DE2059425A1 - Partieller Aufbau von gedruckten Mehrlagenschaltungen - Google Patents

Partieller Aufbau von gedruckten Mehrlagenschaltungen

Info

Publication number
DE2059425A1
DE2059425A1 DE19702059425 DE2059425A DE2059425A1 DE 2059425 A1 DE2059425 A1 DE 2059425A1 DE 19702059425 DE19702059425 DE 19702059425 DE 2059425 A DE2059425 A DE 2059425A DE 2059425 A1 DE2059425 A1 DE 2059425A1
Authority
DE
Germany
Prior art keywords
etch
metal
resistant cover
epoxy resin
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702059425
Other languages
German (de)
English (en)
Inventor
Hans Hadersbeck
Werner Schmidt
Hubert Zukier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19702059425 priority Critical patent/DE2059425A1/de
Priority to NL7116101A priority patent/NL7116101A/xx
Priority to IT3168271A priority patent/IT941784B/it
Priority to LU64374D priority patent/LU64374A1/xx
Priority to BE776073A priority patent/BE776073A/xx
Priority to FR7142839A priority patent/FR2117172A5/fr
Publication of DE2059425A1 publication Critical patent/DE2059425A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE19702059425 1970-12-02 1970-12-02 Partieller Aufbau von gedruckten Mehrlagenschaltungen Pending DE2059425A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19702059425 DE2059425A1 (de) 1970-12-02 1970-12-02 Partieller Aufbau von gedruckten Mehrlagenschaltungen
NL7116101A NL7116101A (cs) 1970-12-02 1971-11-23
IT3168271A IT941784B (it) 1970-12-02 1971-11-26 Sistema di costruzione frazionata di circuiti stampati a piu strati
LU64374D LU64374A1 (cs) 1970-12-02 1971-11-30
BE776073A BE776073A (fr) 1970-12-02 1971-11-30 Procede pour la construction fractionnee de circuits multi-couches imprimes
FR7142839A FR2117172A5 (en) 1970-12-02 1971-11-30 Printed laminated circuits - by bonding separate circuit plates of metal coated, glass fibre reinforced epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702059425 DE2059425A1 (de) 1970-12-02 1970-12-02 Partieller Aufbau von gedruckten Mehrlagenschaltungen

Publications (1)

Publication Number Publication Date
DE2059425A1 true DE2059425A1 (de) 1972-06-22

Family

ID=5789821

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702059425 Pending DE2059425A1 (de) 1970-12-02 1970-12-02 Partieller Aufbau von gedruckten Mehrlagenschaltungen

Country Status (6)

Country Link
BE (1) BE776073A (cs)
DE (1) DE2059425A1 (cs)
FR (1) FR2117172A5 (cs)
IT (1) IT941784B (cs)
LU (1) LU64374A1 (cs)
NL (1) NL7116101A (cs)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2342407A1 (de) * 1972-08-25 1974-03-07 Ciba Geigy Ag Verfahren zur herstellung von gedruckten mehrlagen-schaltungen
DE2629303A1 (de) * 1975-07-03 1977-01-20 Ncr Co Mehrschichtige gedruckte schaltungskarte und verfahren zu ihrer herstellung
DE2703473A1 (de) * 1976-02-06 1977-08-11 Ibm Schichtstruktur aus isolierendem und leitfaehigem material und verfahren zu ihrer herstellung
DE3013667A1 (de) * 1980-04-09 1981-10-29 Wilhelm Ruf KG, 8000 München Leiterplatte und verfahren zu deren herstellung
DE4438777A1 (de) * 1994-10-18 1996-05-02 Atotech Deutschland Gmbh Verfahren zur Herstellung elektrischer Schaltungsträger
EP1318704A1 (en) * 2001-10-16 2003-06-11 Ultratera Corporation Printed circuit board micro hole processing method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4284468A (en) * 1977-12-16 1981-08-18 Llewelyn Stearns Patterned chemical etching of high temperature resistant metals
US4591411A (en) * 1982-05-05 1986-05-27 Hughes Aircraft Company Method for forming a high density printed wiring board
WO1983003944A1 (en) * 1982-05-05 1983-11-10 Hughes Aircraft Company High density printed wiring board
US4663497A (en) * 1982-05-05 1987-05-05 Hughes Aircraft Company High density printed wiring board
FR2656493A1 (fr) * 1989-12-21 1991-06-28 Bull Sa Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant.
US5698299A (en) * 1991-02-28 1997-12-16 Dyconex Patente Ag Thin laminated microstructure with precisely aligned openings
WO1992015408A1 (de) * 1991-02-28 1992-09-17 Dyconex Patente Ag Heinze & Co Determiniertes mikrosieb, determinierter verbundkörper
JPH07500951A (ja) * 1992-06-15 1995-01-26 ディコネックス　パテンテ　アーゲー 信号誘導のための超高密度配線を有するメタルクラッドラミネートを使用するプリント配線回路基板の製造方法
FR2713139B1 (fr) * 1993-12-03 1995-12-29 Loic Demeure Support métallisé à base de mousse organique, assemblage d'au moins deux de ces supports et procédé de fabrication de ce support.
EP0834242B1 (de) 1995-06-15 2002-04-03 Dyconex Patente Ag Verbindungssubstrat
JP2005150263A (ja) * 2003-11-13 2005-06-09 Nitto Denko Corp 両面配線回路基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2342407A1 (de) * 1972-08-25 1974-03-07 Ciba Geigy Ag Verfahren zur herstellung von gedruckten mehrlagen-schaltungen
DE2629303A1 (de) * 1975-07-03 1977-01-20 Ncr Co Mehrschichtige gedruckte schaltungskarte und verfahren zu ihrer herstellung
DE2703473A1 (de) * 1976-02-06 1977-08-11 Ibm Schichtstruktur aus isolierendem und leitfaehigem material und verfahren zu ihrer herstellung
DE3013667A1 (de) * 1980-04-09 1981-10-29 Wilhelm Ruf KG, 8000 München Leiterplatte und verfahren zu deren herstellung
US4440823A (en) * 1980-04-09 1984-04-03 Wilhelm Ruf Kg Printed board for electrical circuits
DE4438777A1 (de) * 1994-10-18 1996-05-02 Atotech Deutschland Gmbh Verfahren zur Herstellung elektrischer Schaltungsträger
DE19581162D2 (de) * 1994-10-18 1997-06-19 Atotech Deutschland Gmbh Verfahren zur Herstellung elektrischer Schaltungsträger
EP1318704A1 (en) * 2001-10-16 2003-06-11 Ultratera Corporation Printed circuit board micro hole processing method

Also Published As

Publication number Publication date
NL7116101A (cs) 1972-06-06
BE776073A (fr) 1972-03-16
IT941784B (it) 1973-03-10
LU64374A1 (cs) 1972-06-19
FR2117172A5 (en) 1972-07-21

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