DE2212168C2 - Monolithisch integrierte Halbleiteranordnung - Google Patents
Monolithisch integrierte HalbleiteranordnungInfo
- Publication number
- DE2212168C2 DE2212168C2 DE2212168A DE2212168A DE2212168C2 DE 2212168 C2 DE2212168 C2 DE 2212168C2 DE 2212168 A DE2212168 A DE 2212168A DE 2212168 A DE2212168 A DE 2212168A DE 2212168 C2 DE2212168 C2 DE 2212168C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- transistor
- semiconductor
- collector
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 48
- 239000000758 substrate Substances 0.000 claims description 11
- 238000005468 ion implantation Methods 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000002955 isolation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
- H01L29/7327—Inverse vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
- H01L27/0233—Integrated injection logic structures [I2L]
- H01L27/0237—Integrated injection logic structures [I2L] using vertical injector structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
- H03K19/082—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using bipolar transistors
- H03K19/091—Integrated injection logic or merged transistor logic
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
- H03K19/098—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using thyristors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/037—Diffusion-deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Computing Systems (AREA)
- Ceramic Engineering (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Logic Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2212168A DE2212168C2 (de) | 1972-03-14 | 1972-03-14 | Monolithisch integrierte Halbleiteranordnung |
FR7305436A FR2175752B1 (US20090163788A1-20090625-C00002.png) | 1972-03-14 | 1973-02-06 | |
IT20055/73A IT978833B (it) | 1972-03-14 | 1973-02-06 | Struttura monolitica a circuiti integrati |
GB614773A GB1401158A (en) | 1972-03-14 | 1973-02-08 | Monolithic semiconductor structure |
JP48016683A JPS5149552B2 (US20090163788A1-20090625-C00002.png) | 1972-03-14 | 1973-02-12 | |
SE7302773A SE386541B (sv) | 1972-03-14 | 1973-02-28 | Monolitisk integrerad halvledarkrets |
US00337510A US3823353A (en) | 1972-03-14 | 1973-03-02 | Multilayered vertical transistor having reach-through isolating contacts |
NL7303411A NL7303411A (US20090163788A1-20090625-C00002.png) | 1972-03-14 | 1973-03-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2212168A DE2212168C2 (de) | 1972-03-14 | 1972-03-14 | Monolithisch integrierte Halbleiteranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2212168A1 DE2212168A1 (de) | 1973-09-20 |
DE2212168C2 true DE2212168C2 (de) | 1982-10-21 |
Family
ID=5838801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2212168A Expired DE2212168C2 (de) | 1972-03-14 | 1972-03-14 | Monolithisch integrierte Halbleiteranordnung |
Country Status (8)
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7107040A (US20090163788A1-20090625-C00002.png) * | 1971-05-22 | 1972-11-24 | ||
DE2262297C2 (de) * | 1972-12-20 | 1985-11-28 | Ibm Deutschland Gmbh, 7000 Stuttgart | Monolithisch integrierbare, logisch verknüpfbare Halbleiterschaltungsanordnung mit I↑2↑L-Aufbau |
US3866066A (en) * | 1973-07-16 | 1975-02-11 | Bell Telephone Labor Inc | Power supply distribution for integrated circuits |
DE2344244C3 (de) * | 1973-09-01 | 1982-11-25 | Robert Bosch Gmbh, 7000 Stuttgart | Laterale Transistorstruktur |
FR2244262B1 (US20090163788A1-20090625-C00002.png) * | 1973-09-13 | 1978-09-29 | Radiotechnique Compelec | |
GB1434961A (en) * | 1973-11-08 | 1976-05-12 | Plessey Co Ltd | Integrated circuit arrangements |
DE2356301C3 (de) * | 1973-11-10 | 1982-03-11 | Ibm Deutschland Gmbh, 7000 Stuttgart | Monolithisch integrierte, logische Schaltung |
GB1507299A (en) * | 1974-03-26 | 1978-04-12 | Signetics Corp | Integrated semiconductor devices |
US3982263A (en) * | 1974-05-02 | 1976-09-21 | National Semiconductor Corporation | Integrated circuit device comprising vertical channel FET resistor |
US4199775A (en) * | 1974-09-03 | 1980-04-22 | Bell Telephone Laboratories, Incorporated | Integrated circuit and method for fabrication thereof |
US3947865A (en) * | 1974-10-07 | 1976-03-30 | Signetics Corporation | Collector-up semiconductor circuit structure for binary logic |
NL7413264A (nl) * | 1974-10-09 | 1976-04-13 | Philips Nv | Geintegreerde schakeling. |
US3982266A (en) * | 1974-12-09 | 1976-09-21 | Texas Instruments Incorporated | Integrated injection logic having high inverse current gain |
JPS5615587B2 (US20090163788A1-20090625-C00002.png) * | 1974-12-27 | 1981-04-10 | ||
US4119998A (en) * | 1974-12-27 | 1978-10-10 | Tokyo Shibaura Electric Co., Ltd. | Integrated injection logic with both grid and internal double-diffused injectors |
DE2509530C2 (de) * | 1975-03-05 | 1985-05-23 | Ibm Deutschland Gmbh, 7000 Stuttgart | Halbleiteranordnung für die Grundbausteine eines hochintegrierbaren logischen Halbleiterschaltungskonzepts basierend auf Mehrfachkollektor-Umkehrtransistoren |
CA1056513A (en) * | 1975-06-19 | 1979-06-12 | Benjamin J. Sloan (Jr.) | Integrated logic circuit and method of fabrication |
GB1558281A (en) * | 1975-07-31 | 1979-12-19 | Tokyo Shibaura Electric Co | Semiconductor device and logic circuit constituted by the semiconductor device |
JPS5229184A (en) * | 1975-09-01 | 1977-03-04 | Nippon Telegr & Teleph Corp <Ntt> | Transistor circuits device |
US4071774A (en) * | 1975-12-24 | 1978-01-31 | Tokyo Shibaura Electric Co., Ltd. | Integrated injection logic with both fan in and fan out Schottky diodes, serially connected between stages |
FR2337432A1 (fr) * | 1975-12-29 | 1977-07-29 | Radiotechnique Compelec | Perfectionnement a la structure des circuits integres a transistors bipolaires complementaires et procede d'obtention |
JPS52101961A (en) * | 1976-02-23 | 1977-08-26 | Toshiba Corp | Semiconductor device |
US4137109A (en) * | 1976-04-12 | 1979-01-30 | Texas Instruments Incorporated | Selective diffusion and etching method for isolation of integrated logic circuit |
GB1580977A (en) * | 1976-05-31 | 1980-12-10 | Siemens Ag | Schottkytransisitor-logic arrangements |
US4160986A (en) * | 1976-08-02 | 1979-07-10 | Johnson David M | Bipolar transistors having fixed gain characteristics |
US4087900A (en) * | 1976-10-18 | 1978-05-09 | Bell Telephone Laboratories, Incorporated | Fabrication of semiconductor integrated circuit structure including injection logic configuration compatible with complementary bipolar transistors utilizing simultaneous formation of device regions |
US4101349A (en) * | 1976-10-29 | 1978-07-18 | Hughes Aircraft Company | Integrated injection logic structure fabricated by outdiffusion and epitaxial deposition |
US4067038A (en) * | 1976-12-22 | 1978-01-03 | Harris Corporation | Substrate fed logic and method of fabrication |
US4159915A (en) * | 1977-10-25 | 1979-07-03 | International Business Machines Corporation | Method for fabrication vertical NPN and PNP structures utilizing ion-implantation |
US4240846A (en) * | 1978-06-27 | 1980-12-23 | Harris Corporation | Method of fabricating up diffused substrate FED logic utilizing a two-step epitaxial deposition |
JPS552187U (US20090163788A1-20090625-C00002.png) * | 1979-05-24 | 1980-01-09 | ||
US4359816A (en) * | 1980-07-08 | 1982-11-23 | International Business Machines Corporation | Self-aligned metal process for field effect transistor integrated circuits |
US4322883A (en) * | 1980-07-08 | 1982-04-06 | International Business Machines Corporation | Self-aligned metal process for integrated injection logic integrated circuits |
FR2501910A1 (fr) * | 1981-03-13 | 1982-09-17 | Thomson Csf | Structure integree d'operateurs logiques bipolaires et son procede de fabrication |
EP0093304B1 (en) * | 1982-04-19 | 1986-01-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor ic and method of making the same |
GB2137411B (en) * | 1983-03-24 | 1987-01-07 | Plessey Co Plc | Integrated circuit arrangement |
US4573099A (en) * | 1984-06-29 | 1986-02-25 | At&T Bell Laboratories | CMOS Circuit overvoltage protection |
US5539233A (en) * | 1993-07-22 | 1996-07-23 | Texas Instruments Incorporated | Controlled low collector breakdown voltage vertical transistor for ESD protection circuits |
US9680473B1 (en) | 2016-02-18 | 2017-06-13 | International Business Machines Corporation | Ultra dense vertical transport FET circuits |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1538402A (fr) * | 1967-06-30 | 1968-09-06 | Radiotechnique Coprim Rtc | Procédé de fabrication de dispositifs semi-conducteurs intégrés |
US3648128A (en) * | 1968-05-25 | 1972-03-07 | Sony Corp | An integrated complementary transistor circuit chip with polycrystalline contact to buried collector regions |
DE2021824C3 (de) * | 1970-05-05 | 1980-08-14 | Ibm Deutschland Gmbh, 7000 Stuttgart | Monolithische Halbleiterschaltung |
-
1972
- 1972-03-14 DE DE2212168A patent/DE2212168C2/de not_active Expired
-
1973
- 1973-02-06 FR FR7305436A patent/FR2175752B1/fr not_active Expired
- 1973-02-06 IT IT20055/73A patent/IT978833B/it active
- 1973-02-08 GB GB614773A patent/GB1401158A/en not_active Expired
- 1973-02-12 JP JP48016683A patent/JPS5149552B2/ja not_active Expired
- 1973-02-28 SE SE7302773A patent/SE386541B/xx unknown
- 1973-03-02 US US00337510A patent/US3823353A/en not_active Expired - Lifetime
- 1973-03-12 NL NL7303411A patent/NL7303411A/xx not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
GB1401158A (en) | 1975-07-16 |
NL7303411A (US20090163788A1-20090625-C00002.png) | 1973-09-18 |
JPS494485A (US20090163788A1-20090625-C00002.png) | 1974-01-16 |
FR2175752A1 (US20090163788A1-20090625-C00002.png) | 1973-10-26 |
IT978833B (it) | 1974-09-20 |
US3823353A (en) | 1974-07-09 |
FR2175752B1 (US20090163788A1-20090625-C00002.png) | 1984-02-17 |
DE2212168A1 (de) | 1973-09-20 |
SE386541B (sv) | 1976-08-09 |
JPS5149552B2 (US20090163788A1-20090625-C00002.png) | 1976-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OD | Request for examination | ||
D2 | Grant after examination | ||
8339 | Ceased/non-payment of the annual fee |