A1 (de)
FR (1) FR2140666B1 (de)
GB (1) GB1358353A (de)
HK (1) HK22679A (de)
IT (1) IT956367B (de)
NL (1) NL7207635A (de)
SE (1) SE374232B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312631A1 (de) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten
CA1314065C (en) * 1987-12-02 1993-03-02 Andre P. Crane In-line connector
EP2991460B1 (de) * 2014-08-29 2018-11-21 Nokia Technologies OY Vorrichtung und zugehörige Verfahren für verformbare Elektronik
DE102017210979B4 (de) * 2017-06-28 2024-02-15 Vitesco Technologies Germany Gmbh Verfahren zur Herstellung eines elektrischen Bauteils und elektrisches Bauteil

Also Published As

Publication number Publication date
ATA505272A (de) 1976-01-15
ES403731A1 (es) 1975-11-16
IT956367B (it) 1973-10-10
DE2228523A1 (de) 1973-01-04
CA991755A (en) 1976-06-22
BR7203728D0 (pt) 1973-08-09
FR2140666A1 (de) 1973-01-19
GB1358353A (en) 1974-07-03
NL7207635A (de) 1972-12-13
HK22679A (en) 1979-04-06
BE784702A (fr) 1972-12-11
FR2140666B1 (de) 1979-06-15
SE374232B (de) 1975-02-24
ES431420A1 (es) 1976-11-01

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