GB1346938A - Reactors and method of manufacture of semiconductor devices using such a reactor - Google Patents
Reactors and method of manufacture of semiconductor devices using such a reactorInfo
- Publication number
- GB1346938A GB1346938A GB2337671*A GB2337671A GB1346938A GB 1346938 A GB1346938 A GB 1346938A GB 2337671 A GB2337671 A GB 2337671A GB 1346938 A GB1346938 A GB 1346938A
- Authority
- GB
- United Kingdom
- Prior art keywords
- tube
- substrates
- gas
- deposited
- cms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45585—Compression of gas before it reaches the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
1346938 Gas/solid contact; decomposing gases PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 19 April 1971 [11 March 1970] 23376/71 Heading B1F [Also in Division C1] Semiconductor material is deposited on substrates 4 from gas flowing as at 5 through tube 2 which gradually narrows as at 6, the substrates being heated through susceptors 21 by high frequency inductions coil 3. The susceptor may consist of graphite with a surface of silicon carbide. The substrates 4 may be silicon and silicon may be epitaxially deposited from a hydrogen stream containing SiH 4 or SiHCl 3 , or silicon nitride may be deposited. Polycrystalline layers may be deposited. Etching processes on substrates using an etchant gas may also be carried out. The substrates may be continually passed through the tube during deposition. The process condition may satisfy the following relationship: wherein V o is the rate of flow of the gas stream in cms/sec at N.T.P. at the part of tube 2 where the process begins to take place, T s is the temperature in degrees K of the substrate, T m is the temperature in degrees K of the gas in the tube portion for the performance of the process, b is the distance in cms between the susceptor 21 and the top inner surface of the part of the tube 2 where the process begins to take place, and D o is the diffusion coefficient in sq. cms/sec of the compound in the gas stream which diffuses the slowest, and Ï is the angle at which the top and bottom surface of the tube 2 approach each other.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7003431A NL7003431A (en) | 1970-03-11 | 1970-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1346938A true GB1346938A (en) | 1974-02-13 |
Family
ID=19809548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2337671*A Expired GB1346938A (en) | 1970-03-11 | 1971-04-19 | Reactors and method of manufacture of semiconductor devices using such a reactor |
Country Status (11)
Country | Link |
---|---|
US (1) | US3750620A (en) |
JP (1) | JPS5317862B1 (en) |
AT (1) | AT321994B (en) |
BE (1) | BE764013A (en) |
CA (1) | CA923635A (en) |
CH (1) | CH532960A (en) |
DE (1) | DE2110289C3 (en) |
FR (1) | FR2084428A5 (en) |
GB (1) | GB1346938A (en) |
NL (1) | NL7003431A (en) |
SE (1) | SE368724B (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5242075A (en) * | 1975-09-29 | 1977-04-01 | Nippon Denso Co Ltd | Device for controlling gas atmosphere in semiconductor producing equip ment |
GB1524326A (en) * | 1976-04-13 | 1978-09-13 | Bfg Glassgroup | Coating of glass |
JPS5942970B2 (en) * | 1979-03-29 | 1984-10-18 | テルサ−ムコ株式会社 | Reaction tube for semiconductor heat treatment |
JPS5944771B2 (en) * | 1979-03-29 | 1984-11-01 | テルサ−ムコ株式会社 | Semiconductor heat treatment furnace |
JPS5923464B2 (en) * | 1979-04-18 | 1984-06-02 | テルサ−ムコ株式会社 | Semiconductor heat treatment equipment |
US4325319A (en) * | 1980-01-18 | 1982-04-20 | Caterpillar Tractor Co. | Air flow system for the charging conductor in an electrostatic painting system |
US4834022A (en) * | 1985-11-08 | 1989-05-30 | Focus Semiconductor Systems, Inc. | CVD reactor and gas injection system |
US4976996A (en) * | 1987-02-17 | 1990-12-11 | Lam Research Corporation | Chemical vapor deposition reactor and method of use thereof |
FR2612946B1 (en) * | 1987-03-27 | 1993-02-19 | Chimie Metal | PROCESS AND PLANT FOR CHEMICAL DEPOSITION OF MODERATE TEMPERATURE ULTRADOR COATINGS |
US5221556A (en) * | 1987-06-24 | 1993-06-22 | Epsilon Technology, Inc. | Gas injectors for reaction chambers in CVD systems |
DE3721636A1 (en) * | 1987-06-30 | 1989-01-12 | Aixtron Gmbh | QUARTZ GLASS REACTOR FOR MOCVD SYSTEMS |
WO1989012703A1 (en) * | 1988-06-22 | 1989-12-28 | Asm Epitaxy, Inc. | Gas injector apparatus for chemical vapor deposition reactors |
US4993358A (en) * | 1989-07-28 | 1991-02-19 | Watkins-Johnson Company | Chemical vapor deposition reactor and method of operation |
US6090211A (en) * | 1996-03-27 | 2000-07-18 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for forming semiconductor thin layer |
JP3068075B2 (en) * | 1998-01-17 | 2000-07-24 | ハンベック コーポレイション | Horizontal reactor for compound semiconductor production |
SE9801190D0 (en) * | 1998-04-06 | 1998-04-06 | Abb Research Ltd | A method and a device for epitaxial growth of objects by Chemical Vapor Deposition |
TW544775B (en) * | 2001-02-28 | 2003-08-01 | Japan Pionics | Chemical vapor deposition apparatus and chemical vapor deposition method |
US6626997B2 (en) | 2001-05-17 | 2003-09-30 | Nathan P. Shapiro | Continuous processing chamber |
US20060096531A1 (en) * | 2002-06-10 | 2006-05-11 | Tokyo Electron Limited | Processing device and processing method |
US8124170B1 (en) * | 2004-01-23 | 2012-02-28 | Metal Oxide Technologies, Inc | Method for forming superconductor material on a tape substrate |
US20080092812A1 (en) * | 2004-06-10 | 2008-04-24 | Mcdiarmid James | Methods and Apparatuses for Depositing Uniform Layers |
US7396415B2 (en) * | 2005-06-02 | 2008-07-08 | Asm America, Inc. | Apparatus and methods for isolating chemical vapor reactions at a substrate surface |
JP4466723B2 (en) * | 2007-11-21 | 2010-05-26 | 住友電気工業株式会社 | Metalorganic vapor phase epitaxy system |
US8628616B2 (en) | 2007-12-11 | 2014-01-14 | Sumitomo Electric Industries, Ltd. | Vapor-phase process apparatus, vapor-phase process method, and substrate |
JP5954202B2 (en) * | 2013-01-29 | 2016-07-20 | 東京エレクトロン株式会社 | Deposition equipment |
US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3484311A (en) * | 1966-06-21 | 1969-12-16 | Union Carbide Corp | Silicon deposition process |
US3367304A (en) * | 1967-03-13 | 1968-02-06 | Dow Corning | Deposition chamber for manufacture of refractory coated filaments |
US3511727A (en) * | 1967-05-08 | 1970-05-12 | Motorola Inc | Vapor phase etching and polishing of semiconductors |
-
1970
- 1970-03-11 NL NL7003431A patent/NL7003431A/xx unknown
-
1971
- 1971-03-04 US US00120983A patent/US3750620A/en not_active Expired - Lifetime
- 1971-03-04 DE DE2110289A patent/DE2110289C3/en not_active Expired
- 1971-03-08 AT AT195971A patent/AT321994B/en not_active IP Right Cessation
- 1971-03-08 CH CH336071A patent/CH532960A/en not_active IP Right Cessation
- 1971-03-08 SE SE02926/71A patent/SE368724B/xx unknown
- 1971-03-08 CA CA107073A patent/CA923635A/en not_active Expired
- 1971-03-09 JP JP1223771A patent/JPS5317862B1/ja active Pending
- 1971-03-09 BE BE764013A patent/BE764013A/en unknown
- 1971-03-10 FR FR7108288A patent/FR2084428A5/fr not_active Expired
- 1971-04-19 GB GB2337671*A patent/GB1346938A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
SE368724B (en) | 1974-07-15 |
FR2084428A5 (en) | 1971-12-17 |
DE2110289B2 (en) | 1980-03-13 |
CA923635A (en) | 1973-03-27 |
DE2110289C3 (en) | 1980-10-30 |
US3750620A (en) | 1973-08-07 |
NL7003431A (en) | 1971-09-14 |
AT321994B (en) | 1975-04-25 |
CH532960A (en) | 1973-01-31 |
DE2110289A1 (en) | 1971-09-23 |
BE764013A (en) | 1971-09-09 |
JPS5317862B1 (en) | 1978-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |