DE19981278D2 - Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels - Google Patents

Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels

Info

Publication number
DE19981278D2
DE19981278D2 DE19981278T DE19981278T DE19981278D2 DE 19981278 D2 DE19981278 D2 DE 19981278D2 DE 19981278 T DE19981278 T DE 19981278T DE 19981278 T DE19981278 T DE 19981278T DE 19981278 D2 DE19981278 D2 DE 19981278D2
Authority
DE
Germany
Prior art keywords
wafers
providing
complete stack
stack
complete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19981278T
Other languages
English (en)
Other versions
DE19981278B4 (de
Inventor
Jakob Blattner
Bernhard Strasser
Christian Balg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Machinery Ltd
Original Assignee
Tec Sem AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tec Sem AG filed Critical Tec Sem AG
Publication of DE19981278D2 publication Critical patent/DE19981278D2/de
Anticipated expiration legal-status Critical
Application granted granted Critical
Publication of DE19981278B4 publication Critical patent/DE19981278B4/de
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19981278.0T 1998-07-09 1999-07-06 Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels Expired - Lifetime DE19981278B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH01467/98A CH693726A5 (de) 1998-07-09 1998-07-09 Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels.
CH1467/98 1998-07-09
PCT/CH1999/000297 WO2000003417A1 (de) 1998-07-09 1999-07-06 Vorrichtung und verfahren zur bereitstellung eines vollständigen waferstapels

Publications (2)

Publication Number Publication Date
DE19981278D2 true DE19981278D2 (de) 2001-05-31
DE19981278B4 DE19981278B4 (de) 2020-01-09

Family

ID=4211175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19981278.0T Expired - Lifetime DE19981278B4 (de) 1998-07-09 1999-07-06 Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels

Country Status (3)

Country Link
CH (1) CH693726A5 (de)
DE (1) DE19981278B4 (de)
WO (1) WO2000003417A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001267248A1 (en) * 2000-07-09 2002-01-21 Brooks-Pri Automation Gmbh Storage device, especially for the intermediate storage of test wafers
JP4688637B2 (ja) * 2005-10-28 2011-05-25 東京エレクトロン株式会社 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797622A (en) * 1980-12-11 1982-06-17 Toshiba Corp Diffusion heat treating jig of semiconductor substrate
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
US4776744A (en) * 1985-09-09 1988-10-11 Applied Materials, Inc. Systems and methods for wafer handling in semiconductor process equipment
JPS6273631A (ja) * 1985-09-27 1987-04-04 Oki Electric Ind Co Ltd 半導体製造装置
JPS62132321A (ja) * 1985-12-04 1987-06-15 Anelva Corp ドライエツチング装置
US4886412A (en) * 1986-10-28 1989-12-12 Tetron, Inc. Method and system for loading wafers
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5829969A (en) * 1996-04-19 1998-11-03 Tokyo Electron Ltd. Vertical heat treating apparatus
JP3754149B2 (ja) * 1996-09-20 2006-03-08 東京エレクトロン株式会社 縦型熱処理装置
KR100521725B1 (ko) * 1996-10-09 2005-10-17 테크-셈 아크티엔게젤샤프트 웨이퍼 그리핑 장치

Also Published As

Publication number Publication date
CH693726A5 (de) 2003-12-31
DE19981278B4 (de) 2020-01-09
WO2000003417A1 (de) 2000-01-20

Similar Documents

Publication Publication Date Title
DE878824T1 (de) Verfahren und Gerät zur Ätzung eines Werkstücks
DE60039857D1 (de) Verfahren und vorrichtung zur verarbeitung eines wafers
DE69722587D1 (de) Vorrichtung und Verfahren zur Plasmavorbereitung
DE69910543D1 (de) Verfahren und vorrichtung zur handhabung von bohrlochrohren
DE60007688D1 (de) Verfahren und Vorrichtung zur Herstellung eines Werkzeugs
DE69936131D1 (de) Verfahren und vorrichtung zur entfernung eines photoresistfilms
DE69739537D1 (de) Verfahren und Vorrichtung zur Behandlung eines Halbleitersubstrats
DE69916397D1 (de) Verfahren und Vorrichtung zur Betätigung eines Bohrlochwerkzeuges
DE69913106D1 (de) Verfahren und gerät zur roboterausrichtung
DE69939915D1 (de) Verfahren und Vorrichtung zur Harzversiegelung einer Halbleitervorrichtung
DE69803877T2 (de) Vorrichtung und verfahren zur trennung eines heterogenen gemisches
DE69835102D1 (de) Verfahren und vorrichtung zur gesicherten übertragung eines datensatzes
DE69831991D1 (de) Verfahren und Vorrichtung zur Sprachdetektion
DE60128338D1 (de) Verfahren und vorrichtung zur wafervorbereitung
DE60013627D1 (de) Verfahren und vorrichtung zur aufwärtsplanung
DE50013722D1 (de) Verfahren und vorrichtung zur sicherung eines mehrdimensional aufgebauten chipstapels
DE69733087D1 (de) Verfahren und vorrichtung zur scharfeinstellung einer halbleiterscheibe
DE69840840D1 (de) Verfahren und Vorrichtung zur Herstellung eines Halbleiterkristalls
DE69926137D1 (de) Verfahren und vorrichtung zur befestigung eines bauelementes
DE69825525D1 (de) Vorrichtung zur Erstellung eines Bildes sowie Verfahren und Vorrichtung zur Entfernungsmessung
DE50115216D1 (de) Halbleiterbauelement und verfahren zur identifizierung eines halbleiterbauelementes
DE69716594T2 (de) Verfahren und vorrichtung zur verzögerung eines aufzugs
DE69937304D1 (de) Verfahren und vorrichtung zur vakuumbehandlung
DE69903937T2 (de) Vorrichtung und verfahren zur reduzierung der einschaltzeit eines kristalloszillators
DE69803202D1 (de) Verfahren und vorrichtung zur sprachdetektion

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R006 Appeal filed
R125 Request for further processing filed
R126 Request for further processing allowed
R081 Change of applicant/patentee

Owner name: MURATA MACHINERY, LTD., KYOTO-SHI, JP

Free format text: FORMER OWNER: TEC-SEM AG, TAEGERWILEN, CH

R082 Change of representative

Representative=s name: KLEIN & KLEIN PATENTANWAELTE, DE

R071 Expiry of right
R409 Internal rectification of the legal status completed
R018 Grant decision by examination section/examining division
R020 Patent grant now final