DE2143737A1 - Photoaetzverfahren - Google Patents

Photoaetzverfahren

Info

Publication number
DE2143737A1
DE2143737A1 DE19712143737 DE2143737A DE2143737A1 DE 2143737 A1 DE2143737 A1 DE 2143737A1 DE 19712143737 DE19712143737 DE 19712143737 DE 2143737 A DE2143737 A DE 2143737A DE 2143737 A1 DE2143737 A1 DE 2143737A1
Authority
DE
Germany
Prior art keywords
partial
exposure
pattern
photoresist
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712143737
Other languages
German (de)
English (en)
Inventor
Walter Dipl Ing Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
Original Assignee
IBM Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH filed Critical IBM Deutschland GmbH
Priority to DE19712143737 priority Critical patent/DE2143737A1/de
Priority to IT2747972A priority patent/IT963413B/it
Priority to JP8007972A priority patent/JPS5133445B2/ja
Priority to FR7231319A priority patent/FR2151130A1/fr
Publication of DE2143737A1 publication Critical patent/DE2143737A1/de
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • ing And Chemical Polishing (AREA)
DE19712143737 1971-09-01 1971-09-01 Photoaetzverfahren Pending DE2143737A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19712143737 DE2143737A1 (de) 1971-09-01 1971-09-01 Photoaetzverfahren
IT2747972A IT963413B (it) 1971-09-01 1972-07-27 Procedimento di fotoincisione particolarmente per la fabbrica zione di circuiti integrati
JP8007972A JPS5133445B2 (enrdf_load_stackoverflow) 1971-09-01 1972-08-11
FR7231319A FR2151130A1 (en) 1971-09-01 1972-08-29 Photo mask mfr - eliminating defects by successive partial exposures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712143737 DE2143737A1 (de) 1971-09-01 1971-09-01 Photoaetzverfahren

Publications (1)

Publication Number Publication Date
DE2143737A1 true DE2143737A1 (de) 1973-03-08

Family

ID=5818349

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712143737 Pending DE2143737A1 (de) 1971-09-01 1971-09-01 Photoaetzverfahren

Country Status (4)

Country Link
JP (1) JPS5133445B2 (enrdf_load_stackoverflow)
DE (1) DE2143737A1 (enrdf_load_stackoverflow)
FR (1) FR2151130A1 (enrdf_load_stackoverflow)
IT (1) IT963413B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0030117B1 (en) * 1979-11-28 1983-09-07 Fujitsu Limited Method of forming an opening in a negative resist film

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501805A (enrdf_load_stackoverflow) * 1973-05-14 1975-01-09
JPS5168772A (en) * 1974-12-11 1976-06-14 Matsushita Electronics Corp Handotaisochino seizohoho
JPS5348676A (en) * 1976-10-15 1978-05-02 Handotai Kenkyu Shinkokai Method of forming pattern
US4099062A (en) * 1976-12-27 1978-07-04 International Business Machines Corporation Electron beam lithography process
DE2734580C2 (de) * 1977-08-01 1979-02-15 Hoechst Ag, 6000 Frankfurt Verfahren zum Herstellen eines Originals eines Informationsträgers
JPS5429976A (en) * 1977-08-10 1979-03-06 Nec Home Electronics Ltd Manufacture of semiconductor device
DE3013819A1 (de) * 1980-04-10 1981-10-15 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung gedruckter leiterplatten
US4456371A (en) * 1982-06-30 1984-06-26 International Business Machines Corporation Optical projection printing threshold leveling arrangement
JPS594017A (ja) * 1982-06-30 1984-01-10 Toshiba Corp 電子ビ−ム露光方法
JPS59232418A (ja) * 1983-06-15 1984-12-27 Sumitomo Electric Ind Ltd 微細パタ−ン形成法
DE69031212T2 (de) * 1990-03-23 1998-01-29 Ushio Electric Inc Randbelichtungsverfahren für Halbleiterscheiben

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0030117B1 (en) * 1979-11-28 1983-09-07 Fujitsu Limited Method of forming an opening in a negative resist film
US4581316A (en) * 1979-11-28 1986-04-08 Fujitsu Limited Method of forming resist patterns in negative photoresist layer using false pattern

Also Published As

Publication number Publication date
IT963413B (it) 1974-01-10
JPS5133445B2 (enrdf_load_stackoverflow) 1976-09-20
JPS4833908A (enrdf_load_stackoverflow) 1973-05-15
FR2151130B1 (enrdf_load_stackoverflow) 1974-08-19
FR2151130A1 (en) 1973-04-13

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