DE2143785A1 - Verfahren zum selektiven Abbeizen von Zinn und/oder Blei von Kupfersubstraten - Google Patents
Verfahren zum selektiven Abbeizen von Zinn und/oder Blei von KupfersubstratenInfo
- Publication number
- DE2143785A1 DE2143785A1 DE19712143785 DE2143785A DE2143785A1 DE 2143785 A1 DE2143785 A1 DE 2143785A1 DE 19712143785 DE19712143785 DE 19712143785 DE 2143785 A DE2143785 A DE 2143785A DE 2143785 A1 DE2143785 A1 DE 2143785A1
- Authority
- DE
- Germany
- Prior art keywords
- tin
- lead
- acid
- solution
- pickling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 57
- 229910052802 copper Inorganic materials 0.000 title claims description 57
- 239000010949 copper Substances 0.000 title claims description 57
- 238000005554 pickling Methods 0.000 title claims description 51
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 46
- 239000000758 substrate Substances 0.000 title claims description 32
- 238000000034 method Methods 0.000 title claims description 23
- 230000008569 process Effects 0.000 title description 4
- 239000000243 solution Substances 0.000 claims description 58
- 239000002253 acid Substances 0.000 claims description 38
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 20
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 20
- 230000002378 acidificating effect Effects 0.000 claims description 15
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 15
- 239000011707 mineral Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 11
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 5
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 4
- -1 alkyl radical Chemical class 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 3
- 239000003929 acidic solution Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 150000005840 aryl radicals Chemical class 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- 238000004090 dissolution Methods 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical group S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 25
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000000203 mixture Substances 0.000 description 13
- 239000010931 gold Substances 0.000 description 12
- 229910052737 gold Inorganic materials 0.000 description 12
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 9
- 239000004327 boric acid Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000000080 wetting agent Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 150000002978 peroxides Chemical class 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 5
- 239000011152 fibreglass Substances 0.000 description 5
- 229920000151 polyglycol Polymers 0.000 description 5
- 239000010695 polyglycol Substances 0.000 description 5
- 235000019260 propionic acid Nutrition 0.000 description 5
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- 229910002056 binary alloy Inorganic materials 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- AUXGIIVHLRLBSG-UHFFFAOYSA-N 1,3-dipropylthiourea Chemical compound CCCNC(=S)NCCC AUXGIIVHLRLBSG-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical class OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 1
- 101100286286 Dictyostelium discoideum ipi gene Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- VLCDUOXHFNUCKK-UHFFFAOYSA-N N,N'-Dimethylthiourea Chemical compound CNC(=S)NC VLCDUOXHFNUCKK-UHFFFAOYSA-N 0.000 description 1
- FULZLIGZKMKICU-UHFFFAOYSA-N N-phenylthiourea Chemical compound NC(=S)NC1=CC=CC=C1 FULZLIGZKMKICU-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000013504 Triton X-100 Substances 0.000 description 1
- 229920004890 Triton X-100 Polymers 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- BRCRFYDCLUTJRQ-UHFFFAOYSA-N chloroboronic acid Chemical compound OB(O)Cl BRCRFYDCLUTJRQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000834 fixative Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- YAFKGUAJYKXPDI-UHFFFAOYSA-J lead tetrafluoride Chemical compound F[Pb](F)(F)F YAFKGUAJYKXPDI-UHFFFAOYSA-J 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
- LJRGBERXYNQPJI-UHFFFAOYSA-M sodium;3-nitrobenzenesulfonate Chemical compound [Na+].[O-][N+](=O)C1=CC=CC(S([O-])(=O)=O)=C1 LJRGBERXYNQPJI-UHFFFAOYSA-M 0.000 description 1
- MUADFEZFSKAZLT-UHFFFAOYSA-M sodium;3-nitrobenzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC([N+]([O-])=O)=C1 MUADFEZFSKAZLT-UHFFFAOYSA-M 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- FBWNMEQMRUMQSO-UHFFFAOYSA-N tergitol NP-9 Chemical compound CCCCCCCCCC1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 FBWNMEQMRUMQSO-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 210000002105 tongue Anatomy 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6976970A | 1970-09-04 | 1970-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2143785A1 true DE2143785A1 (de) | 1972-03-16 |
Family
ID=22091105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712143785 Pending DE2143785A1 (de) | 1970-09-04 | 1971-09-01 | Verfahren zum selektiven Abbeizen von Zinn und/oder Blei von Kupfersubstraten |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3677949A (enExample) |
| JP (1) | JPS5017336B1 (enExample) |
| CA (1) | CA923024A (enExample) |
| DE (1) | DE2143785A1 (enExample) |
| ES (1) | ES394816A1 (enExample) |
| FR (1) | FR2102030A5 (enExample) |
| GB (1) | GB1361445A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4113283A1 (de) * | 1991-04-24 | 1992-10-29 | Kernforschungsz Karlsruhe | Aetzloesung und verfahren zum abaetzen einer metallschicht |
| DE4219667A1 (de) * | 1992-06-16 | 1993-12-23 | Kernforschungsz Karlsruhe | Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht |
| CN111705216A (zh) * | 2020-06-16 | 2020-09-25 | 云南锡业股份有限公司锡业分公司 | 一种焊锡电解阳极泥的处理工艺 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3841905A (en) * | 1970-11-19 | 1974-10-15 | Rbp Chem Corp | Method of preparing printed circuit boards with terminal tabs |
| US3888778A (en) * | 1973-03-13 | 1975-06-10 | Merton Beckwith | Bright dip composition for tin/lead |
| GB1446816A (en) * | 1973-05-02 | 1976-08-18 | Furukawa Electric Co Ltd | Chemical dissolution treatment of tin or alloys thereof |
| US3926699A (en) * | 1974-06-17 | 1975-12-16 | Rbp Chemical Corp | Method of preparing printed circuit boards with terminal tabs |
| US4004956A (en) * | 1974-08-14 | 1977-01-25 | Enthone, Incorporated | Selectively stripping tin or tin-lead alloys from copper substrates |
| US3990982A (en) * | 1974-12-18 | 1976-11-09 | Rbp Chemical Corporation | Composition for stripping lead-tin solder |
| USRE29181E (en) * | 1974-12-18 | 1977-04-12 | Rbp Chemical Corporation | Method of preparing printed circuit boards with terminal tabs |
| US4175011A (en) * | 1978-07-17 | 1979-11-20 | Allied Chemical Corporation | Sulfate-free method of etching copper pattern on printed circuit boards |
| US4306933A (en) * | 1980-02-11 | 1981-12-22 | Chemline Industries | Tin/tin-lead stripping solutions |
| IT1144797B (it) * | 1981-10-14 | 1986-10-29 | Alfachimici Spa | Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo |
| USRE32555E (en) * | 1982-09-20 | 1987-12-08 | Circuit Chemistry Corporation | Solder stripping solution |
| US4397753A (en) * | 1982-09-20 | 1983-08-09 | Circuit Chemistry Corporation | Solder stripping solution |
| DE3511514A1 (de) * | 1984-04-02 | 1985-10-10 | Parker Chemical Co., Madison Heights, Mich. | Verfahren und waessrige, saure reinigungsloesung zur reinigung von aluminiumoberflaechen |
| US4732649A (en) * | 1986-06-18 | 1988-03-22 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
| US4806200A (en) * | 1986-06-18 | 1989-02-21 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
| ZA873845B (en) * | 1986-06-18 | 1987-11-24 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
| DE3738307A1 (de) * | 1987-11-11 | 1989-05-24 | Ruwel Werke Gmbh | Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen |
| US4957653A (en) * | 1989-04-07 | 1990-09-18 | Macdermid, Incorporated | Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
| US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
| US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
| US4956035A (en) * | 1989-08-01 | 1990-09-11 | Rd Chemical Company | Composition and process for promoting adhesion on metal surfaces |
| JPH0375386A (ja) * | 1989-08-18 | 1991-03-29 | Metsuku Kk | 錫又は錫‐鉛合金の剥離方法 |
| US5017267A (en) * | 1990-07-17 | 1991-05-21 | Macdermid, Incorporated | Composition and method for stripping tin or tin-lead alloy from copper surfaces |
| JP2003277999A (ja) * | 2001-10-11 | 2003-10-02 | Shipley Co Llc | 剥離溶液 |
| CN100339014C (zh) * | 2003-03-27 | 2007-09-26 | 中国人民解放军第三军医大学 | N－乙酰氨基葡萄糖在乳制品中的应用及包含n－乙酰氨基葡萄糖的乳制品 |
| DE102004014680B3 (de) * | 2004-03-25 | 2005-07-28 | Dr.-Ing. Max Schlötter GmbH & Co KG | Entmetallisierungslösung und deren Verwendung |
| EP2503029B1 (en) * | 2011-03-22 | 2013-03-20 | Atotech Deutschland GmbH | Process for etching a recessed structure filled with tin or a tin alloy |
| WO2025241030A1 (en) * | 2024-05-22 | 2025-11-27 | Innovation Mining Inc. | Methods employing thiourea for metal extraction |
-
1970
- 1970-09-04 US US69769A patent/US3677949A/en not_active Expired - Lifetime
-
1971
- 1971-08-11 CA CA120282A patent/CA923024A/en not_active Expired
- 1971-08-25 FR FR7130796A patent/FR2102030A5/fr not_active Expired
- 1971-08-30 JP JP46065944A patent/JPS5017336B1/ja active Pending
- 1971-09-01 DE DE19712143785 patent/DE2143785A1/de active Pending
- 1971-09-02 GB GB4104071A patent/GB1361445A/en not_active Expired
- 1971-09-04 ES ES394816A patent/ES394816A1/es not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4113283A1 (de) * | 1991-04-24 | 1992-10-29 | Kernforschungsz Karlsruhe | Aetzloesung und verfahren zum abaetzen einer metallschicht |
| US5462640A (en) * | 1991-04-24 | 1995-10-31 | Kernforschungszentrum Karlsruhe Gmbh | Etching solution |
| DE4219667A1 (de) * | 1992-06-16 | 1993-12-23 | Kernforschungsz Karlsruhe | Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht |
| CN111705216A (zh) * | 2020-06-16 | 2020-09-25 | 云南锡业股份有限公司锡业分公司 | 一种焊锡电解阳极泥的处理工艺 |
| CN111705216B (zh) * | 2020-06-16 | 2021-12-03 | 云南锡业股份有限公司锡业分公司 | 一种焊锡电解阳极泥的处理工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA923024A (en) | 1973-03-20 |
| US3677949A (en) | 1972-07-18 |
| FR2102030A5 (enExample) | 1972-03-31 |
| ES394816A1 (es) | 1974-11-16 |
| GB1361445A (en) | 1974-07-24 |
| JPS5017336B1 (enExample) | 1975-06-20 |
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|---|---|---|
| DE2143785A1 (de) | Verfahren zum selektiven Abbeizen von Zinn und/oder Blei von Kupfersubstraten | |
| DE3212410C2 (enExample) | ||
| DE2536404C2 (de) | Verfahren zur Entplattierung von Zinn oder Zinn-Blei-Legierungen von Kupfersubstraten und wässerige saure Lösung zur Durchführung des Verfahrens | |
| DE68926622T2 (de) | Inhibierte zusammensetzung und ein verfahren zum abziehen von zinn, blei oder zinn-blei legierung von kupferflachen | |
| DE69518166T2 (de) | Beschichten von kupfer | |
| DE2610470C3 (de) | Verfahren zur stromlosen Abscheidung von Kupferschichten | |
| DE69218892T2 (de) | Komplexierungsmittel für das Zinnplattieren nach der Austauschmethode | |
| DE69014789T2 (de) | Zusammensetzung und verfahren zur entfernung von zinn oder zinn-bleilegierungen von kupferflächen. | |
| DE3390209T1 (de) | Lötmittel-Entfernungslösung | |
| DE69213840T2 (de) | Bad zur stromlosen Beschichtung mit einer Zinn-Blei-Legierung | |
| CH650027A5 (de) | Verfahren zum feuerverzinken metallischer werkstuecke. | |
| DE2810523A1 (de) | Leiterplatten fuer gedruckte schaltkreise und verfahren zu ihrer herstellung | |
| CH625096A5 (enExample) | ||
| DE69329249T2 (de) | Phosphatisierungsverfahren, insbesondere für die herstellung von leiterplatten und verwendung organischer rückstände | |
| DE2847070A1 (de) | Verfahren zur behandlung eines mit additiv aufplattierten gedruckten leiterzuegen versehenen substrates | |
| EP0315891B1 (de) | Badlösungen und Verfahren zum Entfernen von Blei/Zinn-, Blei- bzw. Zinnschichten von Kupfer- oder Nickeloberflächen | |
| DE3887989T2 (de) | Verfahren zur herstellung von gedruckten schaltungen mit durchgehenden löchern für metallisierung. | |
| DE3315062C2 (enExample) | ||
| DE69027952T2 (de) | Verfahren zum Auflösen von Zinn und Zinnlegierungen | |
| DE69314070T2 (de) | Verfahren zur Entfernung Zinn oder Zinn-Bleilegierungen von Kupferoberflächen | |
| DE2412134C3 (de) | Mittel zum Reinigen von Zinn-Blei-Legierungen | |
| DE2947998A1 (de) | Verfahren zur entfernung von kupferionen aus einem bad, insbesondere bei der galvanischen metallabscheidung | |
| DE2932822A1 (de) | Reaktions-ueberzugsloesung und verfahren zum erzeugen von schutzueberzuegen auf metalloberflaechen | |
| EP0183925B1 (de) | Verfahren zum An- und Abätzen von Kunststoffschichten in Bohrungen von Basismaterial für Leiterplatten | |
| DE69302104T2 (de) | Verfahren zur Verbesserung der Adhäsion zwischen verschiedenen Schichten in der Herstellung laminierter Leiterplatten und Zusammensetzungen zur Durchführung des Verfahrens |