GB1358353A - Interconnection assembly - Google Patents

Interconnection assembly

Info

Publication number
GB1358353A
GB1358353A GB2491372A GB2491372A GB1358353A GB 1358353 A GB1358353 A GB 1358353A GB 2491372 A GB2491372 A GB 2491372A GB 2491372 A GB2491372 A GB 2491372A GB 1358353 A GB1358353 A GB 1358353A
Authority
GB
United Kingdom
Prior art keywords
conductors
apertures
substrate
wires
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2491372A
Other languages
English (en)
Inventor
Sr R C Swengel
T A Lemke
F P Villiard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of GB1358353A publication Critical patent/GB1358353A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • G02B6/3612—Wiring methods or machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Package Frames And Binding Bands (AREA)
  • Materials For Medical Uses (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
GB2491372A 1971-06-11 1972-05-26 Interconnection assembly Expired GB1358353A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15214071A 1971-06-11 1971-06-11

Publications (1)

Publication Number Publication Date
GB1358353A true GB1358353A (en) 1974-07-03

Family

ID=22541667

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2491372A Expired GB1358353A (en) 1971-06-11 1972-05-26 Interconnection assembly

Country Status (12)

Country Link
AT (1) AT332480B (enExample)
BE (1) BE784702A (enExample)
BR (1) BR7203728D0 (enExample)
CA (1) CA991755A (enExample)
DE (1) DE2228523A1 (enExample)
ES (2) ES403731A1 (enExample)
FR (1) FR2140666B1 (enExample)
GB (1) GB1358353A (enExample)
HK (1) HK22679A (enExample)
IT (1) IT956367B (enExample)
NL (1) NL7207635A (enExample)
SE (1) SE374232B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2213224A (en) * 1987-12-02 1989-08-09 Aeci Ltd Push-fit connector for tubes
EP2991460A1 (en) * 2014-08-29 2016-03-02 Nokia Technologies OY An apparatus and associated methods for deformable electronics

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312631A1 (de) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten
DE102017210979B4 (de) * 2017-06-28 2024-02-15 Vitesco Technologies Germany Gmbh Verfahren zur Herstellung eines elektrischen Bauteils und elektrisches Bauteil

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2213224A (en) * 1987-12-02 1989-08-09 Aeci Ltd Push-fit connector for tubes
EP2991460A1 (en) * 2014-08-29 2016-03-02 Nokia Technologies OY An apparatus and associated methods for deformable electronics
WO2016030578A3 (en) * 2014-08-29 2016-05-06 Nokia Technologies Oy An apparatus and associated methods for deformable electronics
US10321563B2 (en) 2014-08-29 2019-06-11 Nokia Technologies Oy Apparatus and associated methods for deformable electronics

Also Published As

Publication number Publication date
BR7203728D0 (pt) 1973-08-09
DE2228523A1 (de) 1973-01-04
AT332480B (de) 1976-09-27
ATA505272A (de) 1976-01-15
FR2140666B1 (enExample) 1979-06-15
IT956367B (it) 1973-10-10
ES403731A1 (es) 1975-11-16
FR2140666A1 (enExample) 1973-01-19
HK22679A (en) 1979-04-06
CA991755A (en) 1976-06-22
ES431420A1 (es) 1976-11-01
SE374232B (enExample) 1975-02-24
NL7207635A (enExample) 1972-12-13
BE784702A (fr) 1972-12-11

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee