DE202012101073U1 - Eine Wärmeableitungsstruktur aufweisende elektronische Vorrichtung - Google Patents

Eine Wärmeableitungsstruktur aufweisende elektronische Vorrichtung Download PDF

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Publication number
DE202012101073U1
DE202012101073U1 DE201220101073 DE202012101073U DE202012101073U1 DE 202012101073 U1 DE202012101073 U1 DE 202012101073U1 DE 201220101073 DE201220101073 DE 201220101073 DE 202012101073 U DE202012101073 U DE 202012101073U DE 202012101073 U1 DE202012101073 U1 DE 202012101073U1
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DE
Germany
Prior art keywords
fan
flow fan
heat sink
axial flow
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE201220101073
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German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micro Star International Co Ltd
Original Assignee
Micro Star International Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Star International Co Ltd filed Critical Micro Star International Co Ltd
Publication of DE202012101073U1 publication Critical patent/DE202012101073U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE201220101073 2011-09-28 2012-03-26 Eine Wärmeableitungsstruktur aufweisende elektronische Vorrichtung Expired - Lifetime DE202012101073U1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100218189 2011-09-28
TW100218189U TWM426987U (en) 2011-09-28 2011-09-28 Electronic apparatus with heat-dissipation structure

Publications (1)

Publication Number Publication Date
DE202012101073U1 true DE202012101073U1 (de) 2012-05-14

Family

ID=46447157

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201220101073 Expired - Lifetime DE202012101073U1 (de) 2011-09-28 2012-03-26 Eine Wärmeableitungsstruktur aufweisende elektronische Vorrichtung

Country Status (4)

Country Link
JP (1) JP3176492U (zh)
CN (1) CN202335195U (zh)
DE (1) DE202012101073U1 (zh)
TW (1) TWM426987U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11304331B1 (en) * 2020-09-30 2022-04-12 Taiwan Microloops Corp. Heat dissipating module having auxiliary fan
US20230058602A1 (en) * 2021-08-23 2023-02-23 Fujifilm Business Innovation Corp. Board structure, electronic apparatus, and method of manufacturing board structure
US20230171914A1 (en) * 2021-11-30 2023-06-01 Acer Incorporated Graphics card assembly

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8976528B2 (en) * 2012-06-08 2015-03-10 Apple Inc. Fasteners and dual-thickness thermal stages in electronic devices
CN106211704B (zh) * 2015-05-08 2020-01-03 技嘉科技股份有限公司 组合式的散热模块
TWM545287U (zh) * 2017-01-20 2017-07-11 艾維克科技股份有限公司 介面卡之交錯式散熱結構
CN111200901B (zh) * 2020-02-10 2021-04-23 永捷电子（始兴）有限公司 一种印刷电路板
CN112739145B (zh) * 2020-11-16 2023-06-30 Oppo（重庆）智能科技有限公司 电子设备
TWI808563B (zh) * 2021-12-10 2023-07-11 訊凱國際股份有限公司 散熱裝置與顯示卡組件
CN115243526A (zh) * 2022-08-09 2022-10-25 Oppo广东移动通信有限公司 电子设备

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11304331B1 (en) * 2020-09-30 2022-04-12 Taiwan Microloops Corp. Heat dissipating module having auxiliary fan
US20230058602A1 (en) * 2021-08-23 2023-02-23 Fujifilm Business Innovation Corp. Board structure, electronic apparatus, and method of manufacturing board structure
US11930623B2 (en) * 2021-08-23 2024-03-12 Fujifilm Business Innovation Corp. Board structure, electronic apparatus, and method of manufacturing board structure
US20230171914A1 (en) * 2021-11-30 2023-06-01 Acer Incorporated Graphics card assembly

Also Published As

Publication number Publication date
CN202335195U (zh) 2012-07-11
JP3176492U (ja) 2012-06-21
TWM426987U (en) 2012-04-11

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R150 Utility model maintained after payment of first maintenance fee after three years
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Effective date: 20141217

R151 Utility model maintained after payment of second maintenance fee after six years
R152 Utility model maintained after payment of third maintenance fee after eight years
R071 Expiry of right