DE2117369A1 - Umkapselter integrierter Schaltkreis - Google Patents

Umkapselter integrierter Schaltkreis

Info

Publication number
DE2117369A1
DE2117369A1 DE19712117369 DE2117369A DE2117369A1 DE 2117369 A1 DE2117369 A1 DE 2117369A1 DE 19712117369 DE19712117369 DE 19712117369 DE 2117369 A DE2117369 A DE 2117369A DE 2117369 A1 DE2117369 A1 DE 2117369A1
Authority
DE
Germany
Prior art keywords
base plate
conductors
integrated circuit
socket
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712117369
Other languages
German (de)
English (en)
Inventor
Peter Thacher Scottsdale Ariz. Robinson (V.St.A.). M
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE2117369A1 publication Critical patent/DE2117369A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19712117369 1970-04-16 1971-04-08 Umkapselter integrierter Schaltkreis Pending DE2117369A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2900170A 1970-04-16 1970-04-16

Publications (1)

Publication Number Publication Date
DE2117369A1 true DE2117369A1 (de) 1971-11-11

Family

ID=21846691

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19712117369 Pending DE2117369A1 (de) 1970-04-16 1971-04-08 Umkapselter integrierter Schaltkreis
DE19717113716U Expired DE7113716U (de) 1970-04-16 1971-04-08 Umkapselter integrierter schaltkreis

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19717113716U Expired DE7113716U (de) 1970-04-16 1971-04-08 Umkapselter integrierter schaltkreis

Country Status (2)

Country Link
DE (2) DE2117369A1 (cg-RX-API-DMAC7.html)
NL (1) NL7104239A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0108502A3 (en) * 1982-10-08 1985-08-07 Fujitsu Limited A plastics moulded semiconductor device and a method of producing it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0108502A3 (en) * 1982-10-08 1985-08-07 Fujitsu Limited A plastics moulded semiconductor device and a method of producing it

Also Published As

Publication number Publication date
DE7113716U (de) 1971-07-22
NL7104239A (cg-RX-API-DMAC7.html) 1971-10-19

Similar Documents

Publication Publication Date Title
DE1514827C2 (de) Verfahren zur serienmäßigen Herstellung von Halbleiterbauelementen
DE3814469C2 (cg-RX-API-DMAC7.html)
DE68928095T2 (de) Verfahren zur Herstellung eines elektronischen Moduls und elektronisches Modul, hergestellt nach diesem Verfahren
DE2931449A1 (de) Leitungsrahmen und denselben verwendende halbleitervorrichtung
DE3783076T2 (de) Auf einer oberflaeche montierter hochlast widerstand.
DE2611531A1 (de) In kunststoff eingekapselter integrierter schaltungsbaustein
DE2636450A1 (de) Halbleiter-leitungsrahmen
DE19743537A1 (de) Halbleitergehäuse für Oberflächenmontage sowie Verfahren zu seiner Herstellung
DE4130899C2 (de) Halbleitervorrichtung
DE69612054T2 (de) Sicherungselement für träge Schmelzsicherung
EP0333906A1 (de) Kaltleiter-PTC-Heizkörper
DE3889018T2 (de) Halbleiterpackung mit automatischer Bandmontage.
DE2007014C3 (de) Elektrische Kontaktbuchse
DE2306288A1 (de) Traeger fuer integrierte schaltungen
DE2419504B2 (de) Kunststoffgehaeuse fuer einen kaltleiter oder fuer eine kaltleiterkombination
DE69609921T2 (de) Herstellungsverfahren einer halbleiteranordnung geeignet zur oberflächenmontage
DE1194503B (de) Halbleiter-Diode und Verfahren zu ihrer Herstellung
DE1941959A1 (de) Kapselaufbau fuer elektrische Schaltkreisanordnungen sowie Giessform und Verfahren zur Herstellung desselben
DE1801073B2 (de) Verfahren zum herstellen von halbleiterbauteilen
DE7307696U (de) Leistungs-halbleiterelement
DE102020106247A1 (de) Leadframe-stabilisator für verbesserte leiterplanarität
DE2725260C2 (cg-RX-API-DMAC7.html)
DE1614134B2 (de) Leiterrahmen zur Verwendung bei der automatischen Herstellung von gekapselten, integrierten Halbleiterbauelementen, integriertes Halbleiterbauelement und Verfahren zu dessen Herstellung
DE2123068A1 (de) Sicherungsaufbau
DE1964668C3 (de) Halbleiterbauelement