KR910005073A - 도전성 금속피복을 보유하는 광섬유케이블과 그 제조방법 - Google Patents

도전성 금속피복을 보유하는 광섬유케이블과 그 제조방법 Download PDF

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KR910005073A
KR910005073A KR1019900013550A KR900013550A KR910005073A KR 910005073 A KR910005073 A KR 910005073A KR 1019900013550 A KR1019900013550 A KR 1019900013550A KR 900013550 A KR900013550 A KR 900013550A KR 910005073 A KR910005073 A KR 910005073A
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coating
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optical fiber
carbon
conductive metal
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아끼라 마쓰다
아끼라 이이노
료오도모 시라가와
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도모마쓰 겐고
후루가와 덴기 고오교오 가부시기가이샤
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/104—Coating to obtain optical fibres
    • C03C25/106—Single coatings
    • C03C25/1061—Inorganic coatings
    • C03C25/1062—Carbon
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/104—Coating to obtain optical fibres
    • C03C25/106—Single coatings
    • C03C25/1061—Inorganic coatings
    • C03C25/1063—Metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/343—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one DLC or an amorphous carbon based layer, the layer being doped or not
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S65/00—Glass manufacturing
    • Y10S65/15—Nonoxygen containing chalogenides
    • Y10S65/16—Optical filament or fiber treatment with fluorine or incorporating fluorine in final product

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  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)

Abstract

내용 없음.

Description

도전성 금속피복을 보유하는 광섬유케이블과 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 광섬유케이블 제조방법의 제1실시예로서 광섬유에 케이블피복을 형성하는 장치의 개략단면도.
제7도는 본 발명에 의한 광섬유케이블 제조방법의 제2실시예로서 광섬유에 케이블피복을 형성하는 장치의 개략단면도.
제10도는 본 발명에 의한 광섬유케이블 제조방법의 제3실시예로서 광섬유에 케이블피복을 형성하는 장치의 단면도.

Claims (17)

  1. 심신(11)과 클래드(12)로 이루어진 석영유리 광서유(3), 전기한 광섬유의 외면에 형성된 카아본피복(14)과 전기한 카아본 피복의 외면에 형성된 도전성금속피복을 구비하는 것을 특징으로 하는 광섬유케이블 .
  2. 제1항에 있어서, 전기한 도전성피복은 전기한 카아본피복(14)과 밀착성이 양호한 도전성금속인 것을 특징으로 하는 광섬유케이블.
  3. 제2항에 있어서, 전기한 도전성피복은 Ni로 이루어진 것을 특징으로 하는 광섬유케이블.
  4. 제3항에 있어서, 전기한 Ni피복(15)위에 전기저항치가 작은 도전성금속피복이 형성된 것을 특징으로 하는 광섬유케이블.
  5. 제2항에 있어서, 전기한 도전성피복을 Cu로 이루어진 것을 특징으로 하는 광섬유 케이블.
  6. 제1항에 있어서, 전기한 도전성피복은 A1로 이루어진 것을 특징으로 하는 광섬유 케이블.
  7. 제1항에 있어서, 전기한 카아본피복(14)은 비결정성카아본상태로 형성된 것을 특징으로 하는 광섬유케이블.
  8. 심선(11) 및 클래드(12)로 이루어진 석영유리광섬유(3)의 외면에 카아본피복(14)을 형성하는 공정과, 전기한 카아본피복(14)위에 도전성금속피복을 형성하는 공정으로 이루어진 것을 광섬유케이블제조방법.
  9. 제8항에 있어서, 전기한 도전성금속피복의 형성공정은 무전해도금법에 의해 수행되는 것을 특징으로 하는 광섬유케이블 제조방법.
  10. 제8항에 있어서, 전기한 도전성금속피복의 형성공정은, 무전해도금법에 의해 전기한 카아본피복(14)위에 금속피복을 형성하는 공정과, 전해도금법에 의해 전기한 금속피복위에 전기저항치가 작은 도전성금속 피복을 형성하는 공정으로 이루어진 것을 특징으로 하는 광섬유케이블 제조방법.
  11. 제10항에 있어서, 전기한 무전해도금법으로 전기한 금속피복을 형성하는 공정은, 전기한 카아본피복(14)과 밀착성이 양호한 제1금속층을 형성하는 공정과, 전해도금법에 의해 전기한 도전성속 피복과 밀착성이 양호한 제2금속층을 형성하는 공정으로 이루어진 것을 특징으로 하는 광섬유케이블 제조방법.
  12. 제10항에 있어서, 전기한 도전성금속피복을 형성하는 공정은, 무전해도금법에 의해 전기한 카아본피복(14)위에 전기한 카아본피복과 밀착성이 양호한 제1금속층을 형성하는 공정과, 전기한 제1금속층위에 전기한 제1금속층과의 밀착성이 양호한 제2금속층을 전해도금법으로 형성하는 공정과, 전기한 제2금속층위에 전기저항치가 작은 도전성금속피복을 전해도금법으로 형성하는 공정으로 이루어진 것을 특징으로 하는 광섬유케이블 제조방법.
  13. 제9항에 있어서, 전기한 도전성금속피복을 형성하는 공정은, 전기한 카아본피복(14)위에 전기한 카아본피복과의 밀착성이 양호한 금속층을 무전해도금법으로 형성하는 공정과, 전기한 금속층위에 스퍼터링법에 의해 도전성금속피복을 형성하는 공정으로 이루어진 것을 특징으로 하는 광성유케이블 제조방법.
  14. 제9항에 있어서, 전기한 도전성금속피복을 형성하는 공정은, 전기한 카아본피복(14)위에 전기한 카아본피복과의 밀착성이 양호한 금속층을 무전해도금법으로 형성하는 공정과, 전기한 금속층위에 금속증착법에 의해 도전성금속피복을 형성하는 공정으로 이루어진 것을 특징으로 하는 광성유케이블 제조방법.
  15. 제8항에 있어서, 전기한 도전성금속피복을 전기한 카아본피복(14)위에 형성하는 공정을 스퍼터링법에 의해 수행되는 것을 특징으로 하는 광섬유케이블 제조방법.
  16. 제8항에 있어서, 전기한 도전성금속피복을 전기한 카아본피복(14)위에 형성하는 공정은 금속증착법에 의해 수행되는 것을 특징으로 하는 광섬유케이블 제조방법.
  17. 제8항에 있어서, 전기한 카아본피복을 형성하는 공정은 비결정성카아본 피복을 형성하기 위해 수행되는 것을 특징으로 하는 광섬유케이블 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900013550A 1989-08-30 1990-08-30 도전성 금속피복을 보유하는 광섬유케이블과 그 제조방법 KR930001534B1 (ko)

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JP1-221832 1989-08-30
JP221832 1989-08-30
JP1221832A JP2567951B2 (ja) 1989-08-30 1989-08-30 金属被覆光ファイバの製造方法

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KR930001534B1 KR930001534B1 (ko) 1993-03-04

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Publication number Publication date
JPH0388747A (ja) 1991-04-15
KR930001534B1 (ko) 1993-03-04
CA2024266C (en) 1998-12-29
CA2024266A1 (en) 1991-03-01
US5093880A (en) 1992-03-03
JP2567951B2 (ja) 1996-12-25
EP0419882B1 (en) 1994-05-18
EP0419882A1 (en) 1991-04-03
DE69008981D1 (de) 1994-06-23
DE69008981T2 (de) 1994-12-01

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