DE2110289C3 - Verfahren zum Niederschlagen von Halbleitermaterial und Vorrichtung zu seiner Durchführung - Google Patents

Verfahren zum Niederschlagen von Halbleitermaterial und Vorrichtung zu seiner Durchführung

Info

Publication number
DE2110289C3
DE2110289C3 DE2110289A DE2110289A DE2110289C3 DE 2110289 C3 DE2110289 C3 DE 2110289C3 DE 2110289 A DE2110289 A DE 2110289A DE 2110289 A DE2110289 A DE 2110289A DE 2110289 C3 DE2110289 C3 DE 2110289C3
Authority
DE
Germany
Prior art keywords
susceptor
substrates
tube
gas
semiconductor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2110289A
Other languages
German (de)
English (en)
Other versions
DE2110289B2 (de
DE2110289A1 (de
Inventor
Franciscus Cornelis Eversteijn
Hermanus Leonardus Peek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2110289A1 publication Critical patent/DE2110289A1/de
Publication of DE2110289B2 publication Critical patent/DE2110289B2/de
Application granted granted Critical
Publication of DE2110289C3 publication Critical patent/DE2110289C3/de
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45585Compression of gas before it reaches the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Drying Of Semiconductors (AREA)
DE2110289A 1970-03-11 1971-03-04 Verfahren zum Niederschlagen von Halbleitermaterial und Vorrichtung zu seiner Durchführung Expired DE2110289C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7003431A NL7003431A (enrdf_load_stackoverflow) 1970-03-11 1970-03-11

Publications (3)

Publication Number Publication Date
DE2110289A1 DE2110289A1 (de) 1971-09-23
DE2110289B2 DE2110289B2 (de) 1980-03-13
DE2110289C3 true DE2110289C3 (de) 1980-10-30

Family

ID=19809548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2110289A Expired DE2110289C3 (de) 1970-03-11 1971-03-04 Verfahren zum Niederschlagen von Halbleitermaterial und Vorrichtung zu seiner Durchführung

Country Status (11)

Country Link
US (1) US3750620A (enrdf_load_stackoverflow)
JP (1) JPS5317862B1 (enrdf_load_stackoverflow)
AT (1) AT321994B (enrdf_load_stackoverflow)
BE (1) BE764013A (enrdf_load_stackoverflow)
CA (1) CA923635A (enrdf_load_stackoverflow)
CH (1) CH532960A (enrdf_load_stackoverflow)
DE (1) DE2110289C3 (enrdf_load_stackoverflow)
FR (1) FR2084428A5 (enrdf_load_stackoverflow)
GB (1) GB1346938A (enrdf_load_stackoverflow)
NL (1) NL7003431A (enrdf_load_stackoverflow)
SE (1) SE368724B (enrdf_load_stackoverflow)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242075A (en) * 1975-09-29 1977-04-01 Nippon Denso Co Ltd Device for controlling gas atmosphere in semiconductor producing equip ment
GB1524326A (en) * 1976-04-13 1978-09-13 Bfg Glassgroup Coating of glass
JPS5944771B2 (ja) * 1979-03-29 1984-11-01 テルサ−ムコ株式会社 半導体熱処理炉
JPS5942970B2 (ja) * 1979-03-29 1984-10-18 テルサ−ムコ株式会社 半導体熱処理用反応管
JPS5923464B2 (ja) * 1979-04-18 1984-06-02 テルサ−ムコ株式会社 半導体熱処理装置
US4325319A (en) * 1980-01-18 1982-04-20 Caterpillar Tractor Co. Air flow system for the charging conductor in an electrostatic painting system
US4834022A (en) * 1985-11-08 1989-05-30 Focus Semiconductor Systems, Inc. CVD reactor and gas injection system
US4976996A (en) * 1987-02-17 1990-12-11 Lam Research Corporation Chemical vapor deposition reactor and method of use thereof
FR2612946B1 (fr) * 1987-03-27 1993-02-19 Chimie Metal Procede et installation pour le depot chimique de revetements ultradurs a temperature moderee
US5221556A (en) * 1987-06-24 1993-06-22 Epsilon Technology, Inc. Gas injectors for reaction chambers in CVD systems
DE3721636A1 (de) * 1987-06-30 1989-01-12 Aixtron Gmbh Quarzglasreaktor fuer mocvd-anlagen
DE3884810T2 (de) * 1988-06-22 1994-05-05 Advanced Semiconductor Mat Gaseinspritzvorrichtung für reaktoren für den chemischen dampfniederschlag.
US4993358A (en) * 1989-07-28 1991-02-19 Watkins-Johnson Company Chemical vapor deposition reactor and method of operation
US6090211A (en) * 1996-03-27 2000-07-18 Matsushita Electric Industrial Co., Ltd. Apparatus and method for forming semiconductor thin layer
JP3068075B2 (ja) * 1998-01-17 2000-07-24 ハンベック コーポレイション 化合物半導体製造用水平反応炉
SE9801190D0 (sv) * 1998-04-06 1998-04-06 Abb Research Ltd A method and a device for epitaxial growth of objects by Chemical Vapour Deposition
TW544775B (en) * 2001-02-28 2003-08-01 Japan Pionics Chemical vapor deposition apparatus and chemical vapor deposition method
US6626997B2 (en) 2001-05-17 2003-09-30 Nathan P. Shapiro Continuous processing chamber
US20060096531A1 (en) * 2002-06-10 2006-05-11 Tokyo Electron Limited Processing device and processing method
US8124170B1 (en) * 2004-01-23 2012-02-28 Metal Oxide Technologies, Inc Method for forming superconductor material on a tape substrate
WO2005124859A2 (en) * 2004-06-10 2005-12-29 Avansys, Inc. Methods and apparatuses for depositing uniform layers
US7396415B2 (en) * 2005-06-02 2008-07-08 Asm America, Inc. Apparatus and methods for isolating chemical vapor reactions at a substrate surface
JP4466723B2 (ja) * 2007-11-21 2010-05-26 住友電気工業株式会社 有機金属気相成長装置
US8628616B2 (en) * 2007-12-11 2014-01-14 Sumitomo Electric Industries, Ltd. Vapor-phase process apparatus, vapor-phase process method, and substrate
JP5954202B2 (ja) * 2013-01-29 2016-07-20 東京エレクトロン株式会社 成膜装置
US11032945B2 (en) * 2019-07-12 2021-06-08 Applied Materials, Inc. Heat shield assembly for an epitaxy chamber

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484311A (en) * 1966-06-21 1969-12-16 Union Carbide Corp Silicon deposition process
US3367304A (en) * 1967-03-13 1968-02-06 Dow Corning Deposition chamber for manufacture of refractory coated filaments
US3511727A (en) * 1967-05-08 1970-05-12 Motorola Inc Vapor phase etching and polishing of semiconductors

Also Published As

Publication number Publication date
US3750620A (en) 1973-08-07
BE764013A (fr) 1971-09-09
AT321994B (de) 1975-04-25
DE2110289B2 (de) 1980-03-13
CH532960A (de) 1973-01-31
FR2084428A5 (enrdf_load_stackoverflow) 1971-12-17
NL7003431A (enrdf_load_stackoverflow) 1971-09-14
SE368724B (enrdf_load_stackoverflow) 1974-07-15
GB1346938A (en) 1974-02-13
JPS5317862B1 (enrdf_load_stackoverflow) 1978-06-12
CA923635A (en) 1973-03-27
DE2110289A1 (de) 1971-09-23

Similar Documents

Publication Publication Date Title
DE2110289C3 (de) Verfahren zum Niederschlagen von Halbleitermaterial und Vorrichtung zu seiner Durchführung
DE3884682T2 (de) Verfahren zur Züchtung eines Halbleiterkristalles aus III-V-Gruppen-Verbindung auf einem Si-Substrat.
DE69032691T2 (de) Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck
DE69505234T2 (de) Plasmabehandlung in der elektronikapparateherstellung
DE4005796C2 (de) Vorrichtung zur Herstellung einer Dünnschicht
DE69118337T2 (de) Vertikal ausgerichtete CVD-Vorrichtung umfassend ein Gas-Einlassrohr mit Gas-Einblasöffnungen
DE69404397T2 (de) Verbesserte Suszeptor Ausführung
DE69126122T2 (de) Methode und apparat zum wachsen von verbindungshalbleiterkristallen
DE2460211B2 (de) Verfahren zum chemischen Abscheiden von polykristallinem Silicium aus der Gasphase
DE2523067B2 (de) Verfahren zum Aufwachsen einer epitaktischen Silicium-Schicht
DE60112372T2 (de) Vorrichtung und Verfahren zur chemischen Gasphasenabscheidung
DE1034776B (de) Diffusionsverfahren fuer leitungstypbestimmende Verunreinigungen in Halbleiteroberflaechen
DE2419142C3 (de) Verfahren zur Ausbildung einer Halbleiterschicht mit einer niedrigen Störstellendichte auf einem Halbleitersubstrat mit einer hohen Störstellendichte
DE69229870T2 (de) Vorrichtung zum einführen von gas, sowie gerät und verfahren zum epitaxialen wachstum.
DE1901819C3 (de) Herstellungsverfahren für polykristalline Siliciumschichten
DE3838164C2 (de) Vorrichtung zum Aufwachsen von Stoffen aus der Gasphase
DE3134702C2 (de) Verfahren zum Ablagern eines schwerschmelzbaren Metalls auf einer dünnen Platte
WO2000014310A1 (de) Vorrichtung zum herstellen und bearbeiten von halbleitersubstraten
DE2718026B2 (de) Verfahren zum Beschichten von HaIbleiterplättchen aus der Dampfphase und deren Anwendung
DE3787556T2 (de) Verfahren zur Bildung eines abgeschiedenen Filmes.
DE3787038T2 (de) Verfahren zur Ausbildung eines abgeschiedenen Films.
DE2161472C3 (de) Verfahren zum Aufwachsen einer polykristallinen Silicium-Schicht auf einer Halbleiterscheibe
DE102019212821A1 (de) Verfahren und Vorrichtung zur Herstellung einer Schicht, damit versehenes Substrat und dessen Verwendung
DE3689387T2 (de) Verfahren zur Herstellung einer Dünnschicht aus GaAs.
DE102019008927B4 (de) Gasphasenepitaxieverfahren

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee