GB1358353A - Interconnection assembly - Google Patents
Interconnection assemblyInfo
- Publication number
- GB1358353A GB1358353A GB2491372A GB2491372A GB1358353A GB 1358353 A GB1358353 A GB 1358353A GB 2491372 A GB2491372 A GB 2491372A GB 2491372 A GB2491372 A GB 2491372A GB 1358353 A GB1358353 A GB 1358353A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- apertures
- substrate
- wires
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
- G02B6/3612—Wiring methods or machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Package Frames And Binding Bands (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Materials For Medical Uses (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15214071A | 1971-06-11 | 1971-06-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1358353A true GB1358353A (en) | 1974-07-03 |
Family
ID=22541667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2491372A Expired GB1358353A (en) | 1971-06-11 | 1972-05-26 | Interconnection assembly |
Country Status (12)
Country | Link |
---|---|
AT (1) | AT332480B (de) |
BE (1) | BE784702A (de) |
BR (1) | BR7203728D0 (de) |
CA (1) | CA991755A (de) |
DE (1) | DE2228523A1 (de) |
ES (2) | ES403731A1 (de) |
FR (1) | FR2140666B1 (de) |
GB (1) | GB1358353A (de) |
HK (1) | HK22679A (de) |
IT (1) | IT956367B (de) |
NL (1) | NL7207635A (de) |
SE (1) | SE374232B (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2213224A (en) * | 1987-12-02 | 1989-08-09 | Aeci Ltd | Push-fit connector for tubes |
EP2991460A1 (de) * | 2014-08-29 | 2016-03-02 | Nokia Technologies OY | Vorrichtung und zugehörige Verfahren für verformbare Elektronik |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0312631A1 (de) * | 1987-10-21 | 1989-04-26 | PRESSKONTAKT Ing. grad. Hartmuth Thaler KG | Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten |
DE102017210979B4 (de) * | 2017-06-28 | 2024-02-15 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung eines elektrischen Bauteils und elektrisches Bauteil |
-
1972
- 1972-05-26 GB GB2491372A patent/GB1358353A/en not_active Expired
- 1972-05-30 CA CA143,472A patent/CA991755A/en not_active Expired
- 1972-06-06 NL NL7207635A patent/NL7207635A/xx not_active Application Discontinuation
- 1972-06-08 IT IT2541572A patent/IT956367B/it active
- 1972-06-09 BR BR372872A patent/BR7203728D0/pt unknown
- 1972-06-09 FR FR7220967A patent/FR2140666B1/fr not_active Expired
- 1972-06-09 BE BE784702A patent/BE784702A/xx unknown
- 1972-06-10 ES ES403731A patent/ES403731A1/es not_active Expired
- 1972-06-12 AT AT505272A patent/AT332480B/de active
- 1972-06-12 SE SE770472A patent/SE374232B/xx unknown
- 1972-06-12 DE DE19722228523 patent/DE2228523A1/de active Pending
-
1974
- 1974-10-28 ES ES431420A patent/ES431420A1/es not_active Expired
-
1979
- 1979-03-29 HK HK22679A patent/HK22679A/xx unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2213224A (en) * | 1987-12-02 | 1989-08-09 | Aeci Ltd | Push-fit connector for tubes |
EP2991460A1 (de) * | 2014-08-29 | 2016-03-02 | Nokia Technologies OY | Vorrichtung und zugehörige Verfahren für verformbare Elektronik |
WO2016030578A3 (en) * | 2014-08-29 | 2016-05-06 | Nokia Technologies Oy | An apparatus and associated methods for deformable electronics |
US10321563B2 (en) | 2014-08-29 | 2019-06-11 | Nokia Technologies Oy | Apparatus and associated methods for deformable electronics |
Also Published As
Publication number | Publication date |
---|---|
FR2140666A1 (de) | 1973-01-19 |
BE784702A (fr) | 1972-12-11 |
CA991755A (en) | 1976-06-22 |
ES403731A1 (es) | 1975-11-16 |
DE2228523A1 (de) | 1973-01-04 |
ES431420A1 (es) | 1976-11-01 |
FR2140666B1 (de) | 1979-06-15 |
AT332480B (de) | 1976-09-27 |
BR7203728D0 (pt) | 1973-08-09 |
HK22679A (en) | 1979-04-06 |
NL7207635A (de) | 1972-12-13 |
SE374232B (de) | 1975-02-24 |
ATA505272A (de) | 1976-01-15 |
IT956367B (it) | 1973-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |